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Product
Ultrasound Transducers
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Utilizing optical and semiconductor fabrication techniques, Imaginant manufactures the PureView PrecisionTM line of RoHS-compliant delay-line ultrasound transducers with center frequencies ranging from 50 MHz to 250 MHz (higher and lower transducer frequencies are also available). Imaginant's precision-manufacturing process produces transducers that exhibit high reliability and high uniformity from device to device. This manufacturing consistency enables uniform test system performance to be attained across multiple systems. Imaginant transducers are available in focused and flat-face models that can be produced with minimal-damping for applications requiring maximal sensitivity or with maximal-damping and high-bandwidth for applications requiring the highest-degree of temporal precision.
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Product
88-lane, 44-port, PCI Express
PEX89088
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The new PCIe Gen 5.0 (32 GT/s) PEX89000 series builds on the longevity of the Broadcom series of switches, now spanning 13 families. The PEX89000 family allows customers to build systems from simple PCIe connectivity inside the box to high-performance, low-latency, scalable, cost-effective PCIe fabrics for composable hyper-scale compute systems supporting ML/AI and Server/Storage applications.
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Product
LVDS Digital I/O with Kintex UltraScale FPGA - XMC
Model 71810
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Supports Xilinx Kintex Ultrascale FPGAs- Front panel digital I/O can be used as a status and control or data interface- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction-cooled versions available
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Product
3-Channel 200 MHz A/D and 2-Channel 800 MHz D/A with Virtex-6 FPGA - 3U VPX
Model 52620
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- Complete radar and software radio interface solution- Supports Xilinx Virtex-6 LXT and SXT FPGAs- Supports gigabit serial fabrics including PCI Express, Serial RapidIO and Xilinx Aurora- Three 200 MHz 16-bit A/Ds- One digital upconverter- Two 800 MHz 16-bit D/As- Up to 2 GB of DDR3 SDRAM or 32 MB of QDRII+ SRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- Optional LVDS connections to the Virtex-6 FPGA for custom I/O- 3U VPX form factors provides a compact, rugged platform- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
18-Slot 3U PXI Express Chassis with AC - Up to 8 GB/s
PXES-2780
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The ADLINK PXES-2780 is an 18-slot PXI Express chassis, compliant with PXI Express and cPCI Express specifications and offering one system slot, one system timing slot, ten hybrid peripheral slots, and six PXI Express peripheral slots for a wide variety of testing and measurement applications requiring enhanced bandwidth. The PXES-2780 provides a configurable PCIe switch fabric and is configurable in two-link, and four-link PXI express deployments, with 8 GB/s system bandwidth and up to 4 GB/s slot bandwidth for dedicated peripheral slots, thanks to PCIe gen2 signaling technology.
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Product
Powered VXS Crates
6U VXS 6023-JL
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The WIENER VXS 6023 crate series adds high performance Switch Fabrics according to VITA 41 specification to VME based systems. Designed primarily for high speed applications in data acquisition, as well as military / aerospace test and instrumentation it combines superior mechanical quality with lowest noise power supply technology.
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Product
Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Product
Custom Testing
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You create a custom test plan (a file that lists a series of tests to be run), to meet requirements specific to your environment and apply that test plan to any number of clusters. You specify the order in which tests run and the specific components to be tested. After you set up your custom test environment, you run the test procedure from SMIT and view test results in SMIT and in the Cluster Test Tool log file. For information about customized testing, see Setting up custom cluster testing.*Fixture Design*Fixture Fabrication*Custom Test Stands*Prototype Testing Services*Product Safety Testing Services
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Product
MTCA.3 Conduction Cooled MicroTCA Carrier Hub (MCH)
UTC041
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The VadaTech UTC041 is the most feature-rich conduction cooled MicroTCA Carrier Hub (MCH) on the market. Its management software is based on VadaTech’s robust Carrier Manager and Shelf Manager which have been deployed for years with proven results. The MCMC manages the Power Modules, Cooling Units, and up to 12 AMCs within the chassis. It also manages PCIe Gen3 or 10GbE XAUI fabric switch as well as the standard GbE with 10GbE uplink Base Channel switch.
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Product
Universal Amplifier Heatsinks
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A universal heatsink, which is designed and fabricated for Eravant's active device applications with up to 15-watt power dissipation. The heatsink consists of the main heatsink body, a DC fan and a heat spreader. The heat spreader is also known as adapter, which is used to bridge the mounting gap between the heat sink main body and the to-be-heat-sunk devices, such as power amplifier, frequency active multiplier, oscillator, transmitter and transceiver due to various mounting hole locations. The heat spreader offers various mounting patterns to accommodate more than 15 product models. This heatsink is not only designed for Eravant's standard products and Uni-Guide™ featured products, but also for many industrial standard microwave and millimeter wave products offered by other manufacturers. Other heatsinks with different power dissipation capacities are offered under different model numbers.
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Product
Random Pilling Tester
UI-TX08
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Random Pilling Tester is a kind of pilling tester to determine textile fabric resistance to pilling, fuzzing and matting by tumbling randomly.
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Product
AATCC Wrinkle Recovery Tester
M272
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To determine a fabric's ability to recover after wrinkling under a predetermined load for a set period of time. Set of 3-D plastic replicas are available to grade fabrics.
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Product
4-Channel 200 MHz A/D with DDC, Kintex UltraScale FPGA - XMC
Model 71861
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Four 200 MHz 16-bit A/Ds- Four multiband DDCs (digital downconverters)- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
Textile Testing Instruments
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Dongguan Amade Instruments Technology Co., Ltd
Textile testing instruments are developed to determine the quality and performance of various fibrillar component fabrics, structural fabrics, garments, home textiles and other textiles by physical and chemical methods in conformance with international standards. By using scientific testing methods to judge the quality of materials or final products, manufacturers of textiles are capable of detecting the defects and unqualified products to correct problems in time, conducive to reducing loss and maintaining the business reputation. Testings cover tensile strength, tearing strength, seam slippage, joint strength, bursting strength, resistance to wear, pilling resistance, color fastness to washing, rubbing fastness, light fastness, color fastness to perspiration, dimension stability, inflaming retarding test etc.
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Product
Automated Monitoring of Airborne Molecular Contamination
AMC-Monitor T-1000
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The all-in-one analyzer for FOUP, fab and clean-room environment AMC monitoring in the semiconductor industry. The AMC-Monitor is a modular and flexible platform for airborne molecular contaminations (AMC) monitoring in semiconductor applications such as: FOUP analysis with a focus on VOC and condensables incl. full integration with Pfeiffer Vacuum APA 302 pod analyzer. Clean-room monitoring in fabrication plants.
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Product
Infrared Simulation Services
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INO offers a simulation service to assist with the hardware and software design of infrared and electro-optical devices. Precise performance predictions help integrators understand application requirements and bring application performance in line with client specificationsbefore the advance design and fabrication phases. For a minimal investment, infrared simulations help minimize risk in the early stages of development.
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Product
40-72 GHz Doubler
1GC1-8048
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The 1GC1-8048 is a balanced diode frequency doubler consisting of two Schottky diodes and a coplanar balun structure. The doubler provides 15 dB conversion loss and 17.5 dBc 1st and 3rd order feed-thru for input frequencies between 20 and 33.5 GHz. This IC is fabricated in HFTC's InGaP/GaAs heterojunction bipolar transistor (HBT) process that provides excellent uniformity, reliability and 1/f noise performance.
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Product
Thermal Control Devices
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Sumitomo Electric Industries, Ltd.
Sumitomo Electric offers heat control devices with excellent heat characteristics by combining its proprietary high-functional material technologies with process technologies (e.g. metallization, joining, sealing) and heat design technologies. These technologies are applied in the heaters for semiconductor fabrication equipment that achieves superior temperature uniformity and rapid heating and cooling characteristics.
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Product
Shielded and Unshielded Cable
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Teledyne Marine Cable Solutions
Shielding Types• Braided I Served I Spiral• Foil & Hybrid• Vapor Barriers• Copper & Alloys• Conductive & Static Dissipative Tapes• Conductive Fabrics• Tensile Members• RFI & EMI Tapes & Braids (Serveor Interwoven)• Utilizing Flat & Round Copper• Stainless Steel• Bronze• Aramid Fibers & Textile, amongothersConstruction• Multi-conductor, shielded pairs, pairs with steel tubed fiber or copper conductors with fiber optics, coaxial conductors & aramid strength fibers
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Product
Fibre Channel Test & Simulation Interface for PCI-X
PCI-X-FC4
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Avionics Interface Technologies
Supports Point-to-Point, Switched Fabric, and Arbitrated Loop topologies - Two independent Fibre Channel ports - Two SFP sockets accept fiber or copper transceivers - Each port supports 1, 2, and 4 Gbps speeds - Comprehensive decoding of FC-1, FC-2, and Upper Layer Protocol (ULP) frames - Full Error Injection and Detection - IRIG-B Time Code Encoder/Decoder for Data Correlation - In-line Port Configuration for Transparent AnalyzerSupports multiple ULPs including FC-AE-ASM, FC-AE-RDMA, FC-AE-1553, and FC-AV - Compatible with AIT’s fcXplorer GUI Bus Analyzer Software
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Product
1 GHz A/D and D/A with Virtex-6 FPGA - 3U VPX
Model 52630
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- Complete radar and software radio interface solution- Supports Xilinx Virtex-6 LXT and SXT FPGAs- Supports gigabit serial fabrics including PCI Express, Serial RapidIO and Xilinx Aurora- One GHz 12-bit A/D- One GHz 16-bit D/A- Up to 2 GB of DDR3 SDRAM or 32 MB of QDRII+ SRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multiboard synchronization- Optional LVDS connections to the Virtex-6 FPGA for custom I/O- 3U VPX form factors provides a compact, rugged platform- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Product
3U VPX Processor Board
VP32001
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LinkedHope Intelligent Technologies Co.,Ltd.
The VP32001 is a PC-compatible high performance 3U VPX processor board supporting the 2nd generation Intel® Core™ processor and the Intel® Series 6 mobile class chipset with up to 8 Gbytes of DDR3-1333 ECC SDRAM. The VP32001 features an XMC site and a range of I/O interfaces including two SATA600 channels, dual 1000Base-BX, RS232/422/485 and USB interfaces. The board provides a flexible PCI Express® (PCIe) backplane fabric interface that can be configured in several ways from eight x1 PCIe ports to a single x8 PCIe port making it suitable for use in both distributed systems and centralized switching systems as defined in OpenVPX (VITA 65). For rugged applications two VPX-REDI conduction-cooled versions are available, the VP32001-RCS is a VPX-REDI Type 1 Two-Level Maintenance conduction-cooled board and the VP32001-RCT is VPX-REDI Type 2. The board is suitable for a range of applications within industrial control, transport, aerospace, security and defense applications. To simplify integration many standard operating systems are supported.
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Product
Chassis 8 Slot
PXIe 4U/ 42HP
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As PXI has evolved into high-speed serial fabric technology, so has the Hartmann Electronic product line with the addition of its PXIe solutions. More power, more bandwidth, more functionality.
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Product
1-Ch 3.6 GHz or 2-Ch 1.8 GHz 12-bit A/D with DDC, Kintex UltraScale - XMC
Model 71841
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- One-channel mode with 3.6 GHz, 12-bit A/D- Two-channel mode with 1.8 GHz, 12-bit A/D- Programmable one- or two-channel DDC (Digital Downconverter)- 5 GB of DDR4 SDRAM- µSync clock/sync for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction-cooled versions available- Clock up to four modules with Model 7194 High-Speed Clock Generator - PMC/XMC- Synchronize up to four modules with Model 7192 System Synchronization and Distribution Amplifier - PMC/XMC- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Product
Propeller Meters
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Measures accurately over a flow range of 10:1 or greater.± 2% of rate accuracy, guaranteed by certified wet calibration at three test points in.Sparling’s National Institute of Standards and Technology (NIST) traceable hydraulic flow lab.Sturdy cast or fabricated steel construction.Operating temperatures are over 100° F(unless higher temperature construction is specified).Suspended solids are over 0.5% of volume.Easily maintained with standard tools.Registration can be furnished in any standard Engineering Unit.
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Product
33 lane, 9 port, PCI Express
PEX 9733
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Broadcom has extended the reach of PCIe for use as a fabric for data center and cloud computing through its ExpressFabric initiative and platform of hardware and software. ExpressFabric can eliminate expensive bridging devices within the rack, such as adapter cards that translate native PCIe to Ethernet and back to PCIe. Yet ExpressFabric works seamlessly with other standards used within the rack and in rack-to-rack connectivity.
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Product
ATCA PCIe Rugged Processor With Dual Xeon E5-26xx V4
ATC127
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The ATC127 is a high performance ATCA processor blade featuring dual 14-core Intel® Xeon® processor (E5-2658 v4, E5-2680 v4, E5-2648L, 2618L, 2620 or 2630 v4), with eight banks of memory up to 256 GB DDR4 memory. Versatile connectivity includes two PCIe Gen3 x16 Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress Ports, front panel dual RS-232 and USB 3.0/2.0 Ports and front panel DVI-I connector. Onboard mSATA storage is available for local boot.
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Product
Nonwoven Thickness Gauge
DRK141P-II
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Shandong Drick Instruments Co., Ltd.
It is used to determine the thickness of bulky non-woven fabrics with a thickness of ≤ 20mm and the thickness of large-compression non-woven fabrics.
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Product
XMC
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LinkedHope Intelligent Technologies Co.,Ltd.
XMC is a PMC with high-speed serial fabric interconnect defined by the VITA 42 standard.
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Product
SPI Flammability Tester (Vinyl Material)
TF318
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TESTEX Testing Equipment Systems Ltd.
SPI Flammability Tester (Vinyl Material), to determine the ignition properties of vinyl plastic film material according to CFR 16 Part 1611 U.S.A. Flammable Fabrics Act for flammability of apparel vinyl plastic film.The rate of burning shall not exceed 1.2 in./s as judged by the average of five determinations lengthwise and five determinations transverse to the direction of processing, when specimen is placed at an angle of 45 degree and expose to the standardized flame (22# fire nozzle, 1/2 inch. In length).
