Tokyo Seimitsu Co., Ltd.
Manufactures and sells semiconductor manufacturing equipment and measuring instruments.
- 042-642-1701
- 042-642-1798
- 2968-2, Ishikawa-machi
Hachioji-shi, Hachioji-shi 192-8515
Japan
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Product
Edge Grinding Machines
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The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Product
Coordinate Measuring Machines
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Tokyo Seimitsu is the pioneer that developed “Japan’s first coordinate measuring machine.” We respond to every need with a varied lineup to which we have added Carl Zeiss products linked to our products.
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Product
X-ray CT System
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The surface and the internal parts, in one measurement. We provide “Dimensional X-ray CT System” that does not only observe the interior of the workpiece, but that can also perform high precision, contactless measurements.
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Product
Auxiliary Equipment For Dicing Machines
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We have a lineup of package singulation machines, automatic cleaning systems, chillers, etc. that support the dicing process.
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Product
High Rigid Grinder
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High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials.
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Product
Polish Grinders
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The polish grinder is a single machine that can both slice various device wafers and remove damage,which has been developed from a unique idea of ACCRETECH-Tokyo Seimitsu. In recent years, the grinder also contributes to various grinding and polishing processes required for advanced packaging technologies such as laminated memory and FO/2.5D/3D.
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Product
Auxiliary Equipment For Probing Machines
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We have a lineup of products that support the probing process.
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Product
Dedicated Measuring Machine
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We offer measurement systems optimized for various production sites. We design and manufacture high precision, stable specialized measuring instruments to match requested specifications and requested performance.
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Product
Air Micrometers
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As the pioneer of air micrometers and electric micrometers in Japan, we respond to a variety of needs for high precision production line measurements.
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Product
Probing Machines
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Probing machine is a wafer transfer and positioning device used for testing the electrical characteristics of chips formed on wafers. This wafer test is used to sort out good and defective chips.
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Product
Discharge Test System
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The automated testing equipment automatically performs charge and discharge of energy devices such as the rechargeable batteries(cells, modules, packs) that are installed in PHV/ EV and mobile devices, while measuring the voltage, current, temperature, and impedance.
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Product
CMP
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CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
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Product
For Grinder And Lathe
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We offer an abundant lineup such as the PULCOM series for in-process and post-process measurements, and the SBS products for the grinding wheel’s automatic balance system.
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Product
Non-contact Surface Texture And Contour Measuring Instruments
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From sub-nano level surface roughness to milli level profile with 3D.Tokyo Seimitsu provides non-contact type surface roughness and contour measuring instruments with the confidence born out of many years cultivating know-how of surface roughness measurements.
Children
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Tosei Engineering Corp.
Repair and technical services for measurement testing equipment, precision equipment, industrial tools, jigs, gauges and electrical equipment. Sale of system products and provision of related repair and technical services. Manufacture and sale of automation and labor saving devices for industrial processes such as measurement, automated measurement, automated assembly, and automated sorting. Manufacture and sales of semiconductor manufacturing equipment. Provision of comprehensive services in all the foregoing areas.
