3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D CT Micro Or Nano Tomography And Digital Radioscopy Compact System
EasyTom
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Versatility for a wide variety of applications and analysable products. 6 motion axis. Large volume Inspection.
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3D CMOS Image Sensors
Flash
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High-resolution in a rectangular format, specifically designed for 3D laser triangulation - Very high frame rate and throughput combined with high power efficiency, delivering outstanding sampling resolution and speed with a high Gbps/W ratio - HDR feature embedded on-chip, to measure all kinds of surfaces - Feature-rich sensors, to perfectly meet application challenges.
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Teledyne PDS Liteview Freeware 3D Viewer for PDS Data Files
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Teledyne PDS LiteView is a freeware 3D viewer that can be used to view Teledyne PDS data files. The viewer will read the Teledyne PDS logdata files, grid model files, 3D design model files and GeoTIFF files. The multibeam and laserscanner data will be extracted from the logdata files and will be visible in the viewer.
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3D Image Processing Software
EyeVision
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EyeVision is the base for numerous measurement and inspection tasks in image processing. Features are: Creation of inspection programs with drag and drop function. EyeVision supports all hardware platforms such as; Smart Cameras, Vision Sensors, PC & Embedded support.
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Inspection System for high-power precise 3D X-ray CT
X-eye PCT225
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Inspection System for 3D X-ray CT able to analyze defected area precisely by precise movement of axis with high polished Anti-vibration table. High-power X-ray Tube of max. 450kV and large area Flat Panel Detector of max.16 inches can be installed depending on the sample. Customized 3D CT equipment is available with selecting main parts by customers depends on their needs for size and material.
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Benchtop 3D Optical Profilometers
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Compact, non-contact metrology instruments used for high-precision, sub-nanometer to micrometer-level measurement of surface topography, roughness, and step heights.
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Product
USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-02
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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3D Flexible Scanner
HDI Advance
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The HDI Advance 3D scanner offers the flexibility of scanning objects of different shapes and sizes. Simply move the camera positions to change the scanner’s field of view (FOV). The 3D scanner comes with three preset camera slots to quickly modify the field of view from 165mm up to 600mm, depending on the scanner model.
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Robotic 2D & 3D Vision Inspection
EyeT+Inspect
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EyeT+Inspect is the outstanding 3D device for robotic visual inspection combining robust 3D vision to inspect product shape with fast 2D vision to inspect product surface. EyeT+Inspect optimizes production thanks to automatic and objective removal of defective products from the production line.
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Cutting-edge 3D GPR array solution for efficient subsurface imaging cart solutions
Raptor
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The Raptor system covers a wide range of applications and can be configurated with 450 MHz or 800 MHz antennas. Raptor 3D Arrays are based on Real-Time sampling (RTS) technology and the unique antenna design is a milestone in the evolution of the GPR. A Raptor Antenna can be arranged in different ways, which allows for both standard and more advanced GPR measurements. These include common mid-point (CMP), wide-angle reflection and refraction (WARR) and Tomography.
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Portable 3D Scanners
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Portable Scanners are the ideal option to quickly scan complex shapes and geometric data from objects large or small when you want to go anywhere and inspect anything.
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3D Measuring Laser Microscope
LEXT OLS5000
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The OLS5000 laser confocal microscope precisely measures shape and surface roughness at the submicron level. Data acquisition that's four times faster than our previous model delivers a significant boost to productivity. Measure samples that are up to 210 mm tall. Capture the shape of any surface. Total magnification: 54x - 17,280x
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High Precision 3D Metrology
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Ensure zero-defect quality in all product deliveries and boost customer satisfaction: ISRA’s precision metrology systems measure all object and surface properties down to the nanometer level while ensuring the shortest cycle times.
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Product
USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-03
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Handy Scan 3D
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The truly portable metrology-grade 3D scanners delivering highly accurate measurements.Truly portable and faster than everMetrology-grade accuracy and resolutionUser-friendly and easy to use
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Open eVision 3D Studio
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Ease the configuration and the setup of a laser triangulation scanner using the Coaxlink Quad 3D-LLESimplify the calibration procedureDisplay interactive Depth Maps, 3D Point Clouds and ZmapsFree of charge
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SPI Isolators
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SPI (Serial peripheral interface) is one of the most widely used interfaces between microcontrollers and peripheral ICs such as sensors, ADCs, DACs, shift registers, SRAM, and others. Analog Devices has your isolated SPI bus covered with our dedicated SPI digital isolators which support this synchronous, full duplex master-slave-based interface. Options include devices built with ADI's proven iCoupler® technology and offering a small footprint, simple design-in, fast speeds, and high data integrity, as well as integrated µModules which require no external components. Our SPI isolator solutions increase performance and reduce board space. This simple, compact solution is ideal for isolated SPI data requiring communication across different ground potentials or through large common mode transients often found in Industrial PLCs (programmable logic controllers) and Instrumentation and data acquisition systems.
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Sapphire 3D Microscope
WDI-2000
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The Sapphire 3D Microscope: HS-WDI-2000 was designed with high quality lighting parts and a good optical system design,can get a very clear image.with the digital camera,it can provide the image in time, widely used in LED,Solar,SEMI…
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Optical 3D Measuring Systems & Devices For Your Quality Assurance
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As a manufacturer of optical industrial metrology, we offer a broad portfolio of optical 3D measuring systems & devices to support companies in various industries with precise quality assurance in production. Based on Focus Variation technology, our measuring systems not only enable surface roughness measurement, but also the detection of micro-geometries, shapes and structures.
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3D Inline Solder Paste Inspection System
TROI 7700 SERIES
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Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
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3D Scanning Reverse Engineering Services
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Reverse engineering is oftentimes a catch-all term used for many design and engineering applications. But trust us, there is so much more to this category for the uses of our 3D scanners, portable CMMs and laser trackers. Also, reverse engineering tends to imply that the 3D scanning will be used solely for product design, when in fact it can be used to address many other engineering functions such as:
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Full 3D Inline Metrological & Imaging AOI
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Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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3D And 2D Visualization Software
3DViz
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The 3DViz software provides intuitive 2D and 3D visualization of high-definition sensor data. Software allows strain or temperature data from an ODiSI system to be visualized directly on a 3D CAD model or a 2D image.
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Areal Confocal 3D Measurement
µsurf
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The measuring system of the µsurf-product line enable automated 3D surface measurements of roughness, topography, layer thickness and volume. µsurf-measuring systems are available in different designs: from compact mobile systems and laboratory solutions up to multisensor setups on granite portal for use near production lines.
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3D Point Cloud Data Viewing, Cleaning, Editing, Leveling, and Alignment Software Package for BV5000 3D Data Processing
QuickStitch Powered by EIVA
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QuickStitch is an easy-to-use 3D point cloud data viewing, cleaning, editing, leveling and alignment software package designed specifically for BV5000 3D data processing. The intuitive controls and user interface allows operators to quickly learn cleaning and alignment techniques. QuickStitch provides customers a fast and simple way to produce clean and aligned data sets to their customers.
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SPI | AOI | AXI
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Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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3D Micro Coordinate Measurement Machine and Surface Roughness Measurement Device
InfiniteFocusSL
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With the InfiniteFocusSL you are able to measure form and roughness of your components with only one system. In addition, color images with high contrast and depth of focus are achieved. The robust frame and the intelligent illumination technology provide fast and high-resolution measurement in the laboratory and a production near environment. The measurement system is particularly attractive due to its cost effectiveness, measurement speed and usability. The long working distance in combination with the above average measurement field allows a wide range of applications. Measurements are achieved within seconds, and features, such as a coaxial laser for quick and easy focusing, enhance its usability.
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3D Printer Laboratory
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Trialon’s commitment to providing 3D printing services is second to none. Our facility is equipped with state-of-the-art 3D printers that create accurate plastic prototype and end user parts.
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3D Form Measurement
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Ensure that components function and can be fitted correctly with efficient form monitoring. ISRA’s 3D form measurement systems capture component geometries down to the nanometer level while ensuring the shortest cycle times.
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Automated 3D Scanner
HDI Compact
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The HDI Compact 3D scanning system eliminates the tedious work involved with manually scanning an object. Save time and get stunning results everytime. The HDI Compact is an automated 3D scanning solution. The rotary table automatically spins the object and stops at predetermined intervals. The scan head captures high resolution, accurate 3D scans of an object each time. Once the object spins a full 360 degrees, all the scans are then automatically cleaned up and merged together to create a full digital 3D model.
