Scientific Computing International
Not a manufacturer of consumer goods, but rather a developer and provider of advanced metrology systems and analysis software.
- (760) 634-3822
- info@sci-soft.com
- 6355 Corte Del Abeto
Suite C-105
Carlsbad,, CA 92011
United States of America
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Product
DUV-NIR Spectroscopic Reflectometry
FilmTek 2000
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Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter. Capable of simultaneous determination of multiple film characteristics within a fraction of a second per site.
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Product
Micro-spot DUV Spectroscopic Reflectometry
FilmTek 2000 PAR
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Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.
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Product
Benchtop Metrology System
FilmTek 2000 SE
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Scientific Computing International
Benchtop metrology system delivering unmatched measurement performance, versatility, and speed for unpatterned thin to thick film applications. Ideally suited for academic and R&D settings. Combines spectroscopic rotating compensator ellipsometry, multi-angle polarized spectroscopic reflection, and intuitive material modeling software to make even the most demanding of measurement tasks simple and reliable.
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Product
R&D
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Scientific Computing International
A term to describe the effort a company devotes to the innovation, and improvement of its products and processes.
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Product
Advanced Packaging & TSV
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Scientific Computing International
System providing an unmatched combination of speed, accuracy, and precision for high-throughput measurements.
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Product
Thin Film Design Software
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Scientific Computing International
SCI offers software tools for optical thin film design, material analysis, ellipsometry, and spectrophotometry. SCI’s current standalone optical thin film software includes:
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Product
Reflection/Transmission Spectrophotometry
FilmTek 3000 PAR-SE
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Scientific Computing International
Engineered to meet the needs of any advanced thin film measurement application, excelling at material characterization on both transparent and non-transparent substrates. Combines spectroscopic ellipsometry, DUV multi-angle polarized reflectometry, and transmission measurement with a wide spectral range to meet the most challenging of measurement demands in both R&D and production. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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Product
Compound Semiconductor
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Scientific Computing International
Semiconductors that are made from two or more elements.
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Product
LED
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Scientific Computing International
A light-emitting diode (LED) is a semiconductor device that emits light when current flows through it.
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Product
Solar Photovoltaic
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Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film.
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Product
Advanced Packaging & TSV
FilmTek 2000M TSV
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Scientific Computing International
Advanced semiconductor packaging metrology system providing an unmatched combination of speed, accuracy, and precision for high-throughput measurements of resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, redistribution layer (RDL) and other packaging processes.
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Product
Multiple Angle Reflectometry
FilmTek 4000
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Scientific Computing International
Fully-automated wafer metrology optimized for photonic integrated circuit manufacturing. Delivers unmatched measurement accuracy, with a 100x performance advantage over the best non-contact method and 10x that of the best prism coupler contact systems. Designed to enable optical component manufacturers to increase functional yield of their products, reliably and at lower cost.
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Product
Optical Thin-Film Metrology for Advanced Thin Films
FilmTek 6000 PAR-SE
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Scientific Computing International
Production-proven metrology system for film thickness, refractive index and stress measurement for a broad range of film layers at the 1x nm design node and beyond. Accommodates 200 or 300 mm wafer metrology. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to meet the challenging demands associated with multi-patterning and other leading-edge device fabrication techniques.
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Product
CD Measurement and Advanced Film Analysis
FilmTek CD
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Scientific Computing International
SCI’s leading-edge solution for fully-automated, high-throughput CD measurement and advanced film analysis for the 1x nm design node and beyond. Delivers real-time multi-layer stack characterization and CD measurement simultaneously, for both known and completely unknown structures. Patented multimodal measurement technology meets the challenging demands associated with the most complex semiconductor design features in development and production.
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Product
Wafer Manufacturing
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Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
