Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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(AOI) Automated Optical Inspection Systems
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For automated defect detection and high-accuracy measurements. VisionGauge Online High-Speed AOI systems are perfect solutions for demanding high-throughput, high-resolution applications. These systems are perfect for a wide range of applications including MicroElectroMechanical systems (for MEMS inspection or MEMS measurement), semiconductor & discrete device inspection and measurement.
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Magnetic Particle Inspection
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Is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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Inspection Scope
KI-TK1010
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Inspection scope & cleaning materials for SC, FC, ST connectors, universal 2.5 mm & 1.25 mm ferrules (LC / 1.25 mm option)
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*Micro-fluoroscopic X-ray Inspection System
Cath-X
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The Cath-X is a bench top system employing Glenbrook’s micro-fluoroscopy technology providing highly detailed x-ray video of the critical components of the needle device. The transparent, safely shielded, view chamber permits the operator to locate the critical areas of the needle for inspection. The x-ray image can be further magnified using the electro-optical zoom feature of the Cath-X.
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Fiber End-Face Inspection Interferometer
CLEAVEMETER 3D
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The CLEAVEMETER 3D™ is a non-contact interferometer designed for inspecting the end-faces of cleaved or polished optical fibers with cladding diameters of 125 µm to 1200 µm. It gives immediate and precise information on important end-face properties such as flatness, perpendicularity, hackles and dust. Based on the NYFORS CLEAVEMETER 3D™ design, in addition to producing sharp fringe patterns it also generates three-dimensional images of the cleaved fiber end.
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MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
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Saki's 3D SPI identifies critical defects and assists with process improvement.
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Concrete Inspection
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Concrete structures are normally constructed using steel reinforcement and Elcometer offers Concrete Covermeters and Rebar Locators to either measure the depth of concrete over the rebar or simply to detect the rebar under the surface. Half-cell versions of the Covermeter can be used to assess the probability that corrosion is taking place on the rebar. Test Hammers are used to assess the surface hardness of cured concrete and Elcometer offers several moisture meters that can be used to determine if the structure is sufficiently dry for coating.
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Tracing-Type Non-Contact Inspection System For LCD/STN/Touch Panel/FPC
TTS
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*"Probe + Non-Contact Sensor" enables to delect SHORT after sticking LCD*No Fixture in LCD Inspection*Applicable to FPC Inspection
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X-ray Inspection System
RTX-113HV
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Precision X-ray Inspection for BGAs, QFNs, LEDs, sensors, medical devices, and other packaged devices.
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High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
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The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
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*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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Solder Paste Inspection System
KY8030-3
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The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Inspection Tool
AMI DF2400
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Automated In-line Inspection Tool for Defect-Free Production Without Sacrificing Throughput. The FACTS² delivers state-of-the-art, automated in-line inspection for quality and process control.
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X-ray inspection system for BLU, LED Long bar products
X-eye 9000LED
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X-ray Tube100kV / 200uAMin. Resolution5µmTable Size1,500mm X 500 mmDetectorFlat Panel Detector (High sensitivity)Dimension3,620(W) x 1,065(D) x 1,590(H)mm / 850kg
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Inspection & Alignment Services
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As a leading provider of precision measurement services for power generation and turbo-machinery, API has the professional experience necessary to minimize the overall downtime of the outage or rebuild schedule. The ability to fully utilize API’s precision measurement capabilities, combined with experienced Service Engineers in the turbine alignment process, differentiates API for complex alignments.
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Code Verification Systems for Quality Inspection
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Matrix codes enable the comprehensive and seamless traceability of goods, which turns out as significant advantage considering everyday product recalls across all industries. Whether salmonella in food, contaminated cosmetics or poor components: defective products can harm consumers, cause losses of image as well as massive economic losses. Using the 2D code, each individual article can be localized globally. Based on the specific serial number, producers and consumers can clearly identify articles if required. That represents a perfect tool for determining whether the article is subject to be withdrawn from circulation. The proper application and specification of 2D code contents allows for serious and sustainable companies to limit recalls, save costs, and to take responsibility for consumer protection.
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PHOTOMASK INSPECTION MACHINE
NEGATIVE FILM
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Negative film and photomask inspection originated from the extensive use of printed circuit boards. Negative films and photomasks are used in large quantities. The early detection method is to use the "inspection light table" for inspection, which requires too much manpower and material resources, and manual testing may be due to eye fatigue and negligence.
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High Resolution Thickness & Surface Profiler for as-sawn Wafers
MX 70x
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The MX 70x series measure Thickness, Warp, Waviness, Roughness and are usable for nanotopography.
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X5C Compact X-Ray Inspection
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Designed with packed convenience food, ready meals and small packaged goods in mind, the X5C is LOMA's smallest X-ray system available, with a machine length of 1000 mm and offers excellent Critical Control Point (CCP) protection in the smallest footprint possible - and manufactured under LOMA's Designed to Survive philosophy to provide one of the toughest systems on the market.
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X-ray Inspection System
RTX-113™
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Glenbrook’s RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGA, micro BGA, QFN and other devices.
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IPC Inspection
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Customers of MASER Engineering that are designing electronic products and thereby using bare and assembled Printed Circuit Boards (PCB's) are interested in the manufacturing quality of the PCB and assembling quality of the PCBA.
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In-Line X-ray Inspection System for Secondary battery
X-eye 9000 Series
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X-ray Tube100 kV / 200 µAMin. Resolution5 µmInspection Ability120ppm , 150ppm, 180ppmSystemConveyor / Index / Pick&Place 방식 LoadingDimension1,800(W) x 1,560(D) x 2,070(H)mm / 5,000kg
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Solder Paste Inspection Machine
3D SPI
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The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Automated LED Inspection and Testing
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Landrex Technologies Co., Ltd.
Automated LED Inspection and Testing
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IR Inspection System
EVG®20
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The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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Wafer Cathodoluminescence Microscope
Säntis 300
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Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
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Conformal Coating Inspection
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Conformal coating plays a key role especially when electronic assemblies are used in products and systems that perform safety-relevant tasks. The coatings applied to the circuit board protect against environmental influences such as dirt, dust, moisture, condensation, and varying temperatures. Increasing packing densities and the trend toward miniaturization are also making conformal coatings essential. The insulating effect of the coating allows reductions in the distance between conductor paths while also boosting the performance of terminal devices.
