Alignment
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Product
Radar Cross Section (RCS) Measurement and Evaluation System
XRC
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KEYCOM develops various radars for versatile applications based on its knowledge and expertise on millimeter wave and microwave technologies. KEYCOM’s product line of radars includes Radar Test Systems (RTS) to evaluate distance accuracy or output, Radar Alignment Systems (RAS) to help you adjust the alignment of radars, and Radar Cross Section (RCS) measurement systems to measure RCS of such radar targets as aircraft, ships and automobiles.
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Product
Multiphoton FLIM System
DCS-120 MP
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*Multiphoton FLIM Upgrade for Existing Conventional Microscope*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*Excitation by Ti:Sa Laser*Two Non-Descanned Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Electronic Pinhole Alignment*Z-Stack FLIM Acquisition with Zeiss Axio Observer Z1*Optional: Spatial Mosaic FLIM via Motorized Sample Stage*Laser Control via SPCM Software
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Product
Optical Fusion Slicers
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ShinewayTech Optical Fusion Splicers - Ribbon, Clad Alignment & Core Alignment Splicers.
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Product
Confocal FLIM System
DCS-120
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*FLIM Upgrade for Existing Conventional Microscope*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*One or Two BDL-SMN or BDS-SM ps Diode Lasers*Two Fully Confocal Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Wideband Version, Compatible with Tuneable Lasers*Electronic Pinhole Alignment*Z-Stack FLIM Acquisition with Zeiss Axio Observer Z1*Optional: Spatial Mosaic FLIM via Motorized Sample Stage
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Product
Alignment Pin Replacement Kit, G2/G6/G10, Receiver
310118000
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This kit contains parts/ tools needed to replace missing or damaged alignment/ dowel pins on the G2, G6, or G10 receiver: 2 alignment/ dowel pins Loctite primer Loctite adhesive Dimension blockInstructions for replacement can be found in G2/G6/G10 user manual.
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Product
Return Band Alignment System
6103/6106
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Enable a single technician to perform return band alignment with this easy to use return band alignment system for CATV. This system consists of a headend signal level receiver/telemetry transmitter (the HECTER 6103) and a small, field portable, dual-carrier signal generator/telemetry receiver unit (HECTER'S PUP 6106).
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Product
3D Point Cloud Data Viewing, Cleaning, Editing, Leveling, and Alignment Software Package for BV5000 3D Data Processing
QuickStitch Powered by EIVA
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QuickStitch is an easy-to-use 3D point cloud data viewing, cleaning, editing, leveling and alignment software package designed specifically for BV5000 3D data processing. The intuitive controls and user interface allows operators to quickly learn cleaning and alignment techniques. QuickStitch provides customers a fast and simple way to produce clean and aligned data sets to their customers.
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Product
UFP series High Sensitivity Fiber Optic Alignment Stages
UFP
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Model: UFP1A-LFeatures:• The linear stage has both coarse adjustment and fine adjustment, sensitivity is much better than 0.5um• The rotation stage sensitivity is much better than 23.4" • High stability
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Product
Fiber Fusion Splicer
KL-300T
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Hangzhou Softel Optic Co., Ltd.
*Core to core alignment by PAS technology (PAS:Profile Alignment System)*Fiber core can be display clearly*Single X or Y view and X & Y view simultaneously*Auto check quality of cleaved end face*Display fiber cleaved and offset angle*Display core and clad offset*5.6 inch TFT color LCD monitor with clear digital image display*USB & VGA interface*Software upgrade via USB interface
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Product
Laser Beam Alignment
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The alignment product line provides full solutions for applications such as: alignment of laser cavities, straightness measurement, machine alignment, wide-bed printers alignment and others. The AlignMeter system simultaneously measures incoming laser beam position (in µm) and angle (in µRad).It is a powerful compact device perfect for alignment monitoring, for testing the drift, centration and beam alignment relative to the outer housing or tube.
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Product
Nanopositioner
P-616 NanoCube
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Physik Instrumente GmbH & Co. KG
Compact Parallel-Kinematic Piezo System for Nanopositioning and Fiber Alignment. In a parallel-kinematic multi-axis system, all actuators act directly on a single motion platform. This means that all axes can be designed with identical dynamic properties, which reduces the moved mass considerably. Further advantages: It is possible to make the parallel-kinematic system more compact than serial stacked or nested systems. The errors and masses of each individual axis do not accumulate.
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Product
Double Arm Alignment Automatic Testing Machine
U820
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1. CCD automatic alignment, the alignment accuracy reaches ± 2.5μm2. Support layout test, displacement function3. The upper and lower jigs X, Y, θ are automatically fine-tuned to improve the yield4. Optional laser marking5. Optional SHOPFLOOR report output6. Optional BARCODE READER
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Product
Laser Pulley Allignment System & Belt Pulley Alignment Tools
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PRÜFTECHNIK Condition Monitoring GmbH
Correcting belt pulley alignment significantly extends machinery service life and lowers power consumption by decreasing wear and improving efficiency. While you can identify misalignment visually or with a straight edge, using a pulley alignment laser tool makes finding angular, vertical, and horizontal misalignment much faster and easier. Our laser belt alignment tools and pulley alignment tools are easy to use and can pay for themselves within only a couple of months.
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Product
LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Product
TCoE Setup
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Alignment of the QA strategy to your business goals is critical to ensure that the QA enterprise is able to deliver on the dynamic expectations of the business. While the quality of your applications is an essential metric for the QA enterprise, it also needs to focus on continuous improvement and to be ready for future technologies. At TestingXperts, we help you transform your QA to a next-gen organization by setting up a Testing Center of Excellence (TCoE).
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Product
Automated Laser Beam Quality Measurement System
Beamage-M2
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Large Apertures: The only M2 system on the market equipped with a complete set of 50mm optics. Also, the sensor is 11.3 x 11.3 mm. Simple Alignment: Two beam-steering mirrors are included for quick and easy alignment of your laser into the system. The internal mirrors are factory-aligned and the pre-set height also simplifies the alignment.Available Fall '17
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Product
CMOS Image Sensor
CIS
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CMOS Image Sensors (CIS) allow multiple camera functions in mobile devices, automobiles and security systems. Nidec SV Probe provides both standard and advanced versions of our CIS cards employing a wide variety of materials ensuring a durable cost-saving solution that can meet the fine pitch and multi-dut challenges of these devices. Other features and benefits include: • Proprietary AC™ Alloy Probes • Reduced Damage Under the Pad • High Frequency Capability • Better Alignment StabilityOur advanced CIS card, the Multiplexer™, is offered specifically for high density and high parallel applications. The Multiplexer™ is built with cantilever needles held into place on one side and shorter AC™ probes on the other which leads to a more stable electrical characterization over other CIS probe card options.Contact your Nidec SV Probe Representative so we can help you find the right CIS product for your testing needs.
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Product
Plane Mirror Reflector
10724A
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The Keysight 10724A reflector is used with the Keysight 10706A, 10706B, 10715A and 10716A interferometers for single-axis measurements. It can also be used with the Keysight 10737L/R Compact Three-Axis Interferometers. Alignment hardware is included.
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Product
High-Speed & High-Precision Alignment for Display Metrology
LMK Position
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TechnoTeam Bildverarbeitung GmbH
The LMK Position is a photometric robotic system combining LMK-based machine vision with the high precision and flexible movements of a 6-axis Denso VS industrial robot and, optionally, a JETI specbos spectroradiometer. It allows effective and cost-efficient accompanying measurements during research and development tasks and rapid small-series product testing of all kinds of display systems.
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Product
Boresight Testing
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CI Systems provides different types of boresighting capabilities, such asLine of Sight BoresightingMission Ready BoresightingMechanical to Optical Alignment
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Product
Automotive Radar Test ∙ Evaluation
XRE
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KEYCOM develops and manufactures various radar systems to measure and evaluate such functionalities of mass-produced millimeter and microwave radars including in-vehicle radars as transmission power, frequency, antenna beam alignment, distance accuracy, bearing accuracy and receiving accuracy.KEYCOM’s product line includes the Radar Test System (RTS) that measures radar distance accuracy and transmission power, and the Rader Alignment System (RAS) that assists you to adjust the mounting position of the in-vehicle radar.
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Product
Inspection & Alignment Services
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As a leading provider of precision measurement services for power generation and turbo-machinery, API has the professional experience necessary to minimize the overall downtime of the outage or rebuild schedule. The ability to fully utilize API’s precision measurement capabilities, combined with experienced Service Engineers in the turbine alignment process, differentiates API for complex alignments.
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Product
Single Fiber Aligner
1100
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The 1100 Single Fiber Aligner uses patented fiber alignment concepts to produce virtually instantaneous temporary couplings for OTDR, dispersion, or any other optical fiber or component test that requires a fiber-to-fiber connection. It delivers low loss, low reflectance couplings on the first try virtually every time, without the need for test instrument feedback. As a result, temporary coupling times are minimized and manufacturing costs are reduced without compromising product quality.
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Product
Custom Solutions for Mask Aligners
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OAI offers custom designed solutions built to your unique specification.
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Product
3U VPX SOSA Aligned Development Chassis
Model 8256
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- Video: AOC 2021 Mercury's Model 8256 SOSA Aligned Dev. Platform and RFM3202 Microwave Transceiver- Video: Model 8256 3U VPX SOSA Aligned Development Platform, multi-vendor operation demonstration- Video: Model 8256 3U VPX SOSA Aligned Development Chassis- Developed in alignment with the SOSA™ Technical Standard- Ideal development platform for Pentek's- Model 5550 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX- Model 5553 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX- 8-slots provide space for a range of acquisition and processing boards- Optional rear panel RF and optical connections- Compatible with the Quartz product family
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Product
Automated Mask Aligner with Integrated Mask Changer
Model 6000A-MC
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The Model 6000A-MC is a precision system combining OAI’s Model 6000, Automated Production Mask Aligner, with an integrated mask changer. The mask changer can handle from 10 to 150 masks. Ideal for both semiconductor and bio-tech applications. It also is designed with a bar code reader to assure each mask is coordinated to the right process. Please contact OAI for further product information.
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Product
725-Watt (28VDC input) DC/DC Converter, SOSA™ Aligned, 3U VPX
VPX55HS
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NAI’s VPX55HS-31 is NAI's latest +28 VDC Input, VPX DC/DC Converter. The VPX55HS was developed in alignment of the SOSA™ Technical Standard and is capable of handling up to 725 Watts of output power. It plugs directly into a standard 3U VPX chassis with a VITA 62 1.0” power supply slot. This off-the-shelf solution for VITA 46.0 and VITA 65 systems is compatible with VPX specifications; supports all VITA standard I/O, signals, and features; and conforms to the VITA 62 mechanical and electrical requirements for modular power supplies.
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Product
3U 12-slot VPX Backplane Aligned To SOSA 1.0
1OVX312AFQ-xxxx
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3U 12-slot backplane with profiles aligned SOSA. It is designed to meet the U.S. Army’s C5ISR Modular Open Suite of Standards (CMOSS), and supports high-speed signals on all data paths and VITA 67.3 and VITA 66.5 connectors.
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
