SoC
A complete computer "System on a Chip".
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Product
SOC Battery Tester
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This sophisticated battery test equipment allows the battery tester to exercise and explore the battery’s internal profile and produce a true state of charge revealing the batteries true AHR capacity and ability to perform under load.
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Product
PCIe/104 OneBank Carrier for Trenz SoC Modules
EMC²-DP
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Sundance Multiprocessor Technology Ltd.
The EMC²-DP is a PCIe/104 OneBank™ Carrier for a Trenz compatible SoC Module and has expansion for a VITA57.1 FMC™ LPC I/O board and also has I/O pins, using a 100-way Samtec RazorBeam connectors system. The add-on board, called “Sundance External Interface Connector – SEIC” contains LEDs, RS232, USB2.0, HDMI, 1Gb Ethernet and SATA . The “SEIC” can be customize for individual applications and bespoke connectors.
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Product
SoC Verification
TrekSoC
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TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
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Product
ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
ETX-BT
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The ETX-BT is based on the latest Intel Atom® processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel Atom® processor E3815 at 1.4GHz to a quad-core Intel Atom® processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.
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Product
Qseven V1.2 SoM Evaluation Kit With I.MX287 454 MHz (Industrial) SoC, 128MB Memory, 4GB EMMC, Gigabit Ethernet, Audio, CAN And BSP
Q7M100-100-EVK
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*Ultra low power consumption ARM9*High flexibility Qseven v1.2 compliant design*5 UART*2 CAN*24-bit TTL LCD*10/100 Mbps Ethernet*Linux 2.6.35
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Product
SMARC Short Size Module With Qualcomm® QRB5165 Series Octa-Core SoC
LEC-RB5N
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- Qualcomm® Kryo™ 585 CPU (8x Arm Cortex-A77 cores)- Qualcomm® Hexagon™ Tensor Accelerator (HTA) running up to 15 TOPS- 4K HDMI/MIPI DSI display, MIPI CSI cameras- 2x PCIe x2 Gen3- 2x GbE Ethernet- 2x USB 3.1/2.0 and 4x USB 2.0- GPIO/SD and UFS- 5VDC +/-5% voltage input
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Product
Intel® Celeron® N3160/ N3060 SoC Fanless Embedded Computer
MXE-1500 Series
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The successor to ADLINK's best-selling MXE-1300 Series, the MXE-1500 offers richer I/O interfaces, and more flexible I/O configurations in the same compact enclosure. Intel® Celeron®(Braswell) processors, Intel’s last generation of CPU to support Windows 7, power the MXE-1500 to a 90% increase in image processing capabilities over the previous generation, and support three independent displays, altogether delivering an unequaled price/performance ratio and making the MXE-1500 an ideal choice for industrial automation applications and mass transit operators.
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Product
SMARC V1.0 SoM With IMX6 Quad/DualLite 800 MHz (Industrial) SoC, 1GB RAM, 4GB EMMC, GbE LAN, Audio, CAN, MIPI And PCAM
SCM120
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*SMARC 1.0 (82 x 50 mm)*Ultra low power consumption Cortex™-A9*2 CAN 2.0B*24-bit TTL signal*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux3.0.35/Android 4.3*Audio
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Product
Mini-ITX SBC With Intel® Celeron® Processor N3160 (up To 2.24 GHz) SoC, VGA/HDMI/LVDS, USB 3.0, Mini PCIe Card, MSATA And HD Audio
MANO300
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The MANO300 mini-ITX motherboard built with the latest Intel® Celeron® processor N3150 (codename: Braswell) with integrated Intel® Gen 8 graphics supporting up to 4K resolution. Two SO-DIMM sockets are provided to support up to 8GB of DDR3L-1600 memory. The 12V single voltage DC power jack or ATX power makes the power input selection more flexible for different automation and embedded industries. Its friendly fanless cooling system design and compact form factor aimed at space-limited applications as well as harsh environments.
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Product
COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
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- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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Product
Qseven V2.0 SoM Evaluation Kit With Quad/DualLite 800 MHz (Industrial) SoC, 1GB Memory, 4GB EMMC, Gigabit Ethernet, Audio And CAN
Q7M120-120-EVK
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*Ultra low power consumption Cortex™-A9*High flexibility Qseven v2.0 compliant design*2 CAN 2.0B*18/24-bit TTL LCD*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux3.0.35/Android4.3*Audio
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Product
Intel® Celeron N3160/N3060 SoC, Intel® Atom E8000 SoC, 3.5" SBC, DDR3L, VGA, HDMI, 48-Bit LVDS, 2GbE, Mini PCIe, MSATA, SUSI API
PCM-9310
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Intel® Celeron QC/DC SoC, Intel® Atom QC, DDR3L-1600MHz SODIMM up to 8GBDirectX11.1, OpenGL4.2, OpenCL1.2, 3 independent display: VGA + HDMI + LVDS/eDP*Rich I/O: 4 x COM, 2 x SATA, 2 x USB3.0, 4 x USB2.0, TPM2.0, SMBus/I2C, GPIO, full-size Mini PCIe w/ SIM holder, full-size mSATASupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
SoC Integration At RTL
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Before logic synthesis, STAR enables full implementation capabilities towards IP and connectivity insertion with a real-time monitoring of the integration progress. This enables SoC creation in minutes and maximize design reuse from existing projects.
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Product
I-Pi SMARC IoT Development Kit Based On Intel® 7th Gen Atom® X7433RE Quad-Core SoC
I-Pi SMARC Amston Lake
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The I-Pi SMARC Amston Lake is a SMARC-based edge solution devkit powered by power-efficient Intel Atom x7433RE quad-core SoC with integrated Intel UHD graphics with 32 EUs, deep learning inference capabilities, industrial grade durability and comprehensive high-speed interfaces.
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Product
SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC
LEC-RB5
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The ADLINK LEC-RB5 is a SMARC module powered by the Qualcomm® QRB5165 SoC with 8 Arm Cortex-A77 cores and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device artificial intelligence (AI) capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, enterprise, defense, industrial and logistics sectors.
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Product
SoC Tester
UltraFLEXplus
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The UltraFLEXplus combines new instrument and software capability with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP developed over the UltraFLEX’s 15 year history .
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Product
3U VPX SDR Module
VPX3-ZU1-SDR
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Sundance Multiprocessor Technology Ltd.
The VPX-ZU1-SDR from PanaTeQ is a 3U OpenVPX module based on a Xilinx Zynq Ultrascale+ MPSoC ZU6EG/ZU9EG/ZU15EG using JESD204B interface to an Analog Devices AD9371 or AD9375 Wideband RF Transceiver. Available in Air Cooled or Conduction Cooled version (see picture), this module offers incredible capabilities for the developers looking for ruggedized Software Defined Radio applications and targeting the defence/aerospace market. The module can work as stand-alone module or can be the SBC of the VPX system using the power effecient Quad-Core ARM Cortex A53 SoC and the on-board PCIe Gen2 Switch (worldwide unique feature)
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Product
Custom & ASSP
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Offering innovative SoC, SiP, ASIC, audio/video ASSP and other custom solutions and foundry services across a wide variety of applications in the automotive, industrial, medical, and aerospace & defense markets.
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Product
Fanless Embedded System With Intel® Celeron® 2980U/ Core™ I5-4300U/i3-5010U ULT SoC, HDMI/DisplayPort, 2 GbE LANs, 4 USB 3.0, 2 COM And PCIe Mini Card
eBOX560-880-FL
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The eBOX560-880-FL, a palm-sized, fanless embedded computing system utilizes high performance Intel® Haswell ULT multi-core SoC. The ultra-compact, ultra-lightweight eBOX560-880-FL adopts an IP40-rated rugged aluminum cold-rolled steel enclosure to withstand vibration of up to 3 Grms (with SSD) and has a unique thermal solution to support the temperature range from -20°C to +50°C (-4°F to +122°F). Supporting 4K2K resolution via HDMI interface, the outstanding embedded box computer is ideal for passenger information system, Kiosk, entry-level gaming, video surveillance, and other automation & embedded applications.
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Product
High Performance Netlist Debugging and Netlist Viewing
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GateVision PRO is the third generation of graphical gate-level netlist analyzers and netlist viewers from Concept Engineering. Please check out the Demo Video: Basic Features. Completely rewritten to run on modern 32/64bit platforms, GateVision PRO provides the designer of even the largest chips and SoCs with intuitive design navigation, netlist viewing, waveform viewing, logic cone extraction, interactive logic cone viewing for netlist debugging and design documentation.
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Product
COM-HPC Server Type Size E Module with Ampere® Altra® SoC
COM-HPC-ALT
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ADLINK’s COM-HPC Ampere Altra is the first 80-core COM-HPC Server Type module in the world. It is based on the Ampere® Altra® SoC based on the Arm Neoverse N1 architecture and offers up to 80 Arm v8.2 64-bit cores at 2.8GHz with only 175 Watt TDP. The excellent performance-per-watt architecture makes the COM-HPC Ampere Altra well suited to processing massive data at the edge without requiring a significant initial investment or ongoing maintenance costs.
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Product
Signal Board Computers
PX1-C415
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WINSYSTEMS’ PX1-C415 single board computer (SBC) is a PC104 form factor SBC with PCIe/104™ OneBank™ expansion featuring the latest generation Intel® Atom™ E3900 series SOC processors (formerly known as Apollo Lake-I). Its small size, rugged design and extended operational temperature make it a great fit for Industrial IoT applications and embedded systems in the industrial control, transportation, Mil/COTS, and energy markets.
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Product
JAMMA (J-Series)
DPX-J100
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High performance AMD Embedded V & R SOC APUs. Quad and dual core APUs up to 2.6 (3.5) GHz, 25W. Radeon™ VEGA GPU with up to 8 compute units. Up to three independent monitors supported.
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Product
DOOH Digital Signage
DS-330
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Intel Atom x7433RE, Processor N97 and i3 N305 Quad Core SoC with triple display, dual LAN, Fanless Box PC. Intel® Atom™ x7433RE, Processor N97, i3 N305.
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Product
COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
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The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Product
PCI Express IP
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Rambus silicon-proven, high-performance PCI Express® (PCIe®) 6.0, 5.0, 4.0 and earlier generation digital controllers are optimized for use in SoCs, ASICs and FPGAs. These market-leading solutions for high-performance interfaces address AI/ML, data center and edge applications.
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Product
3U OpenVPX Module
VPX3-ZU1B
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Sundance Multiprocessor Technology Ltd.
PanaTeQ’s VPX3-ZU1B is a 3U OpenVPX module based on the Zynq UltraScale+ MultiProcessor SoC device from Xilinx. This upgraded version provides a dual Ethernet 1000BaseT interfaces on the VPX P2 connector.
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Product
Sealed Panel PC
PPC12-427
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WINSYSTEMS’ PPC12-427 is a fanless, 12.1-inch panel PC featuring the latest generation Intel Apollo Lake-I SOC processor. Its small size, low power, extended operational temperature, and IP65 rating make it a great fit for harsh environments in the industrial control, transportation, energy, and industrial IoT markets.
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Product
SMARC Module
LEC-MTK-I1200
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The ADLINK LEC-MKT-I1200 is a SMARC module powered by the MediaTek MT8395 SoC with 4x Arm Cortex-A78 and 4x Cortex-A55 cores and up to 5 TOPS APU. The module incorporates a spate of IoT technologies, such as on-device artificial intelligence (AI) capabilities and support for up to 3 cameras, while delivering a low power envelope, making it the ideal solution for robotic and drone applications across various sectors, including consumer, enterprise, defense, industrial, logistics, and more.
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Product
Hybrid Verification Platform
HES-DVM
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HES-DVM™ is a fully automated and scalable hybrid verification environment for SoC and ASIC designs. Utilizing the latest co-emulation standards like SCE-MI or TLM and newest FPGA technology, hardware and software design teams obtain early access to the hardware prototype of the design. Working concurrently with one another they develop and verify high-level code with RTL accuracy and speed-effective SoC emulation or prototyping models reducing test time and a risk of silicon re-spins.
