Thermal
The radiation of heat.
See Also: Energy, Chemical, Electrical, Nuclear, Electromagnetic, Thermal Shock, Thermal Test, Infrared
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Thermal Analysis
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Thermal Analysis is important to a wide variety of industries, including polymers, composites, pharmaceuticals, foods, petroleum, inorganic and organic chemicals, and many others. These instruments typically measure heat flow, weight loss, dimension change, or mechanical properties as a function of temperature. Properties characterized include melting, crystallization, glass transitions, cross-linking, oxidation, decomposition, volatilization, coefficient of thermal expansion, and modulus. These experiments allow the user to examine end-use performance, composition, processing, stability, and molecular structure and mobility.
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Product
High Temperature Source
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The Veeco High Temperature Source provides thermal evaporation of charge materials at temperatures up to 2000°C. This compact MBE source operates efficiently to achieve high temperatures without excessive thermal load on the system. Low power requirements also enhance the lifetime of the heater filaments.
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Product
Instruments
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Organizations working on new thermosets or new thermoset formulations need an intimate understanding of how these materials cure before they can proceed to the next step in the research, quality control, or production process. What happens when the material is heated? When is the best time to apply pressure to squeeze out voids? How fast does the material react at 120C? 150C? 180C? Most organizations today address this need by curing a sample for an arbitrary amount of time before using inexact, error-prone manual methods, or complex thermal analytical instruments to test cure state. Maybe the sample has reached the end of cure, but maybe not. With traditional methods, it’s difficult to tell for sure. How can organizations determine whether they’re processing materials longer than necessary? Dielectric cure monitoring lets them know for sure.
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Product
6 Slot VPX PCIe Gen2 Chassis
Desert Gecko
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The 6 slot conduction cooled chassis can dissipate 120W in a non-moving air environment. The fin design and wall thickness was designed and analyzed with Flowmetrics software and designed for minimum delta T offset in an average thermal load application. The design was then verified in real life enviromental chamber experiments with a sealed chassis using our 3U heat simulator modules. Data available upon request.
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SWIR Imagers
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SWIR imagers (short wavelength infrared) are an important group of surveillance electro-optical imagers due several reasons. First, advances in InGaAs technology enabled design of relatively low cost SWIR imagers. Second, InGaAs imagers are very sensitive and can generate images of observed scenery even at dark nights. Third, SWIR imagers are less vulnerable to bad atmospheric conditions than TV/LLLTV cameras working in visible/near infrared band. Fourth, SWIR imagers can generate hi-res images even if they are built using much smaller optics than used for design of thermal imagers.
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Product
Situational Awareness Camera
FLIR K1
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The FLIR K1 is a rugged, compact thermal camera that serves as an extra set of eyes on the fire scene, allowing commanders, officers, and inspectors to quickly complete a thorough 360° assessment in total darkness and through smoke. With a bright, integrated flashlight, the FLIR K1 illuminates the scene to help the user steer and manage the crew more effectively. It also displays 160 × 120 pixel thermal images that help users gain additional situation awareness that is not possible with the naked eye.
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Product
Compact Single-Point Anemometer
ComfortSense Mini
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The ComfortSense Mini is a compact and robust single point anemometer that covers a wide range of applications. With an easy exchange of probes, the ComfortSense Mini covers both high velocity measurements in ventilation ducts as well as draught measurements in offices. The velocity probes are based on the well-proven technology of thermal anemometry which offers a wide velocity range, increasing sensitivity as velocity decreases, and fast response. This makes it particularly suitable for very low velocities, at which other methods either fail or become too inaccurate.
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Product
Dual Filament Source
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Get the optimal thermal profile for different materials and situations with the Veeco Dual Filament Source. This source is designed for growing high-quality Ga- and In-containing materials, while preventing charge material recondensation and significantly reducing defects. Dual Filament Sources are available for use with both SUMO and conventional crucibles (including Group III production crucibles).
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Thermal Quad Scanner
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Thermal Quad Scanner has the Highest Isolation of any 4-Terminal Scanner and operates at up to 1000V. With a Guildline model 6664C scanner and software, hard-to-make high ohm measurements (up to 100 GΩ) can be automated and scheduled at any time that is convenient to the metrologists, even at night and over the weekends.
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Product
Temp Characterized CalPod, 20 GHz
85531B
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CalPods provide a new and unique way to quickly and easily refresh a network analyzer calibration, at the push of a button and without removing the DUT or re-connecting standards. Very useful in thermal chamber testing, where it is desired to remove the thermal effects of the test cables and connectors from the DUT’s response, and where it is impractical to stop the thermal testing to perform a normal re-calibration.
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Product
Temperature Sensors
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The infrared sensor measures temperature at a distance without contacting the target. The integrated infrared module senses the thermal radiation emitted by objects on a 16 x 4 array of sensing points, for measuring the temperature distribution across a surface. These 64 measurement pixels are transmitted via CAN to the host controller or data logging device. The sensor is available in both 35 and 60 field of view options to suit a variety of installations. A software package is provided for viewing live temperature data from the array.
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Product
Dual IR and EO Vehicle Situational Awareness Sensor
ThermoVision Dual Sensor (DS)
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The DS camera is a vehicle camera system composed of a thermal camera and a color TV camera. The color TV image can be fused/blended with the IR picture, which is very useful for situational awareness. The driver's vision version of the camera has a 55 or 90 degree field of view (FOV).
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Product
IR Thermal Camera
AMG8833
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This is the Thermal Camera FeatherWing: thanks to the Panasonic AMG8833 8x8 GridEYE sensor, it adds heat-vision to any Feather main board. Using our Feather Stacking Headers or Feather Female Headers you can connect a FeatherWing on top of your Feather board and let the board take flight!This part will measure temperatures ranging from 0°C to 80°C (32°F to 176°F) with an accuracy of +- 2.5°C (4.5°F). can detect a human from a distance of up to 7 meters (23) feet.
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Product
Autofocus System
CRISP
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Applied Scientific Instrumentation
The CRISP system is designed to maintain focus over time i.e. compensate for thermal & other factors that may cause the sample to drift out of focus over time. It also can be used to maintain a given focal point while scanning the sample in XY. If you are looking to find the optimal focal point while scanning through the sample in Z phase.
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Product
6-Zone SMT Reflow Oven
CR6000
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A combination of high-mass heat sources and efficient thermal transfer allows the CR6000 to provide excellent reflow soldering results and throughput with a shorter-than-average heating tunnel. Your 6-zone unit also includes advanced features such as a wide combination pin-over-mesh belt conveyor, partnered pre-loaded KIC Auto Focus profile predictions software, and real-time thermal profiling standard.
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Aircraft Escape Systems
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The Emergency Interseat Sequencing System (EISS) was designed an qualified for the F-15K Fighter and has since been installed in the F-15SG and F-15SA configurations of the F-15. The system consists of Thermal Batteries with Initiators, a Digital Interseat Sequencer, Mode Selector, and customer provided cabling Electro-Explosive Devices (EEDs). The system is operated from either thermal battery and aircraft 28Vdc for redundancy. A separate field Test Set (EESSTS) performs both complete system continuity tests and an operational test of the total system installed in the aircraft. The sequencer is programmable and could be used in any escape system.Based on the initiation point, Forward or Aft Seat Handle, Internal or External Canopy Jettison Handles, and the Mode Selector setting, the Sequencer provides firing pulses to the EEDs to support canopy removal, ejection seat inertial reel activation(s) and ejection seat catapult firing(s). Sensing capabilities are provided to determine system state, canopy gone, seat gone, so as to provide the optimum escape timing.
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Longwave Infrared Thermal Camera Module
Tau® 2
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Made in USA, the Tau® 2 OEM thermal imaging cameras offer an unmatched combination of features and reliability, making them well-suited for demanding applications including unmanned vehicles, thermal sights, and handheld imagers. Improved electronics provide powerful image processing modes that dramatically improve detail and contrast through continuous histogram equalization. Radiometry is available in every pixel for both 640 × 512 and 336 × 256 resolutions and all three camera grade levels. All Tau 2 configurations share electrical, mechanical, and optical interfaces allowing integrations to be designed that work seamlessly with all formats. Available in Commercial, Performance, and Industrial variants, each with unique sensitivity and pixel operability thresholds to meet operational requirements. Radiometry is an optional feature for Performance-grade cameras, and standard feature with Industrial-grade. All Tau 2 configurations and resolutions share electrical, mechanical, and optical interfaces allowing integrations to be designed that work seamlessly with all formats.
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Oxygen/Nitrogen/Hydrogen by Inert Gas Fusion Infrared and Thermal Conductivity Detection
836 Series
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The ONH836 Oxygen/Nitrogen/Hydrogen Elemental Analyzer is designed for wide-range measurement of oxygen, nitrogen, and hydrogen content of inorganic materials, ferrous and nonferrous alloys, and refractory materials using the inert gas fusion technique.
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Altitude & Space Simulation Test Chambers
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Weiss Technik’s vast experience with altitude, thermal vacuum, low temperature and space simulation test chambers can provide you with the right solution. We offer both pre-engineered and custom altitude chambers for ultra-low cooling, extended mbar, and extended temperature ranges that will meet your testing exact requirement.
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Molded Interconnect Subtrate
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A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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Thermal Imaging Cameras (TIM)
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TIM thermal imaging cameras are designed for non-contact measurement of surface temperatures from -20 °C to 2450 °C. They enable efficient monitoring and control of temperature-critical processes both with low temperatures (e.g. in cooling chains) and with very high temperatures (e.g. in glass and metal processing). Their high thermal sensitivity makes these infrared cameras ideally suitable for precise and dynamic tasks. Different performance classes enable a suitable model to be selected for every application. The camera is connected via a USB interface, which also supplies the power.
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Product
Multispectral PTZ Thermal Camera
FLIR Elara DX-Series
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The FLIR Elara™ DX-Series multispectral pan/tilt/zoom (PTZ) security camera provides full situational awareness in the most punishing environments. Combining thermal and visible light imagers, the Elara DX-Series gives operators the ability to monitor large areas in complete darkness, glaring light, and adverse weather. The exceptional detection and identification capabilities of multispectral cameras help integrators provide solutions for challenging imaging problems at critical infrastructure sites and remote facilities.
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Product
4-CH RTD Thermal Input EtherCAT Module
EPS-3504
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ADLINK" s EPS slave system features modular design for flexible high channel density, rugged construction, easy maintenance, and intelligent performance, compatible with 3rd party EtherCAT products. Precise time-deterministic control enables I/O synchronization for critical applications, and FPGA and ARM technology allow users to fully monitor status of EPS modules and systems, including operating temperature and usage cycle of relay switching, as well as motion control status for general purpose motor drive control. In addition, the ADLINK EtherCAT configurator enables auto-scan and configuration across EtherCAT systems. The EPS" unique structural and electronic design supports hot-swappable function, reducing repair time, and the rugged construction and operating temperature range of -20°C to 60°C allow operation in the harshest environments.
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GCxGC Time-of-Flight Mass Spectrometer
PEGASUS® BT 4D
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The Pegasus BT 4D offers enhanced sensitivity by coupling our benchtop Pegasus BT with our high performance GCxGC thermal modulation system. This combination gives the Pegasus BT 4D the ability to interrogate challenging samples where the best sensitivity is needed. Unique and powerful software and hardware features simplify quantitation, while also dramatically making GCxGC easy to use and understand.
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THERMO & A/D MODULE OF THE COMPACT DEVICE FAMILY
ES650
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Featuring 16 electrically insulated measuring channels for analog voltages and an adjustable acquisition rate per module, this module provides high measuring accuracy through 16-bit (A/D) or 21-bit (thermal) resolution. Signal smoothing occurs through a parameterized software filter, and offers two selectable measuring ranges of 10 V and 60 V. The automotive measuring range is -210 C to 1372 C (-346 F to 2502 F). Data transfer to PC occurs via Ethernet.
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SSD
MSATA SSD (MLC) 3ME4 Series
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Innodisk mSATA 3ME4 is SATA III 6.0 Gb/s flash based disk, which adopts latest Marvell NAND controller with Innodisk’s exclusive L³ FW architecture. The upgraded L³ FW architecture, combining Innodisk signature 4K mapping algorithm L² FW architecture with powerful LDPC technology, makes 3ME4 series have outstanding high IOPS, better data integrity and extended lifespan through reducing the bad block number happening. Built-in thermal sensor, and iData Guard ensure data integrity and reliability of mSATA 3ME4 for industrial applications.
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Analytical Services
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Atomic Force Microscopy (AFM) allows for sub nanometer resolution imaging of surface topography and is able to quantify surface roughness at the angstrom scale. Our team can give you highly accurate measurements such as surface topography, dopant distribution, magnetic domain features, and a wide variety of other sample properties to give you the information you need to do great work.Park can provide measurements in the following areas:● Topography (surface roughness, grain size, step height, etc.)● Mechanical Properties (stiffness, etc.)● Electrical properties (capacitance, conductivity, etc.)● Thermal properties ● Magnetic properties These properties can be measured in air or liquid, depending on your needs.
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Systems Integration for Circuit Card Assembly
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Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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Product
Oil Immersed Transfer Standard
esi SR1030 Series
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The esi SR1030 transfer standards consist of 12 equal steps. These steps are available in increments of 1 (SR1030-1), 10 (SR1030-10), 100 (SR1030-100), 1k (SR1030-1k), 10k (SR1030-10k) and 100k (SR1030-100k). The esi SR1030 provides four-terminal connections for each step or for series and parallel combinations of these resistance steps using the optional Series-Parallel (SPC102), Parallel Compensation Networks (PC101) and shorting bars (SB103). This improves power dissipation, stability and errors due to variance in temperature. The esi SR1010 and esi SR1030 are used for the same applications and are alike in configuration. The esi SR1030 differs from the esi SR1010 in that it is specially sealed, and values below 100 k are filled with oil to improve changes due to thermal variations.
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Non-Destructive Testing
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The essential feature of active thermography is the targeted supply of energy to the test object. A temporal and spatial characteristic heat flow results depending on the geometry and thermal properties of the test subjects. Its progression on the surface of the test object is captured by a thermographic camera.





























