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Product
6-Ch 200 MHz A/D with DDC & 4-Ch 800 MHz D/A with DUC, Kintex UltraScale - 6UVPX
Model 58821
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Six 200 MHz 16-bit A/Ds- Six multiband DDCs (digital downconverters)- Two DUC (digital upconverter)- Four 800 MHz 16-bit D/As- 10 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
PXI Express Embedded Controller
PXIe3110
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The PXIe3110 is the most compact andpowerful 3U one-slot embedded controller forthe PXI Express and CPCIexp platform. With itshuge and future-ready interface capabilities,it runs perfectly with most test and measurementapplications.The Controller is driven by a 7th generationIntel® Core™ processor combined with up to32 GB DDR4 memory and easily supports highbandwidth applications with its PCIe Gen3system and storage interconnectivity.
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Product
DDR4 X4/x8 BGA Interposer For Logic Analyzer, Connects To 61-pin ZIF
W4643A
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The W4643A DDR4 2-wing BGA interposer for DDR4 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W4643A is the smallest BGA interposers for DDR4 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
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Product
PICMG® 1.3 Full-Size 6th generation Intel® Core™ i7/i5/i3 LGA1151 Processor-based SHB (Code name: Skylake)
NuPRO-E43
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The ADLINK PICMG 1.3 SHB, the NuPRO-E43, supporting the 6th Gen IntelR Core i7/i5/i3 processor and equipped with the IntelR Q170 Express chipset. The NuPRO-E43 supports high-speed transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133 MHz memory up to 32 GB.
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Product
1-Ch 3.6 GHz or 2-Ch 1.8 GHz 12-bit A/D with DDC, Kintex UltraScale - 3U VPX
Model 52841
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- One-channel mode with 3.6 GHz, 12-bit A/D- Two-channel mode with 1.8 GHz, 12-bit A/D- Programmable one- or two-channel DDC (Digital Downconverter)- 5 GB of DDR4 SDRAM- µSync clock/sync for multiboard synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Product
Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-4000 Series
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- NVIDIA® Quadro® PEG card support- 8th/9th Gen Intel® Core™ i7/i5/i3 processor- Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)- 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards- 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module- 300W/500W Flex ATX PSU
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Product
DDR4 Registered DIMM
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a type of computer RAM that features a register (or buffer) between the memory chips and the system memory controller. This register stabilizes the electrical load, allowing servers and workstations to utilize higher memory capacities and improve overall stability compared to unbuffered RAM (UDIMM).
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Product
1-Ch. 6.4 GHz or 2-Ch. 3.2 GHz A/D, 2-Ch 6.4 GHz D/A Kintex UltraScale - 3U VPX
Model 52141
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Supports VITA-49.2 VITA Radio Transport standard- One-channel mode with 6.4 GHz, 12-bit A/D- Two-channel mode with 3.2 GHz, 12-bit A/D- Programmable DDCs (Digital Downconverters)- Two 6.4 GHz, 14-bit D/As- Programmable DUCs (Digital Upconverters)- 5 GB of DDR4 SDRAM- µSync clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x4- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Product
System on Module Microsemi PolarFire
SoM3-MPF300T
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Sundance Multiprocessor Technology Ltd.
The SoM3-MPF300T is a small footprint System On Module (SoM) with 40x50mm dimensions. It has a low power, highly secure FPGA from the PolarFire family from Microsemi. It comes with 4GB of DDR4 memory, Ethernet PHY, and FLASH. This SoM is ideal for being used in complex hardware designs, and is compatible with Sundance SoM carriers SE215 and EMC2-DP-V2.
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Product
LGA 4094 AMD® EPYC™ 7003 ATX Server Board with 8x DDR4, 5x PCIe 4.0 x16 + 2x PCIe 4.0 x8, 9x SATA 3, 5x USB 3.0, Dual 10GbE, and IPMI
ASMB-830
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- LGA 4094 (Socket SP3) ATX server board with AMD EPYC™ 7003 processor- DDR4 3200 MHz RDIMM up to 128GB per DIMM- Features 5x PCIe 4.0 x16, 2x PCIe 4.0 x8- Intel® X550 dual 10GbE ports- Eight (via SFF-8643 connector) + one SATA 3 and two M.2 connectors (SATA/PCIe 4.0 compatible)- 0 ~ 60 °C/ 32 ~ 140 °F ambient operating temperature range
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Product
16GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U16GN32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
VPX SBC
SBC3511 3U
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The SBC3511 is based on the new, highly integrated Intel® Xeon® E-2276ME 6-core/12-thread processor ('Coffee Lake Refresh') which operates at 2.8 GHz with TurboBoost up to 4.5 GHz, 64 GB of DDR4 RAM and the inclusion of up to 256GB of NVMe SSD, providing increased platform performance and throughput.
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Product
JadeFX Kintex UltraScale Processor and FMC Carrier - 3U VPX
Model 5983
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family BrochureVITA-57.4 HSFC FMC+ site offers access to a wide range of possible I/O- Supports Xilinx Kintex UltraScale FPGAs- 9 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- User-configurable gigabit serial interface- LVDS connections to the Kintex UltraScale FPGA for custom I/O- Optional optical interface for backplane gigabit serial interboard communication- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-66.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available
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Product
COM-HPC Server Type Development Kit based on Ampere® Altra® SoC
Ampere Altra Dev Kit
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Ampere Altra Dev Kit consists of a COM-HPC Server Base carrier paired with a COM-HPC Server Type Size E module and heatsink with fan. The module features Ampere® Altra® SoC (Arm Neoverse N1-based architecture) harnessing 32/64/96/128 Arm v8.2 64-bit cores for up to 1.7/2.2/2.8/2.6 GHz and providing support for up to 768GB DDR4 memory, offering unprecedented performance and power per watt with exceptional scalability.
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Product
Intel Coffee Lake Platform To Support Intel® 9th & 8th Gen Core™ I Processor With One Low-Profile PCIe Expansion Slot
EPC-B2276
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Supports Intel® 9th & 8th Gen Core™ i processor (LGA1151) with Intel Q370.Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM.Supports triple display of 2x DP/HDMI.One low-profile PCIe expansion slot.Reserved 2 USB, 2 COM, punchouts on front panel.Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
11th Gen Intel® Core™ I5-Based Fanless Embedded Computer
EMP-510 Series
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- 11th Gen Intel® Core™ i5 BGA SoC processor- DDR4 SODIMM up to 64GB- FHD/4K/8K up to 4x independent displays- 2x GbE, 1x COM, 4x USB ports- M.2 2280 SSD- Wi-Fi 6/LTE compatibility
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Product
Analyzer Probes
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The following probes are available for the MA51x0 and MA41x0 series analyzers. These probes are designed for low-voltage and high-speed midbus probing or probing with an interposer. The following JEDEC memory standards are widely used by these probes: DDR5 (JESD79-5), DDR4 (JESD79-4), DDR3 (JESD79-3), LPDDR5 & LPDDR5X (JESD209-5), LPDDR4 & LPDDR4X (JESD209-4), and LPDDR3 (JESD209-3).
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Product
2U 20" Short-Depth Server
HPC-6240+ASMB-622
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2U 20" short-depth server with dual 3rd Gen Intel® Xeon® CPUs, 1TB DDR4, and 8 PCIe slots. A powerhouse for edge AI, HPC, and virtualization.
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Product
LGA 1200 Intel® Xeon® W & 10th Gen.Core™ Proprietary Server Board with 4 x DDR4, 1 x PCIeX16, 2 x PCIeX4, 5 x USB 3.2, 3 x SATA 3, Quad LANs and IPMI
ASMB-610
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- Proprietary server board with LGA 1200 Intel® Xeon® W & 10th Gen. - Core™ i9/i7/i5/i3 processors- Compatible with HPC-61 series chassis- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 slot or two PCIe x8 slots support FH/10.5" Length Cards- Two PCIeX4 slots support low profile expansion cards- 3x SATA 3 ports and 5x USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Quad LAN with Intel I350- Flexible IO board design
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Product
SOM Module
TEO820-ZU4EV
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Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784EZU4, 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)
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Product
Industrial Mini-ITX Motherboard With Intel® N97 Processor
AmITX-ALN
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- Intel Alder Lake N SoC processors, N97- Single channel DDR4 3200 MHz memory up to 32 GB- Triple independent display: HDMI 2.0b, DP 1.4a (from Type C), VGA, LVDS or eDP- Dual GbE ports: 2x 2.5GbE- Expansion slots: 1x PCIe Gen3 x1, 1x USB 3.2 Gen2 Type C, 4x USB 3.2 Gen1, 6x USB 2.0, 1x M.2 B-key, 1x M.2 E-key, 1x M.2 M-key- 12 to 28V DC-in
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Product
Micron 8G DDR4 3200 288PIN 1GbX8 REG 1.2V
96D4-8G3200ER-MI
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DDR4-3200 Registered ECC DIMM, 1.2V power consumption, Supports ECC error detection and correction. Data bus inversion (DBI) for data bus, Low-power auto self refresh (LPASR).
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Product
Virtex UltraScale+ 3U VPX Plug-In Module
iW-RainboW-G47V®
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AMD Xilinx’s VU13P, VU11P, VU9P, VU7P, VU5P Virtex Ultrascale+ FPGADual 64 bit, 4GB FPGA-DDR4 with ECC (Upgradable)31 channels of FPGA GTY transceivers up to 32.75Gbps1Dual ARM Cortex-A7 core processor of 1.2GHz speed32bit 2GB DDR4 for CPU with ECC128MB QSPI Flash & 256MB NOR Flash3U VPX Connector (P0+P1A & P1B+P2A)8 Optical transceivers through MT Ferrule Connector (P2B)
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Product
Dual LGA3647-P0 Intel® Xeon® Scalable EATX Server Board with 24 DDR4, 5 PCIe x16 + 1 PCIe x8, 10 SATA3.0, 6 USB3.0, Dual 10GbE, IPMI
ASMB-935
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- EATX server board with dual Xeon Scalable processors- DDR4 2933 MHz RDIMM up to 3TB, support Intel Optane DC Persistent Memory- Five PCIe x16 (Gen3) and one PCIe x8 (Gen3) for three double-deck cards- Intel® X557-AT2 dual 10GbE ports- Ten SATA3.0 and six USB3.0 ports- One M.2 2280 (SATA / PCIe compatible)- 0 ~ 40 °C ambient operating temperature range
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Product
LGA 3647-P0 Intel® Xeon® Scalable ATX Server Board with 6 DDR4, 5 PCIe x8 or 2 PCIe x16 and 1 PCIe x8, 8 SATA3.0, 6 USB3.0, Dual 10GbE, IPMI
ASMB-815
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- ATX server board with Xeon® Scalable processors- DDR4 2933MHz RDIMM up to 768GB, support Intel Optane DC Persistent Memory- Five PCIe x8 or two PCIe x16 and 1 PCIe x8- Intel® X557-AT2 dual 10GbE ports- Eight SATA3.0 and one M.2 connectors (SATA / PCIe compatible)- 0 ~ 60 °C ambient operating temperature range
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Product
Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3002
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- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additional Molex 4 pin power cable (12V/1.5A and 5V/2A) support- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Product
COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
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ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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Product
COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
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ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Small-Size Integrated DIN-Rail IPC With Intel® Atom® X6413E And X6425RE
UNO-137 V2
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Intel® Atom® x6413E (1.5 GHz) and x6425RE (1.9GHz) processor with 8GB DDR4 memoryWide operating temperature range (-40 ~ 70 °C/-40 ~ 158 °F) and wide power input range (10 ~ 36 VDC)Port isolation for 8 x DI, 8 x DO, 2 x COMDP++ ensures HDMI/DVI compatibilityDual storage: 1 xM.2 M-key 2242 PCIe/NVMe or SATA/SSD and 1 x mSATAOnboard TPM 2.0 provides hardware-based securityModular design for optional iDoor extensionRuggedized DIN-rail kitCompliant with IEC 61010-1 safety requirements
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Product
1U Rackmount Network Appliance With Intel® Xeon® Processor D Family For VE-CPE And Network Applications, 2 NMC Slots
FWA-3260
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Intel® Xeon D-1500 Processors, up to 16 Cores with 2 x 10G MAC4 x DDR4 ECC RDIMM slots4 x 1GbE RJ-45, 2 x 10GbE SFP+ slots with 2 pairs of LAN bypass1 x PCIe x8 slot on rear, supports FH/HL add-on cardsIPMI v2.0 compliant BMC2 x Advantech network module expansions2 x internal 2.5" SATA HDDs/SSDs
