Evolved Packet Core
LTE system core voice and data network.
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Product
Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Product
X-Band Silicon Radar Quad Core IC
AWS-0105
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The AWS-0105 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and single beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain and +15 dBm output power during transmit mode and 7 dB gain and +7 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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Product
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
Computer on Module
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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Product
CT Core Tester
VCCT
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Veer make CT Core Tester VCCT is portable & easy to use Instrument. It is very useful to measure Voltage & Current of Electrical Steel like Toroidal Cores of different grade and size. VCCT is designed to test a lamination stack Toroidal Core. A Quality is judged by comparing the value of voltage applied & consumption of current.
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Product
Ultra Compact, Uncooled Thermal Imaging Core
Dione S 1280 CAM Series
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The Dione S 1280 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 1280 × 1024 resolution and NETD of less than 40 mK (available upon request) and 50 mK.The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 1280 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 1280 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 1280 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M34/M45 lens (optional).The ultra-compact Dione S 1280 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
Air Core Line & Load Reactors
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Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.
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Product
12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-278
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12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), Up to 24Core. Support Q670E/H610E chipsetDual channel DDR5 5600MHz, max. 96GB with two SODIMMsSuper Speed I/O: PCIe x16 Gen5 (32GT/s), USB3.2 Gen2 (10Gbps), 2.5GbEQuad independent 4K displays with 2 DP1.4, 1 HDMI, and 1 eDPRich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 3 SATA(RAID 0,1,5)TPM2.0 supportWindows 10 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOn
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Product
Industrial IP69K Stainless Steel Panel PCs With 11th Gen Intel® Core™ Processor
Titan2
Panel PC
- 11th Gen Intel® Core™ i5/i3 BGA type processor- 15.6”/21.5”/23.8” FHD with projected capacitive touchscreen- Full IP69K rating for dust and water ingress- Corrosion-resistant 304 stainless steel enclosure (316 for Option)- All M12 type connectors suite for harsh environments- Optional for optical bonding and high brightness (1000 nits)- Standard VESA, Yoke/Pipe mount (optional)
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Product
Fanless Embedded System With Intel® Core™ I5-6300U 2.4 GHz/i3-6100U 2.3 GHz/Celeron® 3955U 2.0 GHz, 2 HDMI, 2 GbE LANs, 4 USB 3.0, 2 COM And 9 - 36 VDC
eBOX565-500-FL
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The eBOX565-500-FL is designed to support the 6th generation Intel® Core™ i5-6300U or Celeron® 3955U processor with one 260-pin DDR4-2133 SO-DIMM socket with up to 16GB system memory. The eBOX565-500-FL is designed for reliable use in industrial environments with an IP40-rated enclosure, a wide range 9 to 36 VDC power input, a wide temperature ranges from -10°C to 50°C (14°F to 122°F), as well as up to 3G vibration endurance. To fulfill various needs, the palm-sized industrial embedded computer, which measures 141.6 x 106 x 73 mm in size, provides rich I/O connectivity including two HDMI ports, one RS-232/422/485 port, one RS-232 port, four USB 3.0 ports, two Gigabit Ethernet ports, and two SMA type connector openings for antenna. One PCI Express Mini Card slot enables the addition of Wi-Fi, 3G, or LTE wireless cards.
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Product
3.5 Inch SBC with 7th Gen Core i7 CPU and PCIe/104
VENUS
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Based on the “Kaby Lake” 7th generation Core i7 processor, Venus offers high CPU performance in a small form factor rugged SBC with modest power consumption. It incorporates a full suite of rugged features such as soldered memory, latching connectors, a thicker PCB, and true -40/+85ºC operating temperature, making it suitable for the most demanding vehicle applications. High I/O density, multiple expansion sockets, rugged design, modest power consumption of 14W, and wide temperature operation combine to make Venus an extremely attractive option for applications requiring high CPU performance or ruggedness.
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Product
Intel® Core™ Ultra 5/7/9 LGA1851
AIMB-589
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Intel® Core™ Ultra Series 2 Processors, max. 24Core. Support W880/Q870 chipsetsUp to 192GB DDR5 UDIMMs/CUDIMMs for data transfer2 x 2.5GbE LAN and 2 x GbE LAN for digital devices1 x USB4, 8 x USB3.2, 4 x USB2.02 x M.2 M-Key 2280 for NVMe SSDAccommodate 2 double-deck GPU cards by PCIe x16 slots (x8 lanes)
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Product
Versatile All-In-One Medical Panel PC Family With 12th/13th Generation Intel® Core™ Processor Performance
MLC-S Series
Panel PC
- Powerful 12th/13th Gen Intel® Core™ i3/i5/i7/i9 processor- 21.5’’or 23.8’’ full HD display with PCAP multi-touch touchscreen and anti-glare coated safety glass for unsurpassed visualization capabilities- 7 illuminated soft-touch function keys on the front glass- Edge-to-edge glass surface and patented screwless design allow for easier and faster cleaning and disinfection procedures- Fully sealed aluminum housing and fan less design for high hygienic standards with IP54 rated ingress protection and antibacterial treatment- PCIe x16 internal expansion slots for storage, networking and processing cards
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Product
PICMG® 1.3 Full-Size 6th generation Intel® Core™ i7/i5/i3 LGA1151 Processor-based SHB (Code name: Skylake)
NuPRO-E43
Single Board Computer
The ADLINK PICMG 1.3 SHB, the NuPRO-E43, supporting the 6th Gen IntelR Core i7/i5/i3 processor and equipped with the IntelR Q170 Express chipset. The NuPRO-E43 supports high-speed transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133 MHz memory up to 32 GB.
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Product
Fanless Embedded System With Socket G2 Intel® Core™ I7/i5/i3 & Celeron® Processor And 4 GbE LANs
eBOX660-872-FL
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A high-performance fanless embedded system with 3rd Generation Intel® Core™ processor (Ivy Bridge), the eBOX660-872-FL, is presented by Axiomtek earnestly. It incorporates the 3rd Generation Intel® Core™ processor (i7/ i5/ i3) or Intel® Celeron® processor with Intel® HM76 Express chipset, propelling computing with better processing. With the great graphics computing capability and dual view support, this fanless embedded box computer is especially suited for automatic optical inspection, digital signage (DS), digital surveillance, gaming, automation control and POS/Kiosk. In addition, this application-ready compact rugged platform also targets for nearly any field of industrial embedded applications like embedded controller, factory automation and more fields.
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Product
COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
Computer on Module
The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
PXIe-8830MC, Intel Core i7 Processor PXI MultiComputing Processing Module
783564-33
Processing Module
The PXIe‑8830mc allows two or more intelligent systems to exchange data using PCI Express technology. Featuring an Intel quad-core processor, the NI PXIe‑8830mc can be installed in any PXI Express peripheral slot. It runs on the LabVIEW Real‑Time OS and can act as a coprocessor to offload the processing from the main embedded controller in the system.
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Product
Intel Coffee Lake Platform To Support Intel® 9th & 8th Gen Core™ I Processor With One Low-Profile PCIe Expansion Slot
EPC-B2276
Embedded PC
Supports Intel® 9th & 8th Gen Core™ i processor (LGA1151) with Intel Q370.Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM.Supports triple display of 2x DP/HDMI.One low-profile PCIe expansion slot.Reserved 2 USB, 2 COM, punchouts on front panel.Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
Modular TPC - Computing Box Module With Intel® Core™ Processors (13th Gen)
TPC-B520
Panel PC
Modular Computing Box powered by Intel® Core™ processors (13th gen) i5-1335UE deca-core/ i7-1365URE deca-core processorSingle DDR5 Memory slot supports up to 32GBSupport expansion via three M.2 slots (NVMe, Wifi, 5G)LAN, POE, isolated serial port and isolated digital I/O via iDoor technologySupport Type C connector with USB 3.2, DP 1.4a, 15W power deliverySupport fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologyModular Front Panel modules ranging from 12.1" to 23.8" with P-CAP multi-touch in selection (12.1", 15", 15.6", 21.5" with high brightness panel option)
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Product
3U CompactPCI Intel® 6th Gen. Quad- Core™ Processor Blade
MIC-3332
Processor Blade
MIC-3332 is using Intel® 14nm technology to provide significant performance and power efficiency. It provides an ideal solution for railway rolling stock, high-performance computing and military application. With its optimized design on EMC & thermal, it is available to meet or exceed EN50155.
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 or Xeon® E Processors
IMB-M45
Motherboard
ADLINK IMB-M45 ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 and Xeon E3 processor in the LGA1151 package, and the Intel C246 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe 3.0, USB 3.1 Gen2 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz ECC or non-ECC memory up to 128 GB in four DIMM slots.
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Product
Thermal Imaging Core
JOHO336CM_A00
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Wuhan JOHO Technology Co., Ltd
JOHO336CM_A00 is a high sensitivity, high reliability uncooled thermal imaging core . With advanced image processing technology, it offers excellent image quality by 320x240 resolution,17m pitch sensor. Featuring of compact design and ultra low power.
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Product
Mini-ITX 12th/13th/14th Gen & And Series 2 Intel® Core™ Processor LGA1700
AIMB-289 A2
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Intel® Core™ Desktop Processors 12/13/14th Gen and Series 2Dual channel DDR5 5600MHz, max. 96GB with two SODIMMsRich expansion: M.2 B key for SSD Storage, M.2 E key for wireless, 2 SATA12-24V DCin Power Input via DC Jack or ATX 4pin+5VSB pin headerWindows 10/11 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOnTriple independent 4K displays with 1 DP1.4, 1 HDMI, and 1 LVDS
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Product
Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-4000 Series
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- NVIDIA® Quadro® PEG card support- 8th/9th Gen Intel® Core™ i7/i5/i3 processor- Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)- 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards- 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module- 300W/500W Flex ATX PSU
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Product
2-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, Front-access I/O, PCIe And PCI Slots
IPC962-511-FL
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The IPC962-511-FL is powered by the 7th/6th generation Intel® Core™ and Celeron® processors (codename: Kaby Lake/Skylake) up to 65 W with the Intel® H110 chipset, featuring high performance capability. The ultra-compact industrial computer provides flexible expansion options with one I/O module slot and two PCI/PCIe expansion slots. It has a wide operating temperature range of -10°C to +60°C, and is equipped with a wide range 19V - 30V DC power input for mission-critical environments. The ruggedized industrial PC has a creative modular design with rugged mechanisms and optimized expandability. To meet different customization requirements, it has an optional I/O module slot and three different types of I/O modules. The choices, include a 4-port isolated RS-232/422/485 module; isolated 8-in/8-out DIO module; 2-port isolated RS-232/422/485 and 4-in/4-out DIO module, can provide system integrators with a less cabling solution for a lower total cost of ownership. Additionally, the compact industrial PC provides two flexible PCI/PCIe expansion slots with three different combinations of AX96205, AX96206, AX96207: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; 2 PCI.
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Product
17" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-317S RPL
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True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3102 with Intel MXM GPU
Industrial Computer
- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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Product
11th Gen Intel® Core™ I5-Based Fanless Embedded Computer
EMP-510 Series
Box PC
- 11th Gen Intel® Core™ i5 BGA SoC processor- DDR4 SODIMM up to 64GB- FHD/4K/8K up to 4x independent displays- 2x GbE, 1x COM, 4x USB ports- M.2 2280 SSD- Wi-Fi 6/LTE compatibility
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Product
3U OpenVPX™ SOSA™-Aligned SBC with Intel® Core™ i7-1186GRE Processor (Tiger Lake)
68INT6
OpenVPX
The 68INT6 is a SOSA™-aligned 3U OpenVPX Intel® Core™ i7-1186GRE Processor / integrated PCH-LP (Tiger Lake) w/ 4 Cores & 12M Smart Cache running up to 2.8 GHz Single Board Computer that can be configured with up to two Smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
Air Core Inductors
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Osborne designs our Air Core Inductors to realize their advantage of high linearity. We also work with our clients to identify and mitigate any potential disturbances that could result from electromagnetic fields created. The air core design approach is known to create strong electromagneticfields. Osborne develops electromagnetic circuit models, if necessary, to ensure that our clients build effective and reliable circuits.
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Product
Thin Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, DisplayPort++, HDMI, LVDS, VGA, USB 3.0, M.2 And Dual GbE LAN
MANO521
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The MANO521 is a thin mini-ITX motherboard powered by the LGA1151 socket 9th/8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake) with Intel® H310 chipset or optional Intel® Q370 chipset. This Intel® Coffee Lake-based motherboard provides rapid video acceleration advantage, multiple expansion interfaces and triple-view capability. It is designed with rich functionality, solid performance in a small footprint, making it suitable for a broad range of performance-driven embedded applications such as industrial automation, transportation, self-service kiosks, medical, and digital signage. The MANO521 features two high bandwidth 260-pin DDR4-2400/2666 with a memory capacity up to 32GB. It offers two SATA-600 sockets and one M.2 Key M 2242/2260/2280 connector for storage. The thin mini-ITX motherboard also provides various expansion interfaces within its limited dimensions including one PCIe x4, one full-size PCIe Mini Card slot and one M.2 Key E 2230, which offers diversity and flexibility for application integration. Moreover, the mini-ITX embedded board has a built-in DC Power Jack or ATX connector supporting 12V and 19 to 24V DC input with AT mode auto power function.
