Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Saluki SEL7 Series Programmable DC Electronic Load (up to 6kW)
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The new SEL7 series programmable DC electronic load is a new generation product designed by Saluki Technology. Incorporating high-performance chips, the SEL7 series delivers high speed and high accuracy with a resolution of 0.1mV and 0.01mA (basic accuracy is 0.03% and basic current rise speed is 2.5 A/μs).SEL7 series have wide application from production lines for cell phone chargers, cell phone batteries, electronic vehicle batteries, switching power supplies, linear power supplies, and LED drivers, to research institute, automotive electronic, aeronautic and astronautic, maritime, solar cell and fuel cell etc. test and measurement applications.
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Product
SparkFun MicroMod Teensy Processor
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The SparkFun MicroMod Teensy Processor leverages the awesome computing power of the NXP iMXRT1062 chip and pairs it with the M.2 MicroMod connector to allow you to plug it into your choice of compatible MicroMod Carrier Board. With the M.2 MicroMod connector, connecting your Teensy Processor is a breeze. Simply match up the key on your processor's beveled edge connector to the key on the M.2 connector and secure it with a screw (included with all Carrier Boards). Adding a Teensy to your desired project has never been easier!
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Product
3U Processor Board
CP39001
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LinkedHope Intelligent Technologies Co.,Ltd.
CP39001 is a 1553B bus control card developed by Linghao Intelligent® for avionics applications. The product complies with the PICMG 2.0 R3.0 specification. CP39001 uses DDC's BU-61580 1553B bus protocol control chip and TI's DSP as the intelligent control unit.
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Product
48-CH DIO & Timer/Counter Cards
cPCI-7248/7249R
Counter/Timer Module
- PICMG 2.0 Rev 2.1- 48-CH digital TTL/DTL input/output- Emulates 4/2/1 industry standard 8255 PPI (mode 0)- Direct interface with OPTO-22 compatible I/O modules Output port status read back- On board 8254 timer/counter chip
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Product
MIS Capacitors
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The SemiGen 8000 and 8100 series of MIS Capacitors are available in a wide variety of capacitance ranges and sizes. They are made with prime starting material and consist of an Oxide/Nitride layer that provides low dielectric loss and high standoff voltage. These RF microwave chip capacitor products are available in chip form only.
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Product
0 Hz/DC to 14 GHz, Single-Pole, Four-Throw MEMS Switch With Integrated Driver
ADGM1304
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The ADGM1304 is a wideband, single-pole, four-throw (SP4T) switch, fabricated using Analog Devices, Inc., microelectro-mechanical system (MEMS) switch technology. This technology enables a small, wide bandwidth, highly linear, low insertion loss switch that is operational down to 0 Hz/dc, making it an ideal switching solution for a wide range of RF applications. An integrated control chip generates the high voltage necessary to electrostatically actuate the switch via a complementary metal-oxide semiconductor (CMOS)-/low voltage transistor-transistor logic (LVTTL)-compatible parallel interface. All four switches are independently controllable. The ADGM1304 is packaged in a 24-lead, 5 mm × 4 mm × 0.95 mm lead frame chip-scale package (LFCSP).
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Product
Thermal Cycling Test Equipment
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Wewon Environmental Chambers Co, Ltd.
IC welding to PCB, IC is integrated in the chip general purpose circuit, it is a whole. Once the inside is damaged, the chip will be damaged. The goal of printed circuit boards (pcbs) is to connect IC and discrete components to form a larger working circuit. Thermal cycling equipment can detect the defects and hidden dangers of welding components in the production process, decreasing failure rate. When it fails, components can be replaced in timehttps://www.wewontech.com/thermal-cycling-test-equipment/
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Product
Optical Transimpedance Amplifiers
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Analog Devices optical transimpedance amplifiers offer a complete, high performance, single chip solution for converting photodiode current into a differential voltage input. Supporting data rates from 155 Mbps to 11.1 Gbps, our transimpedance amplifiers are ideally suited for data communications and telecommunications applications supporting lay protocols including 1×, 2×, 4×, and 8× Fibre Channel, 10GBASE-LX4, SONET/SDH up to OC-192 with FEC, and 10 Gigabit Ethernet. Our transimpedance amplifiers feature low input referred noise current, high input current, and low power dissipation.
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Product
Digital Mission Engineering
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From chip to mission, connect modeling and simulation efforts across all phases of the engineering product life cycle. Model multi-domain operational environments, including land, sea, air and space, with accurate, dynamic, physics-based simulations. Integrate with the Ansys portfolio of multi-physics tools and solvers to achieve unmatched end-to-end modeling and simulation.
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Product
60 GHz WR-15 Waveguide Tx Module
PEM010
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The PEM010 is a highly integrated millimeter wave transmitter that covers the 60 GHz global unlicensed spectrum allocations packaged in a standard waveguide module. Transmitter architecture is a double conversion, sliding IF with wide bandwidth capability through the up-conversion chain from baseband to carrier. The I/Q interface accepts analog baseband signals which provides for flexibility in design and applications. The baseband input optionally supports FSK/MSK modulation for non-coherent applications. The transmitter incorporates a complete waveguide interface with low-loss transition between the chip and the WR15 waveguide port. The integrated package is small and lightweight, with a simple to use multi-pin ST4 connector for power, reference clock, digital control port and baseband signals. Either of two reference clocks can be used for setting 540 MHz or 500 MHz channel spacing.
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Product
3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
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e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
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Product
Infrared Moisture Analyzer
LD-LIMA-A10
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Infrared Moisture AnalyzerLD-LIMA-A10is an online, fast, continuous measurement and non-contact measurement device with measurement distance range of 20 to 40 cm. It provides automated control and 4 to 20 mA current signal. This IR Moisture Analyzer emits different wavelengths of infrared light (4, 6, 8, 10 beam) to calculate the moisture content of the measured object. Designed with long-life high-speed brushless motor, imported high response infrared sensors, information processing chip FPGA + DSP + ARM9 combination, to attain real time data, improved stability and precision.
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Product
3D Measurement
PSD-Array
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The PSD array consists of 16 parallel one-dimensional PSD elements on the same chip. By utilizing the triangulation technique the reflection of a laser line or multiple laser spots onto the PSD array will provide information about the contour of the illuminated object. The possibility for simultaneous readout of the 16 elements together with the fast response of each element makes the PSD array suitable for applications like high speed 3D contour measurements and measurements of parallel, moving objects such as cantilevers.
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Product
Miniature 8-channel photon counter
id150 SERIES
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Intended for large-volume OEM applications, the id150-1x8 is the only multichannel solid-state single photon detector on the market. It consists of a CMOS silicon chip packaged in a standard TO8-16pin header with a transparent window cap. The chip combines 8 in-line single photon avalanche diodes that can be accessed simultaneously for parallel processing. square in center-to-center A fast active quenching circuit is integrated within each pixel in order to operate each diode in photon counting regime. The chip is mounted on a printed circuit board on top of a single-stage thermoelectric cooler (TEC). A thermistor can be used to measure the temperature of the chip. Only two low power supplies of +5V and -25V are needed for operation in photon counting mode. The fast active quenching circuit leads to a dead time of less than 50ns per channel. An outstanding timing resolution of less than 60ps allows high accuracy measurements.
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Product
Peak Track Instrument
90323
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The model 90323 Peak Track Instrument is a general-purpose sensor readout device designed to complement our AutoID line of load cells and torque sensors. AutoID is a term that indicates that the calibration information for a sensor is stored on a chip inside the sensor’s connector. AutoID allows true “plug and play” operation without manual calibration procedures of any kind. The unit is also equipped with a 2-line alpha-numeric display and single button operation for simplicity.
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Product
Endpoint / Chamber Health Monitor based on Optical Emission Spectroscopy and MWL Interferometry
EV 2.0 Series
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To address new requirements in Semiconductor, lighting devices, automotive components, flat panels, MEMS sensors, memory chips, and logic electronics processed in the industry using dry etch, cleaning and (PE)CVD, HORIBA has introduced a unique generation of sensor dedicated to Advanced Endpoint Control, Fault Detection and Chamber Health Monitoring.
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Product
Isolated LVDS
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Isolated LVDS (low voltage differential signaling) devices couple differential signals applied to the LVDS receiver inputs across the isolation barrier to the outputs on the other side and re-transmits the bit stream or clock as LVDS. Analog Devices' drop-in LVDS isolators offer designers robust, high speed differential signaling for point-to-point and multidrop applications. Extending iCoupler® chip scale transformer technology for ultrahigh speed data encoding, these LVDS isolators support a a data rate of up to 2.5 Gigabits per channel for a total bandwidth of 10 Gbps. In contrast to expensive fiber implementations, deserialized links over standard digital isolators or optocouplers, and design-intensive bespoke solutions using transformers or high voltage capacitors, ADI Gigabit Digital LVDS isolators offer the only integrated comprehensive, high performance isolation at 10 Gbps. High performance galvanic isolation for applications include analog front-end (AFE), processor to processor serial communication, or video and imaging data (such as HDMI isolators) as well as isolation between boards, or at a cable interface for LVDS or CML signal chains.
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Product
PCI Evaluation Board
BCM91125E
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The BCM91125E is a full-length PCI evaluation board with the SiByte® BCM1125H MIPS processor System on a Chip (SoC). The board is designed for software development and developing PCI applications, which require high-performance processors. The BCM91125E can be plugged into a PCI slot in any PC, workstation or server, or can be used as a stand-alone device.
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Product
SMARC
ROM-5820
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The Advantech ROM-5820 stands as a state-of-the-art SMARC 2.1 Computer-on-Module, incorporating the robust NXP i.MX95 System-on-Chip (SOC). This SOC features an impressive configuration, with up to six Arm Cortex-A55 cores, accompanied by a dedicated Cortex-M7 and M33 real-time processor, and an added Neural Network accelerator. The ROM-5820 provides extensive connectivity options, including USB 2.0, USB 3.2 Gen1By1, 10 Gigabit Ethernet, MIPI-CSI, PCI Express, as well as both a dual-channel LVDS and a 4-lane MIPI-DSI Display interface. These remarkable features position the ROM-5820 as an exceptional choice for a wide variety of embedded applications.
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Product
Electronic Inspection Systems
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Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
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Product
Automated Programmer Superpro Sb05
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※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job※ Compact sizeHigh throughput：4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices. Prog. Time (S) 50 60 120 180 240 300 UPH (unit per hours) 1600 1600 840 560 420 336 Accurate positioning：Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.High performance programmers： 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 100,000 devices from over 300 IC manufacturers and growing.Varied I/O devices：Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.Short change-over time：I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.Powerful and intelligent software：Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.Remote Control：Remote project loading, quality monitoring, volume control, file security.
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Product
Value Added Services
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For over three decades, Teledyne RF & Microwave has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, Teledyne offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. We offer a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
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Product
Demonstration Board
SAMPULSE20x2
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The SAMPULSE20x2 is a demonstration board for the Furaxa SiGe3 30GHz sampler/pulser IC. The SIGe3 IC is a dual channel sampler pulser chip, and the SAMPULSE20x2 demonstration board contains two 2.4mm combined TDR input/output connectors, one to each sampler/pulser channel in the IC. The SiGe3 IC's two sampler outputs are then sent to to two SMA jacks, the first outputting the sample taken on the rising edge of the sampler clock, and the second containing the sample taken on the falling edge of the sampler clock. The sampler clock input, which must be a square wave, may be set to any frequency from 5MHz to 1GHz, causing the board take two pairs of samples (one on each clock edge) at rates from 5 million to 1 billion per second. A pulser clock input, which may be set to any frequency from 5MHz to 2GHz, and MUST be a square wave (preferably differential) with rise time under 100pS, causes the board to produce concurrent pulses on both of the SiGe3's I/O pins, which produce near-concurrent pulses at the two 2.4mm sampler/pulser TDR input/output connectors.
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Product
Fast Temperature Shift
CherryTemp
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CherryTemp is a temperature controller based on two independent Peltier channels, allowing for very accurate temperature control and ultra-fast shifts from 5°C to 45°C. A thermalization liquid circulates from a reservoir to the heat exchangers (heating/cooling Peltier elements) where it is thermalized to a target temperature. Once thermalized, this liquid can be quickly injected to a microfluidic device (CherryTemp chip) mounted near the sample. Because of the small thermal mass (the distance between the microfluidic chip and the sample), the temperature transfer is very fast (less than 10 seconds) and of unprecedented accuracy due to a feedback loop control of the room temperature and the heat-sink played by immersion objective lenses.
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Product
ISDN Chip Set
Emutel Symphony
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Emutel Symphony is a convenient and flexible Basic Rate ISDN, Primary Rate ISDN and Analog PSTN network simulator. With support for S, U, E1, T1 and PSTN analog interfaces you can use the Emutel Symphony to test and develop a full range of ISDN(E1/T BRIS BRIU) and PSTN analog (FXS) equipment.
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Product
5MP MIPI Camera Module
E-CAM55_CUMI0521_MOD
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e-CAM55_CUMI0521_MOD is a small form factor, 5 MP fixed focus camera module based on AR0521 CMOS image sensor from ON Semiconductor® has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video. This low light camera module can stream uncompressed VGA (640 x 480) at 75 fps, HD (1280 x 720) at 100 fps, 1280 x 960 at 75 fps, FHD (1920 x 1080) at 65 fps, 2560 x 1440 at 38fps, 2592 x 1944 at 28 fps.
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Product
3U Processor Board
CP32001
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LinkedHope Intelligent Technologies Co.,Ltd.
CP32001 is designed based on the second generation Intel® Atom™ processor and D525, D455,.The processor has the advantages of low power consumption, high performance and other characteristics and also equipped with high performance Southbridge chips: the Intel® I / O Controller Hub 82801HBM (ICH8M).CP32001 memory controller supports up to 4 GB of DDR3 memory (2x 2GB).The maximum resolution of VGA display core is 2048x1536.CP32001 is a small PC, integrates many common interfaces, for example: USB, Gigabit Ethernet. SATA II and COM, and also equipped with high-performance sound card interface.
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Product
Anti-Surge Chip Resistors (Double-Sided Resistive)
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
ICs For Wireless Charging System
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The feature of power receiving and charge/discharge system IC RAA457100 is integrated all functions needed for a wireless chargeing, rectification, charging control for small Lithium-Ion battery and top level of power-efficiency DC-DC converter in a singl chip as 3.22mm x 2.77mm small package.
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Product
3U PXI-E System Controller
PX32101
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LinkedHope Intelligent Technologies Co.,Ltd.
PX32101 is a 3U PXI-E system controller based on the newest Intel® Haswell platform. It is designed to provide comprehensive and reliable system controller to support hybrid PXIe-based systems for multiple environments test and measurement applications.Hybrid PXIe-based systems are often required to complete independent diversified complex testing tasks on the PXI test platform. PX32101 provides rich interfaces: 4 USB2.0 / 3.0 for peripheral connectivities; UART for communication or control equipment; dual 1000Base-T Ethernet, one port for LAN connection and the other one for the control of the next generation of LXI instruments. PX32101 can support 4 x4 or two PCIe x8-link, and up to 16GB / s system bandwidth. The ExpressCard 34 expansion slots on the front panel allow users to expand the system modules flexibly. If you install a hybrid multi-slot backplane in the system, then various standard PXI-E and PXI / CPCI peripheral cards could be fitted. In a multitasking environment, PX32101 processor is able to complete multiple tasks independently. The CPU and memory chips soldered with PCB increase reliability performance in shock and vibration environments. Combined with a variety of instrument control interfaces and reliable mechanical & electronic design, PX32101 can meet your hybrid PXIe-based testing for system application requirements perfectly.
