Teledyne DALSA
DALSA Corporation is an international high performance semiconductor and electronics company that designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing specialized wafer foundry services.
- 519 886 6000
- 519 886 8023
- sales.americas@dalsa.com
- 605 McMurray Road
Suite 142
Waterloo, Ontario N2V 2E9
Canada
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Product
PCI Express Image Acquisition Frame Grabber
Xcelera-HS PX8
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The Xcelera-HS PX8 has been built within Teledyne DALSA’s Trigger-to-Image Reliability technology framework. Trigger-to-Image Reliability leverages Teledyne DALSA’s hardware and software innovations to control, monitor and correct the image acquisition process from the time that an external trigger event occurs to the moment the data is sent to the host, providing traceability when errors do occur and permitting recovery from those errors.
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Product
Vision Systems
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Our GEVA vision systems offer the performance and flexibility to inspect multiple parts, assemblies or surfaces at the same time. These systems are equipped with multi-core processors, high-speed camera ports and versatile I/O options to match your application and factory integration requirements.
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Product
Xcelera Frame Grabber Family
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The Xcelera Series leverages the PCI Express (PCIe) platform to bring traditional image acquisition and processing technology to new levels of performance and flexibility. This unified and scalable platform currently supports high-performance Camera Link™ cameras.
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Product
3D Sensors
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Teledyne DALSA offers powerful, innovative 3D sensors combining industry-leading performance with cutting-edge feature sets and value.
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Product
Complete Vision System
BOA2
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Introducing BOA2: a complete vision system in one smart camera. Featuring our highest smart camera resolution yet, BOA2 combines lighting, image capture, processing, and easy-to-use embedded vision software into a convenient single device with a variety of I/O and mounting options.
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Product
Xineos Large Area Detectors
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As a leader in CMOS innovation, Teledyne DALSA developed the Xineos to deliver three times more sensitivity and five times more signal-to-noise performance than other standard technologies at equal X-ray dose conditions. CMOS image detectors offer numerous advantages including the ability to record smaller image details with higher resolutions – allowing for the diagnostics of medical anomalies at earlier stages, and significantly increasing the probability of early intervention, patient recovery, and reduced treatment costs.
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Product
CL+ PX8 Full Frame Grabber
Xcelera-CL+ PX8 Full
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The X64 Xcelera-CL+ PX8 Full has been built within Teledyne DALSA’s Trigger-to-Image Reliability technology framework. Trigger-to-Image Reliability leverages Teledyne DALSA’s hardware and software innovations to control, monitor and correct the image acquisition process from the time that an external trigger event occurs to the moment the data is sent to the host, providing traceability when errors do occur and permitting recovery from those errors.
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Product
Line Scan Camera
Piranha4
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The Piranha4 cameras offer advanced features such as sub-pixel spatial correction, areas of interest (up to 4 at a time) to reduce data processing and simplify cabling, as well as dual-line area mode to double line rate, HDR mode, shading and lens correction. The Piranha4 is built for the real world with features to ease system integration. The advanced GenICam compliant user interface makes it easy to set up and control camera parameters such as exposure control, FFC, white balance, gain, test patterns, diagnostics and more.
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Product
Xtium Frame Grabber Family
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The Xtium series delivers higher bandwidth to sustain Camera Link 80-Bit modes over longer cable distances and supports a wide variety of area and line scan color and monochrome cameras, all in a compact, single slot solution.
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Product
CoalXPress Frame Grabber
Xtium-CXP PX8
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The Xtium™-CXP is based on the industry standard PCI Express™ Gen 2.0 expansion bus to deliver high speed access to host memory. The Xtium series offers high performance frame grabbers for CameraLink, CameraLink HS and CoaXPress interface standards. The Xtium Series takes full advantage of PCIe Gen 2.0 platform to deliver bandwidth up to 3.4 GB/s using PCIe x8 slots. By enabling maximum sustained throughput and ready-to-use image data, the Xtium series minimizes CPU usage and improves processing times for the host applications. In addition, the Xtium series offers enhanced memory architecture to handle area and line scan, monochrome and color cameras. In addition, the Xtium-CXP series support image acquisition rate of up to 6.25 Gb/s from four input channels.
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Product
Xineos Scanning
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Teledyne DALSA's leadership in CMOS innovation lets our Xineos scanning products deliver three times more sensitivity and five times more signal-to-noise performance than other standard technologies at equal X-ray dose conditions. CMOS image detectors offer numerous advantages including the ability to record smaller image details with higher resolutions – allowing for the diagnostics of medical anomalies at earlier stages, and significantly increasing the probability of early intervention, patient recovery, and reduced treatment costs.
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Product
Long Wave Infrared Cameras
Calibir DXM640 Series
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The Calibir uncooled Long Wave Infrared camera platform offers outstanding shutterless imaging performance and is optimized for Size, Weight and Power (SWAP). The Calibir DXM640 series features both shutter and shutterless operation and rapid image output on power up while delivering uniform response over the entire operating temperature range, making it ideal for thermal imaging applications requiring uninterrupted image acquisition. ULIS’s gen2 sensor offers an improved NETD and the updated calibration include customized gain correction on a per lens basis to offer even better image performances and response uniformity.
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Product
CCD Foundry Services
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Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
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Product
Vision Software
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These “all-in-one” software products have been deployed in thousands of installations around the globe, providing advanced tools, design flexibility and system versatility to suit diverse application needs across all industries. Built to run on our smart camera and multi-camera vision systems, our easy-to-use iNspect and Sherlock design platforms save you time and reduce vision development costs without compromising system performance or reliability.
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Product
Area Scan Camera
Genie Nano-1GigE
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Introducing Genie Nano, a CMOS GigE camera that redefines low cost performance. Genie Nano starts with industry leading CMOS sensors and adds proprietary camera technology for breakthrough speed, a robust build quality for wide operating temperature, a three-year warranty and an unmatched feature set—all at an incredible price.





































































