-
Product
Intel® Core™ I Automation Computer With 2 PCI(E) Expansion Slots
UNO-3283G
-
6th Generation IntelR Quad Core Processors with 8GB DDR4 Memory2 x GbE, 6 x USB 3.0, 2 x RS-232/422/485, 2 x RS-232 (pin header), 1 x DVI-I, 1 x HDMI1 x PCIex16, 1x PCI, 2 x mPCIe (2 x full), 1x CFast slot, 1 x mSATA slot (optional)Thumb screw for easy maintenanceHot-Swappable HDD/SSD support for RAID 0/1Easily exchangeable RTC batterySupports Fieldbus Protocol by iDoor TechnologyChassis Grounding ProtectionLAN Redundancy (Teaming)
-
Product
Edge AI HPC System
AIR-500D
-
Edge AI HPC system powered by Intel® Xeon® D-1700 Series processors with support for up to 4 PCIe slots. Intel® Xeon® D-1700 series processor 4x DDR4 SO-DIMM sockets support ECC/nonECC memory up to 128GB.
-
Product
Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, DisplayPort++, VGA, EDP, USB 3.0, M.2 And Dual GbE LAN
MANO523
-
*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 processor*Intel® Q370 chipset*2 DDR4 SO-DIMM for up to 32GB of memory*4 USB 3.0 and 4 USB 2.0*6 COM ports*2 SATA-600 and 1 M.2 Key M*PCIe x16 and M.2 Key E
-
Product
12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-279
-
12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), Up to 24Core. Support Q670E/H610E chipsetDual channel DDR4 3200MHz, max. 64GB with two SODIMMsSuper Speed I/O: PCIe x16 Gen4 (16GT/s), USB3.2 Gen2 (10Gbps), 2.5GbEQuad independent 4K displays with 2 DP1.4, 1 HDMI, and 1 LVDSRich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 2 SATA12-24V DCin Power InputWindows 10 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOn
-
Product
Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 and Xeon E3-1200 v5/v6 Processors
IMB-M43-C236
-
The IMB-M43-C236 is ADLINK's ATX industrial motherboard, supporting the 6th/7th Generation Intel Core and Xeon E3-1200 v5/v6 processor in the LGA1151 package, and the Intel C236 Express chipset, the IMB-M43-C236 supports such high-speed data transfer interfaces as PCIe3.0, USB 3.0 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133/2400 MHz ECC or non-ECC memory up to 64 GB in four DIMM slots.
-
Product
32G DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-D4U32N32-SBW
-
DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
-
Product
ATCA Rugged Blade Processor With Dual Xeon Cascade Lake-SP, 100G Ethernet
ATC129
-
The ATC129 is a high performance ATCA processor blade featuring dual 24 core Intel® Xeon® processors, each with six banks of memory providing up to a total of 384 GB DDR4 memory with ECC.
-
Product
Intel Atom® X6000E Series, Pentium®, Celeron® N And J Series Processor
AIMB-218
-
Supports Intel Pentium/Celeron processor (Elkhart Lake), N6210/N6211/J6412/J6413/J6426/x6413ETwo 260-pin SO-DIMM up to 32 GB DDR4 3200 MT/s SO-DIMMSupports, DP++ , HDMI, eDP(or LVDS)Supports 1x M.2 (B-Key) and 1x M.2 E-Key (or 1x PCIe x1 Gen3 ), 6 COM, 3 USB 3.2 Gen2x1 & 5 USB 2.0, dual LANLower total cost of ownership with DC12V support and onboard TPM2.0 (option) & Amplifier (option)Support SUSI, Ubuntu20.4, WISE-DeviceOn and Edge AI Suite
-
Product
DDR Detective Logic Analyzer
DDR4
-
NOW supports 3DS at 3200MT/s!Provides logic analyzer like deep transaction Listing and Waveform capture. Continuous Capture for Violations and Performance metrics NOT a fill memory and then post process like other tools. This is a FuturePlus ONLY feature!
-
Product
21.5" Fanless Panel PC With Intel® Celeron® J6412 Processor
PPC-321W EHL
-
Industrial-grade 21.5" Full HD TFT LCD with 50K backlight lifetimeDurable true-flat touchscreen with projected capacitive touch controlIntel® Celeron® J6412 quad-core, 2.0 GHz, processorUp to 32 GB DDR4 SDRAM1 x RS-232, 1 x RS-232/422/485, 2 x USB 2.0, and 2 x USB 3.1Compact, fanless design with solid aluminum alloy enclosure and IP66-rated front panelSupports E-key for wireless moduleSupports expansion via M.2 slotSupports Windows Embedded Linux and Android OS
-
Product
High Core Density 2U Network Appliance With Security And Acceleration Features Ready. Ideal For Network Security And Crypto Acceleration Workloads.
FWA-6080
-
Single AMD EPYC™ 7003 Processors, up to 64 Cores16 x DDR4 ECC RDIMM slotsHot-swap 2.5" disk bays and system fan, redundant PSU, 2 x HH/HL Gen4 PCIe x16 slotIntegrated security features with secure boot, memory encryption, and virtualizationIPMI v2.0 compliant, with web interface8 x Advantech network module expansions w/ PCIe Gen4 bandwidth
-
Product
8-Channel 250 MHz A/D with DDC, Kintex UltraScale FPGA - XMC
Model 71131
-
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Powerful Xilinx Kintex UltraScale FPGAs- Eight 250 MHz 16-bit A/Ds- Eight multiband DDCs (digital downconverters)- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction cooled versions available
-
Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
-
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
-
Product
2U Rackmount Network Appliance Platform With Dual LGA2011 Socket Intel® Xeon® E5-2600 V3/v4 Family Processors, Intel® C612 And Up To 42 LAN
NA850
-
The NA850 offers cutting edge performance for networking applications with dual high performance 12-core Intel® Xeon® E5-2600 V3 series processors and Intel® C612 chipset, 16 high bandwidth DDR4 memory slots and two hot swappable 3.5” SATA HDD bays. For greater flexible and easy maintenance, the NA850 can be fitted with up to five Ethernet modules, supporting up to 42 Gigabit LAN ports or 20 10GbE LAN ports. Two PCIe x16 standard expansion slots are available for optional network security cards. The superior network appliance platform also supports the Intel® Data Plane Development Kit (Intel® DPDK), a set of software libraries that can improve packet processing performance by up to ten times. It could achieve over 80 Mbps on a single Intel Xeon processor and double with a dual-processor configuration. With its friendly design and high capacity, this powerful network appliance is suited for IDS/IPS, VPN, content filtering, UTM, network security applications, and cloud computing solutions.
-
Product
7th Gen Intel Core Mobile Processors, I7, I5, I3 3.5" SBC W/ MIOe
MIO-5391
-
7th Gen Intel Core i7/i5/i3 + PCH QM175Dual channel DDR4 2400, Max 32GB (ECC optional)1 Intel i210 GbE & 1 Intel i219 GbE support iAMT, rich I/O: 2COM, SATA, USB3.0, SMBus/I2C,16 bit GPIO full-size Mini PCIe or mSATA /M.2 E Key support NVME, 12V Power inputFull-size Mini PCIe or mSATA /M.2 E KeySupport NVME (optional)Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
-
Product
COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
-
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
-
Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 Processor - SFF Subsystem
Model 6353S
-
- Complete RF converter and processing subsystem- Rugged and conduction-cooled- Ideal for integration into custom enclosures- Incorporates Xilinx® Zynq® UltraScale+™ Gen 3 RFSoC- 16 GB of DDR4 SDRAM- Navigator® BSP for software development- Navigator® FDK for custom IP development- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Please refer to the product datasheet for Installed FPGA IP Module details
-
Product
16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
-
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
-
Product
32GB SO-DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-SD4U32GN32-SB
-
32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
-
Product
3-Ch 200 MHz A/D with DDC & 2-Ch 800 MHz D/A with DUC, Kintex UltraScale - XMC
Model 71821
-
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Exceptional dynamic range and analog signal integrity- Xilinx® Kintex® UltraScale" FPGA- Three 200 MHz 16-bit A/Ds- Three multiband DDCs (digital downconverters)- One DUC (digital upconverter)- Two 800 MHz 16-bit D/As- 5 GB of 2400 MHz DDR4 SDRAM- Programmable frequency synthesized sample clock generator- Sample clock synchronization to an external system reference- Powerful DMA controllers for moving data- PCI Express (Gen. 1, 2 & 3) interface up to x8- Multi-channel synchronization with clock/sync bus- Optional clock/sync generator for multi-board systems- Optional LVDS port for custom FPGA I/O- Optional gigabit serial links for custom FPGA I/O- Ruggedized and conduction-cooled versions available- Navigator® BSP for software development- Navigator® FDK for custom IP development- SPARK® fully-integrated development system- Free lifetime applications support- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
-
Product
17" SXGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-317
-
Industrial-grade 17" SXGA TFT LCD with 50K lifetime and LED backlight.8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMM.Dual channel memory slots support up to 64G in total.Compact, fanless embedded system with aluminum alloy front bezel and chassis grounding protection.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Support expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G).Diverse system I/O and isolated digital I/O via iDoor technology.Support fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technology.Support TPM2.0 hardware security.
-
Product
L-Band RF Tuner and 2-Channel 400 MHz A/D with Kintex UltraScale FPGA - XMC
Model 71891
-
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Accepts RF signals from 925 MHz to 2175 MHz- Programmable LNA handles L-Band input signal levels from -50 dBm to + 10 dBm- Programmable analog downconverter provides IF or I+Q baseband signals at frequencies up to 123 MHz- Two 400 MHz 12-bit A/Ds digitize IF or I+Q signals synchronously- Two FPGA-based multiband DDCs (digital downconverters)- Xilinx® Kintex® UltraScale™ FPGA- Five GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- PCI Express interface (Gen. 1, 2 & 3) up to x8- Clock/sync bus for multimodule synchronization- Optional LVDS and gigabit serial connections for FPGA for custom I/O- Navigator BSP® for software development- Navigator FDK® for custom IP development- Free lifetime applications support- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
-
Product
16G SO-DDR4-3200 1GX8 1.2V SAM -20~85℃
AQD-SD4U16GN32-SE1
-
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
-
Product
ATCA PCIe Rugged Processor With Dual Xeon E5-26xx V4
ATC127
-
The ATC127 is a high performance ATCA processor blade featuring dual 14-core Intel® Xeon® processor (E5-2658 v4, E5-2680 v4, E5-2648L, 2618L, 2620 or 2630 v4), with eight banks of memory up to 256 GB DDR4 memory. Versatile connectivity includes two PCIe Gen3 x16 Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress Ports, front panel dual RS-232 and USB 3.0/2.0 Ports and front panel DVI-I connector. Onboard mSATA storage is available for local boot.
-
Product
System on Module Microsemi PolarFire
SoM3-MPF300T
-
Sundance Multiprocessor Technology Ltd.
The SoM3-MPF300T is a small footprint System On Module (SoM) with 40x50mm dimensions. It has a low power, highly secure FPGA from the PolarFire family from Microsemi. It comes with 4GB of DDR4 memory, Ethernet PHY, and FLASH. This SoM is ideal for being used in complex hardware designs, and is compatible with Sundance SoM carriers SE215 and EMC2-DP-V2.
-
Product
9th Gen Intel® Xeon®, Core™ i7/i5/i3-Based Compact Industrial GPU Workstation
DLAP-8000 Series
-
- 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset- Dual SODIMMs for up to 64GB DDR4 / ECC options*- Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0- Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280- Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM- Front accessible I/O and adaptive Function Module v.2 option- Flexible and powerful PCIe expansions via backplane
-
Product
[Yocto/Android] 7" Touch Panel Computer With ARM Cortex™-A53 Processor
TPC-107W
-
arm SystemReady IR certifiedNXP® ARM® Cortex™-A53 i.MX 8M Mini quad-core processor7" 16:9 LCD with multi-touch P-CAP and true-flat IP66-rated front panelUp to 4 GB DDR4 RAM and 16 GB eMMC storage onboard2 x 10/100/1000 Mbps LANs with optional IEEE 802.3at/af PoE-PD module support1 mb FRAM backup memory for unexpected power interruptions2 x Serial port with 120Ω termination resistor that one supports the CAN 2.0B protocol and offers a programmable bit rate of up to 1 Mb/secEmbedded browser and for rapid Web App developmentSupports Linux Yocto and Android
-
Product
JadeFX Kintex UltraScale Processor and FMC Carrier - 3U VPX
Model 5983
-
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family BrochureVITA-57.4 HSFC FMC+ site offers access to a wide range of possible I/O- Supports Xilinx Kintex UltraScale FPGAs- 9 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- User-configurable gigabit serial interface- LVDS connections to the Kintex UltraScale FPGA for custom I/O- Optional optical interface for backplane gigabit serial interboard communication- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-66.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available
-
Product
8G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U8GN32-SEW
-
DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
-
Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
-
Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
