Common Core
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Product
Mini-ITX M/B Support 12th/13th Gen Intel® Core™ Processors, H610E, 3 X LAN For PPC-600
PPC-MB-620
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Supports Intel® 12/13th Gen Core™ i processor (LGA1700) with Intel Q670E/ H610E chipsetTwo 262-pin SO-DIMM up to 64GB DDR5 4800 MHz SDRAMSupports triple display of DP/HDMI/LVDSSupports PCIe x16 (Gen 5), 1 x M.2 M key & 1 M.2 E key, 6 USB 3.2Supports 2 x SATA 3.0 (Raid 0, 1) (only for PCH Q670E)Supports TPM 2.0Supports 4 RS-232,1 RS-232/422/485Supports 1 GPIO(8 channels)
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Product
15.6" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-315W TGL
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Industrial-grade 15.6" FHD LCD panel with 50k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive contrHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 1Support TPM2.0 hardware security
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Product
Core Loss Testers
S30 and S30S Series
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Stacks built with punched laminations can have a lot of quality issues. Even though the lamination material is tested in sheet format before any process, that alone is not sufficient to guarantee good quality stators. Wear and tear of the punch, bad welding, bad insulating coating in annealing add to the magnetic losses in the stator. It is always advisable to test the stator core in it's final format before winding to ensure good quality throughout the production batch.
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Product
Modular TPC - Computing Box Module With Intel® 12th/13th/14th Gen./BTL S Core™ I CPU Socket (LGA1700)
TPC-B620
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High Performance Computing Box powered by Intel® 12th/13th/14th Gen. Core™ i / BTL Core™ S-series CPUs Socket (LGA1700) with fanless design10+ x Panel Modules (IP66) ranging from 15" to 23.8" in selectionDual Channel Memory slots (DDR5) support up to 64GB in totalComprehensive I/Os, including 4 x USB, 2 x COM, 3 x RJ45...etcSupports Expansion via 1 x PCIe x16, 1 x PCIe x4 or PCIe x2, 4 x M.2 (NVMe, SATA, WIFI)Supports Storage via 2 x M.2 2280 SATA SSD (RAID 0/1), 1 x M.2 NVMe SSD (2280)Supports Fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologySupports Diverse system I/O, DIO, PoE...etc. via iDoor technologySupports TPM 2.0 hardware security
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Product
COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
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ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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Product
Updated Mini-ITX Embedded Board with 6th/7th Gen Intel Core i7/i5/i3, Pentium and Celeron Desktop Processor
AmITX-SL-G
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The AmITX-SL-G is a Mini-ITX motherboard supporting the Desktop 6th Generation IntelR Core? i7/i5/i3 and PentiumR and CeleronR Processor with IntelR Q170/H110 Chipset. The AmITX-SL-G is specifically designed for customers who need high-level processing and graphics performance with a long product life solution.
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Product
PICMG 1.3 Full-Size SBC With 14/13/12th Gen Intel® Core™ Processors And Intel® Q670E Chipset
NuPRO-E47
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The NuPRO-E47 is a high-performance embedded single board computer that features with 14/13/12th Gen Intel® Core™ i7/i5/i3 processor and an Intel® Q670E Express chipset, which supports PCIe Gen 3. It comes equipped with 2 DIMM sockets that can support up to 64GB of Non-ECC DDR5 memory running at 4800MHz. The NuPRO-E47 also includes 6 SATA 3.0 ports with RAID support and 4 COM ports (including RS-232/422/485) for increased connectivity options. Additionally, the NuPRO-E47 supports Intel® PCIe bifurcation, allowing for flexible and efficient use of PCIe lanes. This single board computer is designed for use in a variety of industrial applications that require high-performance computing and reliable connectivity
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Product
IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784966-01
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The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Product
12.1" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-312S(W) RPL
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True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
13th Gen. Intel® Core I7/ I5/ I3/ U300E P/U-Series 3.5" SBC
MIO-5377R
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13th Gen. Intel® Core™ Processor up to 14 Cores, TDP 28/15WDual Channel DDR5-4800 up to 64GB, IBECC support by SKU4 simultaneous displays: LVDS/HDMI/DP/USB-C Alt. DP2x LAN, 8x USB (incl. 1x USB4), 4x UART, 2x CANBus, 3x I2C3 Expansions: M.2 E-Key, B-Key, M-Key (support NVMe)Supports Windows 10/11 LTSC & Ubuntu 22.04 LTS, embedded software APIs, DeviceOn Remote Management, Robotic Suite
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Product
3U Intel® Core™ i7-7820EQ Quad-Core Processor-Based PXI Express Gen3 Controller
PXIe-3987
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The ADLINK PXIe-3987 PXI Express embedded controller, based on the 7th gen Intel® Core™ i7 processor, is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Product
21.5" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-321W TGL
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Industrial-grade 21.5" LCD panel with 50k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive controlHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 1Support TPM2.0 hardware security
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Product
IC-3172, 1.80 GHz Intel Core i5 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784228-01
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The IC‑3172 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3172 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Product
12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-208
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12th/13th/14th Gen Intel® Core™ Desktop Processors, max. 24Core, support H610E chipsetUp to 64GB DDR4 3200MT/s with two SO-DIMMPCIe x16 Gen4Triple independent displays with 2 DP, 1 HDMI, 1 LVDSRich expansion: 1 M.2 M-key & 1 M.2 E-key, 4 USB 3.2 Gen1x1 & 6 USB2.0, 2 SATA III and 6 COMWISE-DeviceOn and Embedded Software APIs
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Product
Shortwave Infrared Camera Core
Tau® SWIR
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FLIR Tau® SWIR provides outstanding short-wave infrared image quality and performance over a wide range of imaging and light level conditions. It is the ideal OEM SWIR imaging module for applications like hyperspectral instrumentation, silicon inspection, electro-optical payloads, art restoration, and portable imaging. The Tau SWIR camera incorporates the FLIR high resolution 640×512 ISC1202 Indium Gallium Arsenide (InGaAs) 15-micron pitch focal plane array (FPA) and includes several advanced camera controls features.
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Product
Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor For Railway, Vehicle And Marine PC
tBOX500-510-FL
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The tBOX500-510-FL comes with the onboard 7th generation Intel® Core™ or Intel® Celeron® processor 3965U along with onboard two DDR4-2133 SO-DIMM slots supporting up to 32GB system memory. It offers two I/O module slots and a wide selection of value-added modules (VAM) to meet different user requirements and customizations. The rugged tBOX500-510-FL is certified with E-Mark, ISO 7637-2, EN 50155, EN 50121, DNV 2.4, EN 45545-2 and IEC 60945.It supports a wide temperature range from -40°C to +70°C and anti-vibration of up to 5 Grms. The fanless embedded box PC equipped with intelligent power management offers ACC on/off delay, shutdown delay and over/under voltage protection. It supports a wide voltage input range: 9V to 36V DC for vehicle applications, 14V to 32V DC for railway & marine applications, and 16.8V to 137.5V DC for railway applications. For system integrators with extensive storage needs, the box computer offers two 2.5” SATA HDDs and one mSATA. The new transportation embedded system is well suited for transportation-related applications such as security surveillance, onboard devices controller, truck fleet management, data transfer, and onboard passenger infotainment system.
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Product
Tilera GX72 Processor, 72 Core, Mid-size, AMC
AMC741
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The AMC741 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network.
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Product
Iron Core Earth Tester
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Weshine Electric Manufacturing Co., Ltd
Transformer iron core grounding current tester is a high-precision clamp meter specially designed for measuring AC leakage current, current and voltage. Large diameter (80×80mm) can clamp φ80mm cable, or 96mm×4mm flat steel ground wire, suitable for cables Leakage detection and transformer grounding flat steel leakage measurement.
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Product
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
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ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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Product
Intel® Core™ I3-N305 Processor, Intel® Processor N-Series, And Intel Atom® Processor X7000E Series Pico-ITX SBC
MIO-2364
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Intel® Core™ i3-N305, N-series N97, and x7000E Series x7211EDDR5-4800 up to 16GBDual independent display: LVDS + HDMIGbE (optional PoE/PD, 802.3at), 4 USB, COM, SMBus/I2CExpansion: M.2 E-Key, M.2 B-KeySupports iManager & Software APIs, WISE-DeviceOn
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Product
18.5" FHD TFT LED LCD Touch Panel Computer With 13th Gen Intel® Core™ Processors And ATEX Explosion-Protected Certification
SPC-618WE
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Industrial-grade 18.5" FHD TFT LCD with 50K lifetime and LED backlightIntel® Core™ Processors (13th Gen ), i7-1365URE deca-coreBuilt in single DDR5 4800 RAM with 32GB capacityBuilt in sTLC SSD of 256GB with extreme longevity and reliabilityCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionSpecialized enhanced impact proof touchscreen with PCAP touch control and IP65-rated front panelDiverse system including Type C connector with USB 3.2, DP 1.4a, 15W power deliverySupport TPM2.0 hardware securityIEC Ex & ATEX certification for Zone 2/22 criteria and Class I Division II explosion proof certification
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Product
PXI/PXIe RF Multiplexer, Dual 4-Channel, Terminated Common, 3GHz, 50Ω, SMB
40-876A-002
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The 40-876A-002 (PXI) and 42-876A-002 (PXIe) are 50 Ohm 4 to 1 RF multiplexers with 2 banks in a single slot. Additionally, extra switching allows the common connection to be terminated into 50 Ohm, maintaining signal integrity. The module has low insertion loss and VSWR through the use of modern RF relay technology at an affordable cost. Each MUX has been carefully designed to ensure excellent and repeatable RF characteristics to frequencies of 3GHz with each path having a nominally equal insertion loss.
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7th & 6th Gen. Intel® Core™ U-Series (I7/i5/i3/*Celeron®), 3.5" SBC W/MIOe
MIO-5272
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7th & 6th Gen. Intel® Core™ U-series (i7/i5/i3/*Celeron®)Dual SO-DIMM slots support up to 16GB memoryMulti-Display: VGA + HDMI 1.4 + LVDS (48bit)Expansion: 2x Full-size miniPCIe slots (one for mSATA), MIOe connector for I/O extensionDual GbE, 6x USB, 2x COM, SMBus/I2C, GPIO, TPM (optional)Supports Windows 10 LTSC & Ubuntu 20.04 LTS, embedded software APIs, WISE-DeviceOn
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Product
Soft Magnetic Core Power Loss Analyzer
SS-SML01
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This SS-SML01 soft magnetic core power loss analyzer includes one set broadband power signal generator and on set W-A-V meter, the broadband power signal generator is specially researched and manufactured for the testing of the soft magnetism materials.
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Product
Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor, LVDS And LAN
PICO511
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The PICO511 is an extremely compact Pico-ITX motherboard featuring the latest 7th generation Intel® Core™ processor or Celeron® processor 3965U (codename: Kaby Lake). The feature-rich 2.5-inch embedded board is building flexible I/O interfaces through board to board connectors, wide temperature range in a small-form factor motherboard to fit different needs of many demanding applications in various industries. The PICO511 is perfect for system integrators who require an extremely compact embedded motherboard with great processing power and expansion capabilities. Its compact size form factor has ensured that it can fit into a variety of space constricting environments. In addition, the Intel® Kaby Lake-based motherboard was designed to withstand extreme temperatures, ranging from -20°C to +70°C (0°F to +158°F).
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Value Series Industrial ATX Motherboard For 12/13/14th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-C47
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Elevate your industrial applications with the ADLINK IMB-C47 value series motherboards, engineered to deliver robust performance at an exceptional value. Designed with the evolving needs of cost-conscious businesses in mind, the IMB-C47 value series offers a versatile foundation for a wide range of computing tasks.From manufacturing automation to retail kiosks, these motherboards bring reliability without the premium price tag. Featuring support for the latest processors, abundant I/O connectivity, and expansion options, the IMB-C47 value series is crafted for those who seek reliable technology that aligns with their budgetary parameters.
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Product
3.5" Single Board Computer With 13th Gen Intel® Core™ I7/i5/i3/ Celeron® Processor
SBC35-RPL
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SBC35-RPL is powered by Intel's latest processors, which offer improved performance, power efficiency, and support for the latest technologies based on Intel's 13th generation of 3.5-inch Single Board Computers (SBCs) offer a range of advanced features and capabilities for a variety of embedded applications.
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Product
Intel® 8th. Gen. Core I7/i5 Processor Fanless Embedded System
EPC-C301
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Intel 8th. Gen. Core Processor with Quad/Dual Cores (i7/i5), TDP 15W.Semi-Industry Fanless slim systen, Din Rail or Wall mount design.HDMI + DP* (Support vai MIO) dual display.4 GbE, 4 USB3.1, 4 USB 2.0, CAN Bus, M.2 M-Key 2280 supports NVMe, M.2 E-key 2230, M.2 B-key, 1 full size of mini PCIe, DC-in 12V.-20 ~ 60 degree extend temperature operating.Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite.No RED certification.
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Product
10th Gen Intel® Core™ Processor LGA1200
AIMB-277
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Supports 10th Generation Intel® Core™ i processor (LGA1200) with Intel Q470E chipsetTwo 260-pin SO-DIMM up to 64GB DDR4 2933 MHz SDRAMSupports triple display of HDMI 2.0a/DP++/VGA/LVDS( or eDP)Supports PCIe x16 (Gen 3), 1x M.2 M key + 1x M.2 E key, 4x USB 3.2 Gen2 + 4x USB 3.2 Gen1, and 4x SATA IIISupports Intel vPro, AMT, Software RAID 0,1,5,10, TPM 2.0, 3.2W AmplifierSupports ATX powerSupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API and WISE-DeviceOn
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Product
STP Engine (IP Core)
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The Stream Transpose® (STP) engine is a reconfigurable processor (DRP: Dynamically Reconfigurable Processor) core that combines the flexibility of software and the speed of hardware. The firmware defining processing can be reconfigured in an instant, allowing an almost infinite variety of functions to be integrated into a system. A 40nm process is currently available for ASIC.
