Metrology
field of measurement.
See Also: Measurement, Instrumentation, Coordinate Measuring Machines
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Metrology
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Optical critical dimension (OCD) metrology and film metrology require accuracy and repeatability. Onto Innovation's techniques are well-established and trusted by semiconductor manufacturers around the globe.
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Benchtop Metrology System
FilmTek 2000 SE
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Scientific Computing International
Benchtop metrology system delivering unmatched measurement performance, versatility, and speed for unpatterned thin to thick film applications. Ideally suited for academic and R&D settings. Combines spectroscopic rotating compensator ellipsometry, multi-angle polarized spectroscopic reflection, and intuitive material modeling software to make even the most demanding of measurement tasks simple and reliable.
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Particle Metrology System
Archimedes
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Archimedes is an innovative instrument which uses the technique of resonant mass measurement to detect and accurately size and count particles in the size range 50nm to 5um*. Archimedes can distinguish different species from their buoyant mass is particularly useful when characterizing proteinaceous aggregates from contaminating silicon oil in biopharmaceutical preparations, in distinguishing bubbles from lipid micelles and contaminants in ultrasound contrast agents or protein from fat in dairy products.
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Metrology Device
XPLOR 100
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XPLOR 100 is a state of the art, fully automated metrology device designed for measurement and analysis of bubbles and inclusions for optical substrates in the Visible and NIR wave-bands.
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Linear Metrology System
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The ZeroTouch® Linear Metrology System is a high-speed, non-contact linear inspection system ideal for measuring linear-shaped parts such as hip stems and aerospace blades faster than traditional methods.
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3D Metrology Solutions
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SHINING 3D owns multiple core technologies in the field of 3D machine vision based 3D inspection, bringing a variety of independent research and development equipment including laser handheld 3D scanner, blue-light high-precision 3D scanner for inspection system, intelligent robot automatic 3D inspection system, wireless optical portable CMM system and etc.
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Dimensional Metrology Systems
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We are a global provider of optical industrial measurement technology for quality assurance of complex components with tight tolerances. With Bruker Alicona measurement systems, users measure dimension, position, shape, and roughness by using only one optical sensor. Measurement systems are applied in both research and directly on the shop floor.
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Scatterometers/ Thin Film Metrology Systems
LittleFoot Series
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The n&k LittleFoot-CD, and LittleFoot-CD450 are DUV-Vis-NIR scatterometers/thin film metrology systems, based on polarized reflectance measurements (Rs and Rp) from 190nm to 1000nm, with microspot technology. The systems in the LittleFoot-CD Series determine thickness, n and k spectra from 190nm-1000nm of thin films, as well as depths, CDs, and profiles of trenches and contact holes.
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In-Situ Metrology Etch
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In-situ metrology systems are attached to deposition systems on one or several viewports for monitoring the progression of the etch dept during the process in real time. No matter if the required stop depth lies within a layer or at an interface.
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Metrology Training Services
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As a leading provider of precision measurement equipment we are experts at training new equipment customer on how to get the best out of the equipment and training in the accompanying software functionality. Training can take place at an API facility or your location. Customers will required to pass a competency test and will subsequently receive a certificate of training completion.
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Thermal Warpage Metrology Tool
AXP 2.0
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The TherMoiré® AXP 2.0 is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré® AXP 2.0 captures a complete history of a sample’s behavior during a user-defined thermal profile.
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Warpage Metrology System
TableTop Shadow Moiré (TTSM)
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Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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Metrology & Inspection Systems
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Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Optical Metrology
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Complex measurements can be performed quickly and easily with optical measuring solutions from ZEISS. With a high degree of automation and state-of-the-art sensors, they reduce operating errors and guarantee high measuring accuracy.
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Scatterometers / Thin film Metrology Systems
Olympian Series
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DUV-Vis-IR (Wavelength Range: 190nm – 15,000nm) Scatterometers / Thin Film Metrology Systems: The n&k Olympian, n&k Olympian-450 and n&k Olympian-M are DUV-Vis-IR scatterometers/thin film metrology systems with micro-spot technology, covering the wavelength range from 190nm – 15,000nm. With the inclusion of the infra-red wavelength range, the Olympian Series extends the capabilities of n&k’s DUV-Vis-NIR scatterometer series – the OptiPrime-CD Series.
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Metrology Software
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ZYGO has been developing metrology software for decades – our commitment to helping our customers measure confidently, and the heart of our quality guarantee. Our original instrument software, MetroPro, established itself as a gold standard in the optical metrology world. Now, its successor Mx continues that legacy: trusted, easy to use, and heavily customizable.
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Photovoltaic/Solar Metrology System
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Multi-channel thickness, TTV and bow measurement module for in-process monitoring of solar/photovoltaic wafers and other materials.
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Materials Metrology
VeraFlex Family
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World-class XPS and XRF metrology technologies for semiconductor process control.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
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Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Optical Thin-Film Metrology for Advanced Thin Films
FilmTek 6000 PAR-SE
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Scientific Computing International
Production-proven metrology system for film thickness, refractive index and stress measurement for a broad range of film layers at the 1x nm design node and beyond. Accommodates 200 or 300 mm wafer metrology. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to meet the challenging demands associated with multi-patterning and other leading-edge device fabrication techniques.
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Gear Metrology System
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The Gear Metrology System is a non-contact gear inspection system that generates a 3D point cloud, providing manufacturers with real-time metrology and inspection data to optimize production processes, and improve ROI.
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Digital Readouts & Metrology Tools
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HEIDENHAIN digital readouts have universal applications. In addition to standard tasks on milling, drilling and boring machines and lathes, they also can be used with machine tools, measuring and testing equipment, and special machines in fact, they can be used with any machine where axis slides are traversed manually.
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Advanced Metrology System
NGS 3500L
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This top performance system is designed for applications where high-speed defect detection and precision measurements on wafers and other parts are required. It is well suited for use as a dedicated production tool or as a versatile processdevelopment system. It features a powerful set of automated as well as semi-automatic optical/ video tools optimized for high accuracy, production throughput, and ease of use.
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Metrology
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KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
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Semiconductor Metrology Systems
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MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Compact General-Purpose Metrology System
Benchmark 250
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The Benchmark 250 is a compact general-purpose metrology system with all the features and capabilities of the larger VIEW Micro-Metrology models. With travel of 300 x 150 x 150 mm, the Benchmark can accommodate a wide range of part sizes, and is rugged enough to be located in either a Q/A lab or an inspection station on the production floor.
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Metrology
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SV TCL also has the capability to emulate the testing environment with our probe card analyzers including newly installed direct dock analyzers in the United States, Taiwan and Vietnam. SV TCL is dedicated to continuous product improvement so that we can provide our customers the latest and most innovative test solutions.
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Rotational Metrology System
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The ZeroTouch® Rotational Metrology System is a precise, high-speed, in-line or near-line metrology, and inspection system that measures critical dimensions of rotors, stators, brake discs, and other cylindrical parts, providing manufacturers with real-time metrology, and inspection data to optimize production processes, detect defects, and improve ROI.
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Manual Semiconductor Metrology System
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Front USB port enables easy storage of measurements and other data to flash drivesMTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and DependabilityNon-contact measurements76-300 mm diameter wafer rangeOptional wafer measurement ringsWafer stops for exact centeringEthernet interfaceFull remote control software (Windows compatible)Optional calibration wafers
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Materials Metrology
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Nova is a market leader for innovative thin film metrology and process control technologies. We develop highly sensitive in-line metrology solutions on high productivity platforms, thereby enabling critical metrology solutions to be closer to a semiconductor fab’s process and integration needs.Our technologies enable customers to accurately detect and quantify small variations in film composition and thickness, thereby influencing better device functionality, and improved manufacturing yield.
