Reflow
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Product
Electronic Test & Measurement Equipment
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We are known worldwide for the M.O.L.E. Temperature Profiler. The Mole is used in the Electronic, Paint, Food, and the Industrial marketplace. The Mole is a stand alone, 6 channel, temperature profiler that it is used in many harsh processes that require the temperature measuring instrument to be inside the heating chamber or "ride along" with the parts or process being measured over time such as Solder Reflow Ovens and Wave SolderMachines.
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Product
Measuring & Analysis Equipment
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Quality management for semiconductor manufacturing processes and liquid crystal panel manufacturing processes, which require nano-order precision. Oxygen analyzers used in firing furnaces and N2 reflow ovens.Water quality meters used to monitor the water quality of plant discharge and the pure water used in semiconductor manufacturing processes.Our measuring and analysis equipment is used in a wide range of fields.
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Product
5-Zone Lead-Free Convection Reflow Oven Includes Pin-Over-Mesh-Belt Conveyor
CR5000
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The CR5000 full-convection reflow oven provides consistent, quality performance, low ΔTs across every board, and mid-volume throughput, all in a compact, floor-space-saving footprint. The oven also provides flexibility and easy setup and changeover, thanks to the generously sized pin-edge and mesh belt conveyors, easy to use oven management software, and easy profile setup with the included KIC Auto Focus profile prediction software.
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Product
Circuit Card Assembly
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Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
