Thickness Gauges
measure distance between opposite sides of a layer.
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Product
NPIRI Fineness of Grind Gauge
2070
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The Elcometer 2070 NPIRI Fineness of Grind Gauge is used to determine particle size and the fineness of grind of particles in printing inks according to the National Printing Inks Research Institute (NPIRI) scale.
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Product
Analog Surface Profile Gauge
NOVOTEST LIMIT
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Mechanical depth gauge is designed to comply with ASTM D 4417-B, SANS 5772, US Navy NSI 009-32, US Navy PPI 63101-000 for (depending on configuration): measures the peak-to-valley height of a blast cleaned surface; measurement the depth of focal corrosion; measures depth of narrow holes and grooves.
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Product
Wafer Thickness Measuring System
WT-425
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Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
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Product
Fineness of Grind Gauges
2020
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The Elcometer 2020 Fineness of Grind Gauges is used to determine the particle size and fineness of grind of many materials including paints, pigments, inks, coatings, chocolates and other similar products.
