Thermal Expansion
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Product
Thermal Shock Chambers
VTS-Series
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Vertical Thermal Shock chambers consist of two separately controlled hot and cold zones. Product is transferred between these zones for rapid product temperature changes. Thermal Shock Chambers are designed to perform tailored environmental stress screening of component and board level electronic assemblies. The return on investment in both actual savings and customer confidence adds greatly to the value of electronic assemblies screened in a CSZ thermal shock system.
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Product
TSA Thermal Shock Chambers
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Traditional three-zone thermal shock chambers can be quite large, as three separate chambers are used. The TSA series has just one chamber, substantially reducing its size. Instead, it circulates cold, hot, or ambient air as needed. The conditioned air is pre-cooled or pre-heated beyond the setpoint, allowing quicker recovery of the desired condition after transfer.
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Product
Liquid Thermal Shock Baths
TSB Series
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CSZ's Liquid thermal shock chambers consist of separately controlled hot and cold baths. Product is submersed in fluid and thermally stressed between the hot and cold baths, resulting in immediate product temperature changes. CSZ uses perfluorinated fluid that does not coat the product or conduct electricity for use in both the hot and cold baths to eliminate cross contamination and reduce evaporation losses.
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Product
Thermal Shock Test Chamber
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observe the product characteristics and failure occurrences caused by different materials and their thermal expansion coefficients, thermal shock testing is subjected to the product. In thermal shock testing alternating high and low temperatures are fed in the chamber. WEIBER designs and manufactures customised THERMAL SHOCK CHAMBERS with separately controlled temperature zones (2 zone and 3 zone), liquid to liquid (2 zone) depending on configuration of the chamber chosen.
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Product
Serial RS-232 Expansion Connector Accessory for USBHub3c
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Used for connecting a serial RS-232 interface to the control the USBHub3c through the expansion interface connector. Screw terminals are provided for the RS-232 interface. While this board provides for wiring connections, a host machine external to the USBHub3c is required for this control interface.
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Product
EM & Thermal Simulation Software
SEMCAD X
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Schmid & Partner Engineering AG
SEMCAD X is the latest generation of 3-D FDTD full-wave simulation software offering unprecedented levels of user-friendliness, speed & memory efficiency. Its application range has been further greatly extended by incorporating the world's first EM ADI-FDTD solver.
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Product
Thermal Warpage Metrology Tool
AXP 2.0
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The TherMoiré® AXP 2.0 is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré® AXP 2.0 captures a complete history of a sample’s behavior during a user-defined thermal profile.
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Product
Thermal Validation Software
TQSoft and TQAero
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Thermal validation from TQSolutions has long supported the Fluke Hydra Series data loggers. TQSoft and TQAero now support the Fluke 2658A Hydra Series III and 1586A Super-DAQ Precision Temperature Scanner for enhanced data collection and reporting required in regulated industries. It's deal for applications requiring compliance to FDA 21 CFR Part 11 and AMS 2750.
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Product
Thermal Conductivity Measuring Device
TCM1001
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In recent years, there has been a demand for small and thin electronic products such as mobile devices, and printed circuit boards are shifting to thin, multi-layered, and even modularized printed circuit boards. effect of bonding materials, that is, the ability to easily conduct heat, is emphasized, and testing equipment that evaluates thermal conductivity is required .As a business of our company, we have mainly manufactured and sold test equipment for solder wettability tests and solder bonding strength, but there was a need to urgently develop next-generation bonding material test equipment to replace these. Under these circumstances, we received a request from an academic research facility to manufacture a device that can measure the thermal conductivity of conductive adhesives under research and development, and we were able to obtain an opportunity to develop the device. We proceeded with the development based on these requirements .
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Product
Thermal Imaging Camera Attachment for iOS and Android
FLIR ONE
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Explore the world around you in ways you never thought possible. Simply attach FLIR ONE to your smartphone or tablet and experience a new vision of the world. FLIR ONE offers non-contact spot temperature measurement, patented MSX Technology, and automatic shuttering. Plus, the FLIR ONE App offers thermal panoramas and timelapse. FLIR ONE features both FLIR's revolutionary Lepton thermal camera and a VGA visible light camera. Using MSX Technology, FLIR ONE blends images from both cameras to create thermal images with enhanced detail and resolution.
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Product
Thermal Profiling System
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lt is impossible to have dependable production without quality management. The expectation is growing and customers requirements must be addressed. In most of the industries, proper monitoring of temperature with time plays an important role in the quality of products. Whether it can be painted/powder coating industries, oven manufactures, automobile industries, and many more.
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Product
CAN/LIN Communications Expansion Kit
OP-SB7FX
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OP-SB7FX is the expansion kit which makes it possible to monitor, and simulate CAN and LIN communications. It enables monitoring of CAN and LIN data in any combination up to 2 channels at a time. Suitable for evaluation of mixed in-vehicle networks of CAN and LIN.
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Product
IEC60884 Fig38 Thermal Compression Test Device For Plug Testing
IEC60884 fig38
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Shenzhen Chuangxin Instruments Co., Ltd.
IEC60884 fig38 thermal compression test device for plug testingUsed to evaluate the pressure resistance of electrical accessories and wall mounted mounting boxes under heatStandard: GB2099.1-2008 Articles 24.19 and 25.4 and Figure 38, IEC60884-1 Figure 38, etc.
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Product
10-Slot X16 (16 Lane) Gen-3 PCI Express Expansion System
ExpressBox 3600-10
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Magma’s ExpressBox 3600 provides optimal server grade GPU and other HPC peripheral expansion to existing host computer systems. Designed to support full Gen 3 x16 PCIe connectivity to all devices, the EB3600 supports 128 Gbps communication between the host and all peripherals. Ten total expansion slots are supported by the EB3600-10 for one or two hosts.
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Product
Thermal needle system thermal resistivity / conductivity measurement
MTN01
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Hukseflux Thermal Sensors B.V.
The MTN01 Multi-purpose Thermal Needle System allows performing fast measurements of the thermal resistivity or conductivity of soils. It is specifically designed to be reasonably robust, as well as accurate. It is therefore suitable for laboratory as well as field- measurements of soil thermal properties. The sensor is a Non-Steady-State Probe (NSSP), TP07, which is mounted on the Insertion Tool, IT02. The system is operated using a hand-held Control and Readout Unit CRU01.
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Product
2-Slot Expansion I-Module With 1 X PCIe X16, 1 X PCIe X4
MIC-75M20
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1 x PCIE x16, 1 x PCIE x4 (MIC-75M20)2 x PCIE x8 (MIC-75M20-01)Support 2 x 4cm FAN (Optional)Dimension (W x H x D): 50 x 192 x 230 mm
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Product
900 Micron Buffer Fiber Thermal Stripper - TFS-900-250
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Shanghai Fibretool Technology Co.,Ltd.
TFS-900 900um buffer thermal stripper design small, lightweight, easy to use and reliable, longitudinal peel, peel force is small, the high quality of stripped fiber; blade durable and easy to replace, using linear bearing guide and thermal stripping to ensure no damage to the fiber, easy to strip coating, stripping speed and other characteristics. With the fixture using the strip dual core optical fiber
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Product
PMCspan PMC Expansion Board
PMCspan
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SMART Embedded Computing’s PMCspan allows users to customize and expand I/O options when coupled with a Smart SBC.
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Product
Ultra-compact, Uncooled Thermal Imaging Core
Dione S 640 CAM Series
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The Dione S 640 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution and NETD of less than 40 mK (available upon request) and 50 mK. The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 640 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 640 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional).The ultra-compact Dione S 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
Thermal Imaging Range
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Di-LOG Offer the full FLIR Thermal Imaging range. Contact us for more information and to book your on-site demonstration
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Product
Thermal Imaging
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Transcat is an industry-leading supplier of thermal imagers and infrared cameras for every application, ranging from building or HVAC diagnostics and spot temperature measurement to complex and operation-critical industrial preventative maintenance and energy loss analysis. Our featured thermal imaging brands, Fluke and FLIR, continue to expand their diverse range of product offerings with new and innovative cameras at every price level.
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Product
Low Thermal Input Cable
34102A
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Use this 1.2-m shielded, 4-conductor connector only with the 34420A Micro Ohm Meter; terminated in copper spade lugs.
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Product
LXI EMR Low Thermal EMF Matrix 42x33
60-511-002
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This high density 1-pole matrix has excellent thermal stability and substantially reduced thermal EMF figures when compared to a conventional switching matrix.
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Product
PCI Express® Bus To 3U PXI Express™ Chassis Expansion Kit
ACL-EXPRESS-7
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The PCIe-to-PXIe expansion kit includes one PCIe-8560, one PXIe- 8565, and one ACL-EXPRESS cable (7 meters).
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Product
Thermal Sensitive Parameter Selector
UI9600
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Parameter measured under normal temperature:1) β (0-99)2) Switching time T (0.01μs-99.9μs), including Tr, Ts, Tf3) VCES (0-2V), VBE (0-2V)4) Leakage current ICEO (0.01μA-99.9mA)5) Withstand voltage BVCEO (50V-650V)• Parameter measured under high temperature: VBE, β, ICEO
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Product
Automated Thermal Stress System
ATSS Series
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Thermotron's Automated Thermal Stress Systems (ATSS) facilitate extremely rapid product temperature change rates in a space-saving, self-contained design that accelerate a Thermal Stress test. Thermotron's ATSS chambers meet the latest MIL-STD 883E and MIL-STD 202F thermal shock specifications as well as JEDEC and IPC test methods. ATSS chambers are capable of the following: Rapid thermal shocking, Accelerated product stressing, Controlled thermal cycling in a self-contained, compact design. With separate hot and cold zones, the Automated Thermal Stress System was designed with a patented retractable product transfer carrier that makes full use of the available working volume in both temperature zones for increased product loading and throughput. The product transfer carrier reduces the overall height requirements of the chamber and is made as light as possible to minimize thermal loading restraints. Thermotron ATSS chambers can be used as part of most commercial reliability and quality control programs, helping to determine:
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Product
LAN (supporting POE) Expansion Board
OP-SB89
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OP-SB89 is an expansion board for Ethernet LAN, inserting into a slot of battery drive portable data communication analyzer (LE-8200A/LE-8200). It supports the PoE (Power Over Ethernet) standard, and able to analyze the communications and power consumption at the same time.
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Product
PCI Express To PCI Express Expansion With 3 PCIe X8 Gen-3 Slots
ExpressBox 3200
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Connect high performance peripherals at Gen 3 speed. The ExpressBox 3200 is our latest Gen 3 marvel - precision engineered to the same exacting standards demanded by our defense and aerospace customers. The EB3200 is built for blistering speed and features three (3) full-length, full-heightPCIe slots and flexibility with two customer configurable 5.25” expansion bays. The rack-mountable aluminum chassis is designed for integrated removable storage expansion, a 520-watt fanless power supply, auxiliary power, and features Magma’s exclusive quiet cooling technology.
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Product
Thermal Imaging Sensor
3550 FC
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Condition monitoring sensor to visualize thermal patterns on multiple assets. Maintenance managers can now collect a more comprehensive variety of key-indicator data — thermal imaging, voltage, current, temperature, and power — on critical equipment to build a real-time picture of an asset's condition. With the right mix of data all in one place, managers can implement planned maintenance and decrease the frequency of preventive rounds.
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Product
True Reference Audio Interface With MDIO Expansion
Titan
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Titan and Atlas are world class multi-track interfaces offering flexible expansion and unsurpassable sonic clarity. Using the latest generation of Prism Sounds trusted conversion, Titan is ideal for music and sound recording, multi-tracking, overdubbing, stem-based mastering, analogue summing and critical listening applications.
