Semi-conductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
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Product
Emulates Dallas Semiconductors DS89C420
FE-C420
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* Emulates Dallas Semiconductors DS89C420 * 16K Code Memory * Real-Time Emulation * Frequency up to fmax at 3V and 5V * ISP Support * MS-Windows Debugger For C And Assembler * Emulation Headers and Signal Testpoints * Target Board and Programmer Included * Serially Linked to IBM PC at 115Kbaud
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Product
Metrology Solutions for Semiconductors
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Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Product
Semiconductor Tester
5000E
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Current Ranges:Standard: 2.0nA – 50AUp to 100A with Mainframe ExtensionVoltage Ranges:Standard (anode): 10mV – 1000V2000V with 2kV Anode OptionStandard (gate): 10mv – 20V80V with 80V Gate Option
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Product
Semiconductor Packaging System
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Inspects the quality of finished cells by measuring the gap between the battery electrode laminate and aluminum can.
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Product
PXI 24 Channel High Voltage Multiplexer
40-320-101
Multiplexer Module
The 40-310/320 Range of High Voltage Switching Modules will hot switch up to 750V peak and cold switch up to 1000V peak in either general purpose relay (40-310) or multiplexer (40-320) configurations. These modules contain high-quality reed relays with switching ratings comfortably higher than the 40-310/320 specification. Applications for the 40-310/320 series modules include; circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing.
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Product
Millimeter-Wave Automated Accelerated Reliability Test Systems
nm-Wave AARTS System
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AARTS fully integrated, automated, turnkey system provides flexibility and accuracy in determining RF and DC performance degradation with aging to predict life expectancy for compound semiconductor devices. Our millimeter-wave Automated Accelerated Reliability Test Systems (AARTS) and fixture solutions are available in standard frequency ranges from 26.5 to 67 GHz.
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Product
Low Light USB Camera Board (Color)
See3CAM_CU30 - 3.4 MP
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See3CAM_CU30 is a 3.4 MP UVC-compliant Low Light USB camera board based on AR0330 sensor from ON Semiconductor®. This Low Light Board Camera is backward compatible with USB 2.0 and supports compressed MJPEG formats at frame rates equal to USB 3.0. This sensor enables a superior low light performance. It has a dedicated, high-performance Image Signal Processor chip (ISP) that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the MJPEG compressions.
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Product
PXI-5154, 1 GHz, 2 GS/s, 8-Bit, 256 MB/ch, PXI Oscilloscope
780319-03
Oscilloscope
1 GHz, 2 GS/s, 8-Bit, 256 MB/ch, PXI Oscilloscope—The PXI‑5154 is ideal for acquisition and characterization of fast, nanosecond-edge speeds. It is well-suited for automated test and data streaming applications in the consumer electronics, semiconductor, aerospace/defense, and life sciences industries. The PXI‑5154 also comes equipped with up to 256 MB of memory per channel to provide high, sustained sample rates over extended data capture windows. This digitizer, optimized for automated test, uses a high-throughput bus to lower test times, provides picosecond-level synchronization among modules, and integrates with the entire suite of NI hardware, so you can build and customize a complete mixed-signal or high‑channel‑count test system.
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Product
I2C Isolators
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Analog Devices’ family of isolated I2C isolators support a complete isolated I2C interface. This portfolio is based on our iCoupler® chip scale transformer technology. iCoupler is a magnetic isolation technology with functional, performance, size, and power consumption advantages compared to optocouplers. By integrating iCoupler channels with semiconductor circuitry, our technology enables a complete, isolated I2C interface with a small form factor. Our I2C isolators covers applications such as central office switching, networking, and power over Ethernet.
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Product
Copper Diffusion TestSystems
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Materials Development Corporation
MDC announces the addition of software and hardware for copper diffusion studies to its CSM/Win suite of semiconductor test systems and software. This new CSM/Win feature plays an important part in the development of processes and materials for the next advance in integrated circuit technology that employscopper as a conductor. Special Current-Voltage Bias-Temperature Stress (IV-BTS) software can measure the degradation of insulator quality due to copper diffusion.Multiple test sites can be stressed with a constant voltage while the current through each site is measured and recorded. The Current-Voltage Bias-Temperature Stress test supplements conventional MOS C-V measurements and Triangular Voltage Measurements (TVS) that are also employed in copper diffusion studies.
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Product
Advanced Packaging & TSV
FilmTek 2000M TSV
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Scientific Computing International
Advanced semiconductor packaging metrology system providing an unmatched combination of speed, accuracy, and precision for high-throughput measurements of resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, redistribution layer (RDL) and other packaging processes.
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Product
Telecom Optical Amplifiers
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Thorlabs' optical amplifiers for telecom applications are available as complete benchtop systems or as pigtailed butterfly packages. Our line of benchtop optical amplifiers includes a praseodymium-doped fluoride fiber amplifier (PDFA) and erbium-doped fiber amplifiers (EDFAs). Our optical amplifiers available in pigtailed butterfly packages include InP/InGaAsP or GaAs/InGaAs semiconductor optical amplifiers (BOAs or SOAs), and high-speed optical switches.
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Product
Dimensional Metrology
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Nova offers in-line optical integrated and stand-alone metrology platforms. The metrology product portfolio, combined with our modeling algorithm software, delivers unique measurement capabilities for the most advanced semiconductor technology nodes.
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Product
Power Amplifiers
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In this product category you find highly linear power amplifiers for digital and analog data transmission, power amplifiers for CW applications and for laboratory use, which stand out due to its liability, robustness and long-term availability and which are based on the semiconductor technologies which are actually available on the market.
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Product
Wide Bandgap Transistors
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The key for the next essential step towards a more energy-efficient world lies in the use of new materials, such as wide bandgap semiconductors (WBG) which allow for increased power efficiency, smaller size, lighter weight, lower system cost or all of these together. STMicroelectronics offers the broadest product and technology portfolio of silicon carbide (MOSFETs) and gallium-nitride-based (e-mode HEMT) devices, covering bare dies, discretes and modules belonging to the STPOWER family.
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Product
Semiconductor Functional Verification Tools
Trek5
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Breker’s solutions enable test reuse across simulation, emulation, prototyping and actual silicon, eliminating redundant effort across the development flow. The Breker “Trek” suite solves challenges across the functional verification process for large, complex semiconductors.
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Product
Power Supplies
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Excelitas Technologies designs and manufactures high-performance, custom-tailored power supplies and systems for leading OEMs in diverse markets including: Medical, Dental, Semiconductor, Industrial Manufacutring, Defense, Aerospace and Safety and Security. Our broad product portfolio, which leverages the latest advances in power conversion technology, is based on field-proven designs.
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Product
Transmission Line Pulse Testing
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Transmission Line Pulse testing, or TLP testing, is a method for semiconductor characterization of Electrostatic Discharge (ESD) protection structures. In the Transmission Line Pulse test, high current pulses are applied to the pin under test (PUT) at successively higher levels through a coaxial cable of specified length. The applied pulses are of a current amplitude and duration representative of the Human Body Model (HBM) event (or a Charged Device Model – CDM – event in the case of Very Fast TLP, or VF-TLP).
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Product
3.4 MP Autofocus Liquid Lens NVIDIA® Jetson TX2/TX1 Camera Board
E-CAM31_TX2
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e-CAM31_TX2 is a 3.4 Mega pixel 4-lane MIPI CSI-2 liquid lens Auto focus camera board for NVIDIA® Jetson TX2 developer kit and it is also compatible with NVIDIA® Jetson TX1 developer kit. This camera is based on 1/3 inch AR0330 CMOS Image sensor from ON Semiconductor® with 2.2 µm pixel and A-Pix™ technology and an integrated high performance image signal processor (ISP). This S-Mount (M12) liquid lens camera enables autofocus with no mechanical moving part like VCM (Voice Coil Motors) will increase the lifetime and has an ability to focus and refocus in a matter of milliseconds.
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Product
Steam Aging Test Chambers
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Dongguan Amade Instruments Technology Co., Ltd
Steam aging test chamber is a climatic test machine used to judge the products performance to resist extreme circumstance under high temperature, high humidity and high pressure during the transportation, storage and usage. The principle is very simple, water in the tank is heated turning into steam to form a simulated test environment under specified temperature and humidity. Specimens are placed into the drawers of machine to carry out test lasting for preselected time. It is applicable to electronic connectors, semiconductor IC, transistor, LCD, diodes, resistances etc.
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Product
RF Power Transistors
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A specialized semiconductor device designed to amplify or switch high-frequency (Radio Frequency) signals, enabling powerful wireless communication in everything from cell phones and Wi-Fi to radar and satellite systems by handling significant power levels at speeds from kilohertz to gigahertz.
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Product
PhotoMASK Services
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For years APPLIED IMAGE has been serving customers who work with semiconductors, displays, PCB, MEMS, along with college professors, researchers, and students with Photomask making solutions tailored specifically to each customer’s needs. Working with a dedicated sales engineer means that you will have all of your questions answered.
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Product
Multi-Surface Profiler
Tropel® FlatMaster® MSP
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The Tropel® FlatMaster® MSP (Multi-Surface Profiler) is a frequency stepping interferometer that provides fast and accurate metrology for semiconductor wafers up to 300mm in diameter. In seconds up to 3 million data points are collected with sub-micron accuracy enabling total thickness and flatness characterization over the entire surface.
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Product
RF & Microwave PXI Switch Modules
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These switching systems are used for design validation, reliability and production test including 5G, SD radios, S parameter testing for RF cables, antennas, radar and semiconductor verification.
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Product
Semiconductors
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Multiphysics Analysis Solutions for Chips and 3D IC Systems. Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
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Product
PXIe-4163, 24-Channel, ±24 V, 50 mA PXI Source Measure Unit
784483-01
Analog Input Module
PXIe, 24-Channel, ±24 V, 50 mA PXI Source Measure Unit—The PXIe-4163 is a high-density source measure unit (SMU). It features 4-quadrant operation with a current resolution of 100 pA and the ability to sample up to 100 kS/s. The module also offers the ability to maximize stability and measurement accuracy with SourceAdapt, which allows you to custom-tune the transient response to match the characteristics of any load. The PXI-4163 is ideal for a broad range of mixed-signal integrated circuits (ICs) in semiconductor production test.
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Product
5G Testing
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Teradyne test solutions are at the forefront of the 5G test era. Why? We work with the leading semiconductor manufacturers and provide optimized test coverage for the major wireless standards. From emerging millimeter wave devices to the traditional sub-6GHz, our test solutions are already leading the way.
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Product
PXI 12 Channel High Voltage Multiplexer
40-320-001
Multiplexer Module
The 40-310/320 Range of High Voltage Switching Modules will hot switch up to 750V peak and cold switch up to 1000V peak in either general purpose relay (40-310) or multiplexer (40-320) configurations. These modules contain high-quality reed relays with switching ratings comfortably higher than the 40-310/320 specification. Applications for the 40-310/320 series modules include; circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing.
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Product
Diamond-Like Carbon: High-Performance Coatings for Extreme Applications
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When durability matters, Diamond-Like Carbon (DLC) coatings deliver. Known for their hardness, low friction, and chemical resistance, DLC films are the go-to solution for protecting surfaces in high-stress environments: from precision mechanical parts to advanced semiconductor devices.
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Product
ALD Advantages
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Atomic Layer Deposition (ALD) stands out for one reason: control. The most significant advantages of thin film deposition via Atomic Later Deposition over other methods, are manifest in four distinct areas – film conformality, low temperature processing, stoichiometric control, and inherent film quality associated with the self-limiting, and self-assembled nature of the ALD mechanism ALD is exceptionally effective at coating surfaces that exhibit ultra high aspect ratio topographies, as well as surfaces requiring multilayer films with good quality interfaces technology. This thin-film process builds materials one atomic layer at a time, delivering unmatched uniformity and sub-nanometer precision, even on complex 3D structures. That level of accuracy makes ALD a critical technology for advanced semiconductor manufacturing, flexible electronics, and materials research.
