IC
circuitry in a chip.
See Also: Integrated Circuit, Chip, Digital IC Testers, IC Test, IC Clips, IC Probes
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Product
Brushless DC Drivers (BLDC)
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Covering a wide range of power systems, our integrated MOSFET and gate driver ICs thrive in automotive, industrial, and consumer applications, ranging from 3.5 to 100 V operating voltage.
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Product
SparkFun Serial Basic Breakout
CH340G
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The SparkFun Serial Basic Breakout is an easy-to-use USB-to-Serial adapter based on the CH340G IC from WCH. It works with 5V and 3.3V systems and should auto install on most operating systems without the need for additional drivers. The Serial Basic uses the CH340G IC to quickly and easily convert serial signals to USB. It’s a great lower-cost alternative to the extremely popular FTDI Basic.
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Product
IP Reuse
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IC Manage Global Design Platform (GDP & GDP-XL) includes an open platform for maximizing IP reuse. Design and verification teams can use the system to rapidly publish and integrate IP into existing flows, and to trace bug dependencies. Internal and third party IP can be imported or linked with IP Central from multiple commercial and open source design management systems, as well as internal revision control systems. ”
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Product
Micro probes 1 MHz up to 6 GHz
MFA 01 set
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The micro probes are used to measure magnetic fields and they have a high resolution. They measure magnetic fields up to 6 GHz, e.g. at signal conductors (150µm), SMD components (0603-0201) or IC pins. The MFA micro probes are guided by hand. An amplifier stage is integrated into the probe head. The amplifier stage (9V, 100mA) is powered via the Bias tee BT 706. It has an impedance of 50 Ohm. The micro probes are connected via the Bias tee BT 706 to a spectrum analyzer or an oscilloscope. Langer EMV-Technik GmbH includes correction lines in the delivery. With the help of the correction lines the probe output voltage is converted either into the respective magnetic field or to the current which is running through the conductor.
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Product
Advanced Multimeter
7117
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Peaceful Thriving Enterprise Co Ltd
This is a low power consumption, high accuracy and stable hand held 6000 counts multi-meter; with special designed IC to support true RMS measurement. It performs measurements of DC voltage/current, true RMS AC voltage/current, resistance, capacitance, frequency, diode, continuity, temperature and non-contact voltage sensing.
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Product
Video Signal Distributor
MSHD-02
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MSHD-02 distribute inputted component signal to the two (2) output channels via RCA connectors without diminuation & distortion. It takes High Bandwidth Video Distributor IC which is support the highest component resolution up to 1920X1080P & Dot Clock 148.5MHz.
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Product
Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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Product
Motor Driver ICs
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The ST product portfolio offers a wide range of motor control ICs, well-suited for the most demanding automotive environments, covering the requirements of brushed DC motors, stepper motors and brushless DC motors, over an extensive range of voltage and current ratings. Efficiency and accuracy of our motor drivers are guaranteed by a unique combination of low-loss PowerMOS output stages and advanced control circuitry. Robustness and reliability are provided by the integration of a comprehensive set of protection and diagnostic features.
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Product
Stepper Motor Drivers
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ST's portfolio of STSPIN stepper motor drivers spans from relatively simple ICs with current control and phase generation to more complex solutions.
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Product
OX 775 WDM Node
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Sharp Vision WDM Node accepts output for Pon EDFA with 3 wavelengths. They separate 1550nm (CATV) into RF output. PON output (1310/1490nm) is provided.- Double IC – 4 Output- Sensitivity : - 12 dBm- AGC : - 8dBm to + 2dBm- Output Level : 106 dB- Frequency : 40 ~ 900 MHz
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Product
Standard-Res Spectroradiometer
FieldSpec 4 Standard-Res
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Analytical Spectral Devices, Inc.
The FieldSpec 4 Standard-Res portable spectroradiometer is the right choice for a wide range of remote sensing applications, including multispectral sensor ground truthing and calibration, agricultural analysis, and snow and ice studies. In addition to being a world class spectroradiometer, the FieldSpec 4 Standard-Res is equally suited to serve as a rugged, portable spectrometer for accurate contact reflectance
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Product
Circbord
8003
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VECTOR Electronics and Technology, Inc.
Pad per hole & peripheral ground plane.0.085” Square pads etched around each hole on wiring side.Accommodates any type DIP IC device or discrete component.Single sided board with pads and peripheral GND plane on one side only.Single-sided with no etch and plating on reverse side.
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Product
Thermal Cycling Test Equipment
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Wewon Environmental Chambers Co, Ltd.
IC welding to PCB, IC is integrated in the chip general purpose circuit, it is a whole. Once the inside is damaged, the chip will be damaged. The goal of printed circuit boards (pcbs) is to connect IC and discrete components to form a larger working circuit. Thermal cycling equipment can detect the defects and hidden dangers of welding components in the production process, decreasing failure rate. When it fails, components can be replaced in timehttps://www.wewontech.com/thermal-cycling-test-equipment/
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Product
MPI Automated Probe Systems
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MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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Product
Mezzanine System
5235
System
The 5235 ECM provides 16 bits of simple digital I/O. The digital I/O is connected directly to the digital I/O on the carrier card. Inputs are clamped to about 3V by FET buffer ICs, and are 5V tolerant.
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Product
AMIDA 3001XP Tester
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AMIDA has introduced two new analog/mixed-signal and logic options in the AMIDA-3000 series in recent years—the AMIDA-3001XP and AMIDA-3KS test systems. Both reinforce the AMIDA-3000 series' ability to provide cost-optimized test solutions for a variety of consumer components in power management and mobile device components. The AMIDA-3000 series provides more than twice the number of analog channels of its modules per test system, thus greatly reducing the acquisition cost of each channel and more than doubling the number of analog channels in the entire test system. This results in a higher number of parallel tests and a higher level of capability for this system, as well as a lower and more cost-effective IC unit test cost for this tester. This series of test systems provides a powerful test combination with high-speed hardware and software integration. The built-in instant messaging protocol detection function of AMIDA-3001XP test machine not only simplifies the complexity and difficulty of test development, but also greatly shortens the test time by using its high-speed computing capability.
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Product
Emulation & Test Interface
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Solder down modules to suit any package type provides a cost effective solution for replacement test heads, male or female. The mating top modules can incorporate either a ZIF or standard IC socket and the addition of optional test pins if required from RS Components.
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Product
LVDT Sensor Amplifiers
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Analog Devices signal conditioning ICs, together with linear variable differential transformers (LVDTs), can be used to convert mechanical position to a dc voltage. The IC provides both the excitation for the LVDT and the output conversion to dc level with a user selectable gain. ADI LVDT signal conditioners are available to interface with a wide range of LVDTs, including half bridge and standard 4- and 5-wire.
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Product
Amplifiers And Linear ICs
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For the simplest to the most complex designs, our extensive portfolio of amplifiers and comparators enables you to develop low-risk solutions with minimal risk of a forced redesign. These devices are also backed by our client-driven obsolescence practice of continuing to supply a product for as long as possible and while demand for the product exists.
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Product
Automated Programmer Superpro Sb05
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※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job※ Compact sizeHigh throughput：4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices. Prog. Time (S) 50 60 120 180 240 300 UPH (unit per hours) 1600 1600 840 560 420 336 Accurate positioning：Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.High performance programmers： 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 100,000 devices from over 300 IC manufacturers and growing.Varied I/O devices：Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.Short change-over time：I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.Powerful and intelligent software：Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.Remote Control：Remote project loading, quality monitoring, volume control, file security.
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Product
Sensirion SHT31-DIS-B Humidity and Temperature Sensor Breakout Board
SEN-37002-F
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Breakout board for the Sensirion SHT31-DIS-F with a built-in permeable membrane filter. This sensor is an extremely accurate digital (I2C interface) temperature and humidity sensing device, with +/-0.2C temperature and +/-2% humidity accuracy typical. These specs far exceed the accuracy of ICs that came before it, including the HTU2x and SHT1x series, and improves upon the success of the SHT2x that came before it. In addition, the SHT31-DIS-B has a wide input voltage range of 2.4V-5.5V and includes temperature isolation and airflow cutouts as recommended for the optimal operation. Finally, in the case of environmental changes that could cause light condensation, the SHT31-DIS-B has a built-in heater to burn off any condensate.
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Product
Demonstration Board
SAMPULSE20x2
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The SAMPULSE20x2 is a demonstration board for the Furaxa SiGe3 30GHz sampler/pulser IC. The SIGe3 IC is a dual channel sampler pulser chip, and the SAMPULSE20x2 demonstration board contains two 2.4mm combined TDR input/output connectors, one to each sampler/pulser channel in the IC. The SiGe3 IC's two sampler outputs are then sent to to two SMA jacks, the first outputting the sample taken on the rising edge of the sampler clock, and the second containing the sample taken on the falling edge of the sampler clock. The sampler clock input, which must be a square wave, may be set to any frequency from 5MHz to 1GHz, causing the board take two pairs of samples (one on each clock edge) at rates from 5 million to 1 billion per second. A pulser clock input, which may be set to any frequency from 5MHz to 2GHz, and MUST be a square wave (preferably differential) with rise time under 100pS, causes the board to produce concurrent pulses on both of the SiGe3's I/O pins, which produce near-concurrent pulses at the two 2.4mm sampler/pulser TDR input/output connectors.
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Product
Lightning Sensor Breakout
SEN-39001
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Breakout board for the AS3935 digital lightning sensor based on the AMS reference design. Includes specially tuned antenna, SPI or I2C interfacing, and a wide 2.4V to 5.5V standard operating range. This innovative sensor is designed to interface with most current development systems and boards, including all current Arduino modules. The breakout board features an inductor (antenna) specially designed for this application, and the board ships fully calibrated. This ensures that you don't have to write a massive back-end to support low-level IC calibration, just focus on your final application!
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Product
ICs For Wireless Charging System
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The feature of power receiving and charge/discharge system IC RAA457100 is integrated all functions needed for a wireless chargeing, rectification, charging control for small Lithium-Ion battery and top level of power-efficiency DC-DC converter in a singl chip as 3.22mm x 2.77mm small package.
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Product
IceMap™
Real Time Ice Thickness Measurement
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The IceMap real-time display shows the automatically detected bottom of the ice (blue line) in real time. Users can set a minimum thickness warning threshold (gold line). Winter ice roads and bridges are a common transportation link in the northern regions of Canada, Alaska, Europe and Russia. The Sensors & Software IceMap system is designed to measure the ice thickness on these temporary, yet vital, links and ensure the safety of all travelers. The GPR sensor is towed across the ice surface behind a truck or snowmobile and the ice thickness data, displayed in real-time as a cross-sectional image, are sent wirelessly to the operator’s computer.
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Product
Entry-Level Wi-Fi 7 Key E Solution Based On QCC2072
AIW-172BQ
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Commercial-grade temperature range (0~70°C)Compatible with Qualcomm AloT PlatformsMulti-Link Single Radio (MLSR) supportGlobal Certifications (FCC,CE,IC, TELEC, NCC, RCM, KCC, ANATEL)
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Product
Transceivers
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ST offers monolithic ICs containing standard ISO 9141 compatible interface functions and bidirectional transceivers for signal conditioning that operate with a CAN controller and meet ISO/DIS 11898 up to 1 Mbaud.
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Product
Immunity
ESD coupling
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is used for conducted coupling of Langer ESD pulses (200ps rise time) into ICs.
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Product
10M/100M/1G Ethernet Network Emulator
VirtualNetTM GE
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VirtualNet-1G is a high-performance Network Emulator that replicates real world Ethernet network effects such as latency and errors on user traffic in a controlled environment. The VirtualNet-1G emulator uses customized ICs to support full line rate performance at all frame sizes and impairment settings. The emulator can be transparently installed in-line as shown in the diagram below. VirtualNet-1G emulator has an intuitive and easy to use GUI interface and a very powerful TCL based CLI to aid in configuration and testing.
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Product
Passive Probe, 20:1, 500 MHz, 1.3 M
N2875A
Oscilloscope Probe
A compact 2.5-mm probe head diameter, low input capacitance, and various fine-pitch probe tip accessories make the N2870A Series ideal for probing densely populated IC components or surface-mount devices used in today’s high-speed digital applications.
