Chucks
Hold DUTs in place.
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Product
Tabletop Front & Backside Mask Aligner
Model 200IR
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The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
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Product
Spring Stiffness Testing Machine
STB Series
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Jinan Testing Equipment IE Corporation
STB Computer Control Spring Stiffness Testing Machine Under Axial and Lateral Load is to measure the displacement stiffness of spring under both axial and lateral load, complying with the standard EN13298 Railway applications - Suspension components - Helical suspension springs, steel. The Spring Stiffness Testing Machine measures both axial and lateral stiffness of spring, displacement for both lateral and axial, both loads, offset angle etc. The Spring Stiffness Testing Machine is an ideal testing equipment for spring of chuck and train.
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Product
High Temperature Chucks
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High temperature electrostatic chucks are available for the ranges -60 to +400 deg. C, and for 350 to 600 deg. C. Different materials and constructions are used in these two ranges.
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Product
Fully Automatic MRAM Probe System
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*This system can measure MRAM characteristics automatically.*Generates strong and constant magnetic fields. (Max 1.5T, the highest in the industry)*Performs high speed sweep of magnetic field by using non-magnetic materials wafer chuck. (Max 4Hz, ±1T, the highest in the industry)
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Product
Probe Station
EPS500
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Reasonable price and compact design. - Sellectable chuck size : 4inch, 6inch, 8inch when ordering probe station. - Hot chuck can be installed. Temp range: RT ~ 300°C - Hot and cool chuck from 0 °C ~ 300 °C can be provided. - Maximum 6pcs of manipulators can be installed on the base unit of probe station EPS500.
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Product
Pneumatic Non-Shift Wedge Grips
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Pneumatic non-shift wedge grips have an open-front design and use one-touch chucking by foot operation to provide simple specimen mounting. These grips are suitable for tensile testing materials such as plastics and metals.
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Product
TLP Probe Arm Kit
TPA-95
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High Power Pulse Instruments GmbH
*Flexible pulse force, pulse sense combined TLP probe arm kit based on TPA-95L and TPA-95R*Compatible with typical standard micropositioner mechanical interfaces*4.7 kΩ pulse sense voltage divider, which results in a voltage transfer ratio of (4700 + 50)/50 = 95 : 1 into 50 Ω*Variable probe pitch configuration*1 m flexible 50 Ω cables with SMA connector for pulse sense*0.1 m flexible 50 Ω cables with SMA connector for pulse force*Tungsten probe tips*Can be used for chuck backside grounded TLP measurements
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Product
Probe Card Analyzers
PB6800
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The ITC line of Probilt, probe card analyzers provide fast, accurate and repeatable test data for all types of probe card technologies. Simple user definable vision parameters allow even the newest and most complex probe tip geometries to be captured and accurately measured. Probilt’s PB6800 large measurement chuck allows probe arrays as big as 300 mm in diameter to be touched down without overhanging the chuck surface.
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Product
ECHO VS System with Image Enhancement
Echo VS
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The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.
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Product
Thermal Chuck Systems
C-Series
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Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Product
C-V Plotters
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Materials Development Corporation
MDC will tailor your CSM/Win Semiconductor Measurement System for your exact requirements. Choose the best capacitance meter, output device, and probe station for your needs. All CSM/Win C-V plotters feature the latest Dell Computers. The computer and capacitance meters are rackmounted in one compact enclosure. When ordered with a hot chuck or probe station, MDC can deliver a turnkey system of unparalleled performance.
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Product
Tabletop Mask Aligner
Model 200
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The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a tableop mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.
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Product
Wafer Back Side Cooling System
GR-300 Series
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The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
