BGA Inspection
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Product
3D Automated Optical Inspection
Zenith UHS
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High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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Product
Automated Inspection Systems
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Our systems utilize phased array and eddy current array to inspect the full volume and surface of various products and profiles in many manufacturing industries, such as metal, aerospace, transportation, power generation, and oil & gas.
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Product
Visual Visual Inspection Device
IP-3000
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Our visual visual inspection device Inspection Pro IP-3000 is an inspection device that quickly and accurately inspects the mounting board, which is constantly evolving, and judge whether it is good or bad without omission.
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Product
Lithium Battery Inspection Tester
C19
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Fuzhou Fuguang Electronics Co., Ltd.
C19 series is a portable tester which can quickly inspect battery pack of two-wheel vehicles. It can realize quick inspection and selection of SOH data of battery pack and discharge-charge maintenance. Data can be transferred to the mobile phone APP through Bluetooth forming a statistics report and faulty cell warnings so that further maintenance solutions can be developed in time.
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Product
RC BGA Interposer, LPDDR4 200-ball, Rigid, Connects Using 2x U4207A
W6602A
Interposer
The W6602A LPDDR4 rigid RC BGA interposer for LPDDR4 200-ball DRAM enables capture of simultaneous read and write traffic at data rates and has been tested to 3200 MT/s. Two U4207A zero Ω, 34-channel, soft touch pro, single-ended, 4 x 160-pin direct connect probes are required to connect the W6602A LPDDR4 BGA interposer into two U4164A logic analyzer modules. The W6602A LPDDR4 rigid RC BGA interposer allows signal access to the LPDDR4 signals critical to your debug and validation effort through a U4164A logic analyzer system. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR4 200-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR4 signals.
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Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Product
Inspection Instrument for Indicators
i-Checker
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The i-Checker is specially designed to calibrate measuring accuracy of dial indicators, dial test indicators, and other electronic comparison gage heads with a stroke of up to 100mm (4").±(0.2+L/100)µm indication accuracy. Directly inspects an indicator with a stroke of up to 100mm (4"). The dial test indicator, bore gage and lever-type inductive head can be inspected with optional accessories. Adjustment of the measurement position is very easily accomplished because of semi-automatic measurement and full automatic measurement functions. Creates and prints out the simple inspection certificate. Saves inspection result as CSV file for reusable inspection result by any kind of software.
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Product
Tool, Inspection Depth Gauge, Micro Coax, Receiver
910121179
Inspection Tool
Tool, Inspection Depth Gauge, Micro Coax, Receiver
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Product
High-speed 3D Solder Inspection Machine
YSi-SP
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a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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Product
Vision Inspection Systems
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We have available with us diverse array of Vision System. These systems are based on high-end technologies and meet the requirements of diverse sectors. Further, our systems are an epitome of quality and available at economical prices. Details of different systems.
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Product
Complete Non-Contact Inspection System For OLED/TFT/LTPS
GX3/GX7
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*Fastest*Workable to large panel as well as fine pattern of medium-small panel*Workable to large mother glass of every generation*Possible to dock width Repair Machine
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Product
X5 Pack X-Ray Inspection
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Designed to be integrated into line with built-in automatic reject and available in 300, 500 and 600 mm belt width models, the X5 Pack is perfect for a variety of unpackaged and packaged products.
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Product
CT Inspection System
FF35 CT
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The YXLON FF35 CT computed tomography system is designed to achieve extremely precise inspection results for a wide range of applications. Available in a single or dual tube configuration, it is perfect for very small to medium size parts inspection in the automotive, electronics, aviation, and material science industries.
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Product
Powder Coating Inspection Kit
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Elcometer has produced this kit to enable the inspection of powder coatings on all surfaces. For a smooth surface, the digital Elcometer 415 Paint and Powder Gauge may be used but for more demanding, uneven surfaces, the Elcometer 1542 Cross Hatch Adhesion Tester is included.
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Product
Automatic Double-Sided Bare PCB Final Inspection AVI System
FI-18 Series
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InScan Limited (SIP) Co., Ltd.
InScan FI-18 is a compact and high performance fully automatic double sided AVI system for Final Inspection of PCB boards.The setup is based on golden board and CAD data which greatly simplifies the setup process. The FI-18 series inspects and processes a double sided board sized 210X300 mm 5.5 sec. Superior interline high resolution CCD sensor.
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Product
Non-Destructive Test Resonant Inspection System
RAM-AUTO
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Resonant Acoustic Method is designed to help deliver fully inspected parts, economically and on time. Every component has a unique resonant signature or pattern that reflects its composition.
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Product
Automated Optical Inspection
K Series3D
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K Series and K Series3D are the reference in Automated Optical Inspection (AOI), allowing 2D and 3D inspection with very low false calls rate, for both pre-reflow and post-reflow. They are the most powerful gatekeepers to guarantee high quality level for the assembled PCB.
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Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
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Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Product
Dual Projection 3D In-Line Solder Inspection System
KY8030-2
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The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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Product
Smart Factory Inspection System
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API, recognizing manufacturing industry’s increasing demand for part measurement automation, with a higher degree of accuracy, has developed its Smart Factory Inspection System with true 6 Degrees of Freedom (6DoF) real-time 3D robotic measurement incorporating its proven metrology technology and calibration components.SFIS can be delivered as a customized integrated solution or as a standard production inspection cell.
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Product
X-ray inspection system for BLU, LED Long bar products
X-eye 9000LED
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X-ray Tube100kV / 200uAMin. Resolution5µmTable Size1,500mm X 500 mmDetectorFlat Panel Detector (High sensitivity)Dimension3,620(W) x 1,065(D) x 1,590(H)mm / 850kg
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Product
Post Wire and Die Bond Inspection Machine
IV-E1700
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IV-E1700 is a post wire and die bond inspection machine that is known for having a proven, effective and patented 2D+3D Inspection system. This product is best used to weed out defects with data collection for process improvement and reports for SPC quality Control.
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Product
Wafer Inspection System
AutoWafer Pro™
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AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Product
Hi-Definition Video Inspection Station
VIS800
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Video Inspection Stations are available with?or without on-screen measurement capabilities?and offer?an excellent way to evaluate or test small works or items in?difficult to access locations.? As todays electronic and mechanical systems keep getting smaller, it becomes impossible to test or measure these products with traditional methods. For many applications, from development to production testing, video based inspection can help maintain quality control. Many of these systems are used in labs for development or used in production for testing production samples.
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Product
Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Product
Automated Surface Inspection for Glossy Components
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Flawlessly glossy surfaces are among the most important quality features of many premium products. The smallest surface defects immediately have a degrading effect on the product. The result: disappointed end customers or buyers. At the same time, reflective surfaces are often very sensitive and a challenge for optical metrology. A manual inspection is tedious, expensive, and ultimately always governed by subjective decision criteria. During production, faulty painting or coating processes can cause high scrap rates. Defects that are not detected even during the final inspection can lead to expensive complaints and, in the worst case, to the loss of the customer. Only an efficient, automated surface inspection achieves the highest quality at acceptable costs.
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Product
Wireless Fiber Inspection Probe - WIS 300
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Shanghai Fibretool Technology Co.,Ltd.
WIS 300 wireless fiber inspection scope is a WIFI/USB dual-use portable digital fiber inspector. With automated PASS/FAIL and fast images focus functionality, and easy pairing to Android™ and Apple© iOS devices, It can quickly check various patch cords and transceivers, display the fiber end face in PC/laptop/ OTDR/Smartphone etc..digital devices with the USB cable or WiFi connection. Under WiFi mode, it can automatically get the image checked and analyzed. Test results can do the pass/fail judges with IEC/IPC criteria. Fiber images and results can be saved on PC and mobile devices in jpg/pdf/excel format for file records. It’s super light and handy to take anywhere anytime for field tests, operation inspections, and lab research.
