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Product
4-Ch 500 MHz A/D with DDC & 4-Ch 800 MHz D/A with DUC, Kintex UltraScale - 6UVPX
Model 58851
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Supports VITA-49.2 VITA Radio Transport standard- Four 500 MHz 12-bit A/Ds- Four multiband DDCs (digital downconverters)- Two DUC (digital upconverter)- Four 800 MHz 16-bit D/As- 10 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Optional 400 MHz 14-bit A/Ds- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
DDR1 SODIMM
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small-form-factor RAM module designed for laptops and compact systems from the early 2000s. It features a 200-pin connector, operates on 2.5 volts, and supports speeds up to 400 MHz (PC-3200). It is not compatible with modern DDR4 or DDR5 slots, offering significantly lower capacity and speed.
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Product
Industrial Fanless Mini PC (Dual 4K Media Player)
EMP-100 Series
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- Palm size and slim design (H: 28mm)- Intel® Celeron® N6210/J6412 processor- Support 2x HDMI output- Support 12V DC input- 1 x DDR4 SO-DIMM, up to 16GB- 1 x M.2 2280 Key M for optional storage device- 1 x M.2 2230 Key E for optional Wi-Fi/BT Module- 3 x USB 3.2 Gen.1 (Type-A)
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Product
Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor (Code name: Skylake/Kabylake)
IMB-M43H
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IMB-M43H is an ATX motherboard supporting the Desktop 6th/7th Generation Intel Core i7/i5/i3 Processors with Intel H110 Chipset, providing the most cost-competitive solution anywhere in embedded computing and fulfilling the specific needs of all users requiring 5 PCI add-on cards. With high-speed data transfer interfaces such as PCIe 3.0/2.0, USB 3.0, and SATA 6 Gb/s (SATA III), dual-channel DDR4 memory up to 32 GB in two DIMM slots for industrial automation applications, the ADLINK IMB-M43H carries significant competitive advantage in the market. This leading, rugged I/O design enhances user experience with robust device compatibility, durable connectivity, and extreme environment readiness.
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Product
Mini PC
DS-410
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Palm-sized mini PC designed for hospitality and signage applications. Stylish Aluminum Die-cast Design with Intel Atom® J6412 processor. Optimized GFX performace by on board 4GB/8GB DDR4 (3777Mhz). Support HDMI 2.0 up to 4K(3840 x 2160), and VGA up to Full HD.
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Product
8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW1
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, wide temperatures from -40° to 85°C.
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Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX
Model 5550
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- Now available in RFSoC Gen 3 with the Model 5553- Supports Xilinx® Zynq® UltraScale+™ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- 10 GigE Interface- 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 49, VITA 46, VITA 48, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8256 3U VPX SOSA Aligned Development Chassis- Model 6001 unique QuartzXM eXpress module enables migration to other form factors- Video: Model 8256 3U VPX SOSA Aligned Development ChassisPentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
Mini-ITX SBC With LGA1151 Socket 6th/7th Gen Intel® Core™ Processor, Intel® H110/Q170, HDMI/DisplayPort/VGA/LVDS/eDP, Dual LANs And USB 3.0
MANO500
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The MANO500 is based on the new 14nm 7th/6th generation Intel® Core™ i7/i5/i3 and Pentium® processors in the LGA1151 package. Featuring the new Intel® H110 Express chipset with DDR4 2133MHz memory support, this motherboard is built to perform. Its three SATA 6G ports, four USB 3.0 ports, and two RS-232/422/485 ports provide robust storage and I/O options. Users also can increase board functionality with PCIe x16 slot and PCI Express Mini Card slot. The high quality MANO500 allows the connection of up to four display interfaces via HDMI, VGA, DisplayPort, and LVDS/ Embedded DisplayPort (eDP), making it an ideal solution for gaming, workstation, digital signage, medical and other IoT&M2M applications.
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Product
Small-Size Integrated DIN-Rail IPC With Intel® Atom® X6413E And X6425RE
UNO-137 V2
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Intel® Atom® x6413E (1.5 GHz) and x6425RE (1.9GHz) processor with 8GB DDR4 memoryWide operating temperature range (-40 ~ 70 °C/-40 ~ 158 °F) and wide power input range (10 ~ 36 VDC)Port isolation for 8 x DI, 8 x DO, 2 x COMDP++ ensures HDMI/DVI compatibilityDual storage: 1 xM.2 M-key 2242 PCIe/NVMe or SATA/SSD and 1 x mSATAOnboard TPM 2.0 provides hardware-based securityModular design for optional iDoor extensionRuggedized DIN-rail kitCompliant with IEC 61010-1 safety requirements
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
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Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
Fanless Panel PC With Intel® Celeron® J6412 Processor
PPC-310 EHL
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Industrial-grade 10.4" XGA TFT LCD with 30K backlight lifetimeDurable true-flat touchscreen with 5-wire resistive/projected capacitive touch controlIntel® Celeron® J6412 quad-core, 2.0 GHz, processorUp to 32 GB DDR4 SDRAM1 x RS-232, 1 x RS-232/422/485, 2 x USB 2.0, and 2 x USB 3.1Compact, fanless design with solid aluminum alloy enclosure and IP66-rated front panelSupports E-key for wireless moduleSupports expansion via M.2 slotSupports Windows Embedded Linux and Android OS
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Product
2U Rackmount Network Appliance With Intel® Xeon® Processor Scalable Family, Up To 8 NMC Slots. Ideal For Data Center Deployments.
FWA-6170
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Dual 1st/2nd Gen Intel® Xeon® Scalable Processors, up to 28 Cores24 x DDR4 ECC RDIMM slots2x 2.5" disk bays, and system fan, redundant PSU, 2 x low profile Gen3 PCIe x8 slotIntel® QAT with up to 40G Crypto supportIPMI v2.0 compliant, with web interface8 x Advantech network module expansions w/ PCIe Gen3 bandwidth
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Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
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DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
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Product
Xilinx Zynq UltraScale+ SoM
TE0808-ZU9
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Sundance Multiprocessor Technology Ltd.
The Trenz Electronic TE0808 is an industrial-grade SoC module integrating a Xilinx Zynq UltraScale+, max. 4 GByte DDR4 SDRAM with 32-Bit width, max. 512 MByte Flash memory for configuration and operation, up to 256 MByte HyperFlash, 20 Gigabit transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O’s is provided via rugged high-speed stacking connections.
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Product
LGA 4189 Intel® 3rd Gen Xeon® Scalable ATX Server Board with 8x DDR4, 3x PCIe x16, 8x SATA 3, 6x USB 3.2 (Gen1), Dual 10GbE, and IPMI
ASMB-816
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- LGA4189 ATX server board with 3rd Gen. Xeon® Scalable processor- DDR4 3200 MHz RDIMM up to 512 GB (8 DIMMs) supports Intel® Optane™ Persistent Memory- Features 3x PCIe x16, 1x PCIe x8, 2x PCIe x4, and 1x PCIe x1- Intel® X550 dual 10GbE ports- Eight SATA 3 and one M.2 connectors (SATA/PCIe compatible)- 0 ~ 60 °C/ 32 ~ 140 °F ambient operating temperature range
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Product
2U 20" Short-Depth Server
HPC-6240+ASMB-622
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2U 20" short-depth server with dual 3rd Gen Intel® Xeon® CPUs, 1TB DDR4, and 8 PCIe slots. A powerhouse for edge AI, HPC, and virtualization.
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Product
LGA 1200 Intel® Xeon® W & 10th Gen.Core™ Proprietary Server Board with 4 x DDR4, 1 x PCIeX16, 2 x PCIeX4, 5 x USB 3.2, 3 x SATA 3, Quad LANs and IPMI
ASMB-610
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- Proprietary server board with LGA 1200 Intel® Xeon® W & 10th Gen. - Core™ i9/i7/i5/i3 processors- Compatible with HPC-61 series chassis- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 slot or two PCIe x8 slots support FH/10.5" Length Cards- Two PCIeX4 slots support low profile expansion cards- 3x SATA 3 ports and 5x USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Quad LAN with Intel I350- Flexible IO board design
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Product
6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
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- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
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Product
SOM Module
TEO820-ZU3EG
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Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784EZU3EG (optional ZU5EV) 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
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Product
8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-286EF
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Supports Intel® 8th/9th Gen Core™ i processor (LGA1151) with Intel H310 chipsetOne 260-pin SO-DIMM up to 32GB DDR4 2666 MHz SDRAMSupports PCIe x 16 (Gen 3), 1 M.2 B key, 1 M.2 E key, 2 COM, 4 USB 3.0 and 3 SATA IIISupports dual display of DP/HDMI/LVDS(or eDP)Supports TPM 1.2 / 2.0 (optional)THIN Mini-ITX with 12V DC InputSupport Windows10 LTSC, Ubuntu 20.04 LTS, SUSI API, and WISE-DeviceOn
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Product
Computer With 8th Gen. Intel® Core™ I5 Processor, Built-In 8G DDR4 RAM And UL Class 1 Division 2
TPC-318WH
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Industrial-grade 18.5" WXGA TFT LCD with 50K lifetime and LED backlight8th Gen. Intel® Core™ i5-8365UE quad-core processor with built-in 8 GB DDR4 SO-DIMMDual channel memory slots support up to 64G in totalCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionTrue-flat touchscreen with PCAP touch control and IP66-rated front panelSupport expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G)Support TPM2.0 hardware security
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Product
1-Ch 3.6 GHz or 2-Ch 1.8 GHz 12-bit A/D with DDC, Kintex UltraScale - XMC
Model 71841
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- One-channel mode with 3.6 GHz, 12-bit A/D- Two-channel mode with 1.8 GHz, 12-bit A/D- Programmable one- or two-channel DDC (Digital Downconverter)- 5 GB of DDR4 SDRAM- µSync clock/sync for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction-cooled versions available- Clock up to four modules with Model 7194 High-Speed Clock Generator - PMC/XMC- Synchronize up to four modules with Model 7192 System Synchronization and Distribution Amplifier - PMC/XMC- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Product
1U 18" Short-Depth Edge Server
HPC-6120+ASMB-610
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1U 18" short-depth edge server with Intel® Xeon® W CPU, 128GB DDR4, and 4 PCIe slots. Designed for reliable edge AI, automation, and data acquisition.
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Product
12.1" Panel PC With 8/9th Generation Intel® Core™ I/Celeron® Processor
PPC-6121
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12.1" TFT XGA LCD panel with resistive touch control8/9th generation Intel® Core™ i/Celeron® processor (thermal power design: 35W)2 x 260-pin SO-DIMM DDR4 2666 MHz (max. 32 GB)1 x M.2 2230 (E key)1 x mSATA bay (SATA SSD + mSATA support RAID 0&1)1 x Optional TPM2.0 & 1 x Optional PCI/PCIe x4 expansion kit1 x Isolated RS422/485 (terminal block)1 x VGA and 1 x HDMI
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Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
LGA 3647-P0 Intel® Xeon® Scalable ATX Server Board with 6 DDR4, 5 PCIe x8 or 2 PCIe x16 and 1 PCIe x8, 8 SATA3.0, 6 USB3.0, Dual 10GbE, IPMI
ASMB-815
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- ATX server board with Xeon® Scalable processors- DDR4 2933MHz RDIMM up to 768GB, support Intel Optane DC Persistent Memory- Five PCIe x8 or two PCIe x16 and 1 PCIe x8- Intel® X557-AT2 dual 10GbE ports- Eight SATA3.0 and one M.2 connectors (SATA / PCIe compatible)- 0 ~ 60 °C ambient operating temperature range
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Product
Analyzer Probes
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The following probes are available for the MA51x0 and MA41x0 series analyzers. These probes are designed for low-voltage and high-speed midbus probing or probing with an interposer. The following JEDEC memory standards are widely used by these probes: DDR5 (JESD79-5), DDR4 (JESD79-4), DDR3 (JESD79-3), LPDDR5 & LPDDR5X (JESD209-5), LPDDR4 & LPDDR4X (JESD209-4), and LPDDR3 (JESD209-3).
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Product
2U Rackmount Network Appliance With Dual 3rd Gen Intel® Xeon® Scalable Processors, Up To 8 NMC Slots. Ideal For Enterprise Network Security.
FWA-6171
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Dual 3rd Gen Intel® Xeon® Scalable Processors, up to 38 Cores32 x DDR4 ECC RDIMM slotsHot-swap 2.5" disk bays and system fan, redundant PSU, 1 x FH/HL Gen4 PCIe x16 slotRedundant BIOS and BMC imageIPMI v2.0 compliant, with web interface8 x Advantech network module expansions w/ PCIe Gen4 bandwidth
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Product
Multimedia Modular
DPX-M270
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Intel® 8th/9th Generation Core™-i7/i5/i3 CPUs 8,6,4,2 core. Two 260-pin SO-DIMM up to 32GB DDR4 2666 MHz SDRAM. Supports 3 display outputs (2x DP++, HDMI). PCIe x16 Gen 3.0 graphics card slot.
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Product
PCIe FPGA Carrier For FMC+, VU13P UltraScale+TM
PCI596
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The PCI596 is based on the Xilinx VU13P UltraScale+TM FPGA, which provides over 12,000 DSP slices, 360 Mb of UltraRAM and 3,780K logic cells. The FPGA interfaces directly to the FMC+ DP 0-31 and all FMC+ LA/HA/HB pairs, making it compatible with a wide range of industry standard VITA 57 and VITA 57.4 modules. It also has interface to DDR4 memory channels (1x 64-bit wide, 8 GB). This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host. PCI596 has x16 PCIe edge connector routed to the FPGA PCIe Gen4 hard IP block. In addition, 16 uncommitted connection pairs are routed to a dual x8 expansion connector, providing direct connectivity to a neighbouring FPGA (e.g. via Aurora, 10/40GbE, SRIO, PCIe) without the need to go through the host.
