IC
circuitry in a chip.
See Also: Integrated Circuit, Chip, Digital IC Testers, IC Test, IC Clips, IC Probes
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RF & Wireless Test Solutions
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Adivic/Chroma Group has been in the development of RF & WIreless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Toyota, Mitsubishi, Honda, Hyundai, Daewoo...etc., most of the global IC design houses with DTV chips such as Broadcom, Marvell, MTK...etc., and also defense entities around the world.
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Dip Clip, 14 Pin With Nickel Silver Contacts
5114
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Pomona DIP Clip? test clips are designed fortesting dual-in-line IC packages on PC boards. Thesedevices incorporate many built-in features that assurea positive electrical connection as well as hands freetesting.
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Product
Si1145 UV / Ambient Light / Proximity Sensor
SEN-36002
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SEN-36002 is a highly integrated carrier board designed for the Si1145 UV, Ambient Light and Proximity sensor IC from Silicon Labs. This sensor has 100mLUX resolution, and has a dynamic range of 1 LUX to 128 kLUX with IR correction. This means that whether your application is indoors in poor lighting conditions or outside in full sunlight, this sensor has you covered. In addition, we added a high power LED (150mA max, 20 degree) to take full advantage of the proximity sensing capability of this IC - something you won't see on most competitive carrier boards. Integration is easy with 4 x 4-40 sized mounting holes at the corners of the PCB and signal translation to handle interface voltages from 3V to 5V. The board is interfaced via an I2C interface and function pins have been broken out to a 0.1" pin header. The INT pin is also broken out for interrupt capability.
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Tri-Temp Octal Sites Handler
3160-C
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Chroma 3160-C is a productive pick & place system for high volume multi-site IC testing.
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Product
Steering Diodes
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ProTek's low capacitance Steering Diode Arrays provide high-speed data line and I/O port protection from transients caused by Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), Tertiary Lightning and other induced voltages. Steering diodes divert the transient to the power-bus or ground and away from sensitive IC components.
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Product
Direct Digital Synthesis (DDS)
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Analog Devices’ world leading direct digital synthesis ICs incorporate features such as on-board comparators, RAM, PLLs, mixers, and registers. This makes them an ideal agile frequency synthesizer solution in systems for communications, test equipment, and radar.
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Product
Power ICs - Smart Load Switches
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Combining multiple functions in a single IC, Vishay smart load switches eliminate the need for external circuitry . A simplified GPIO interface allows for power distribution and sequencing of multiple sub-systems. Slew-rate-control devices provide a controlled supply ramp to reduce inrush current, while fault protection and isolation switches increase robustness with reverse current, overtemperature, current limiting, and short circuit protection features. The ICs offer quick output discharge and small footprints, while their integrated design saves PCB space compared to discrete solutions, reduces BOM counts, and lowers manufacturing costs.
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Power ICs - MicroBRICK® - DC/DC Regulator Module
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Design fast, run cool with microBRICK, the smallest DC/DC regulator on the market
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Product
Digital Multi-Meter
7124A
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Peaceful Thriving Enterprise Co Ltd
This is a low power consumption, high accuracy, and stable hand held 3 1/2digits (2000 counts) multimeter; with special designed IC to support true RMS measurement. It performs measurements of DC voltage / current, true RMS AC voltage / current, resistance, diode, continuity, and non-contact voltage sensing.
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Product
K-Band Silicon SATCOM Rx Quad Core IC
AWS-0102
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The AWS-0102 is a highly integrated silicon quad core IC intended for satellite communications applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain with a noise figure of 3.4 dB. Additional features include gain compensation over temperature and temperature reporting. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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Product
MAX31855 J-Type Thermocouple Sensor Breakout
SEN-30001-J
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Breakout board for the MAX31855J digital thermocouple interface IC. Measured temperature range is -210C-1200C with known thermal characteristics and output resolution of 0.25C. This sensor supports a larger operating range (specifically in the negative range) than its predecessors, the MAX6674 and MAX6675, though it is not pin-pin compatible. This board is interfaced with a 0.1" 1x5 pin header, has a vertical mini thermocouple connector and four mounting holes for standoffs and 4-40 screws.
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Product
Automatic System Function Tester
3260
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Chroma 3620 is an innovative system handler for high-volume multi-site IC testing at the system level.
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Product
68-Pin PLCC with Die Flipped-to-68-Pin PGA for 87C196 IC and Others
68-304538-10
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68P PLCC WITH DIE FLIPPED TO 68 PGA FOR 87C196 IC AND OTHERS. Correct-A-Chip technology solves problems associated with the use of alternative ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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MAX31855 J-Type Thermocouple Arduino Shield
SEN-30004-J47
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Four channel MAX31855 digital thermocouple Arduino Shield. Two versions of this shield are avaliable for each thermocouple type: either 'Ch 0-3' (CS pins use Uno/Mega IO pins 7-10) or 'Ch 4-7' (CS pins use Uno/Mega IO pins 3-6), with the only difference being which set of zero-ohm resistors are populated on the board. This allows use of other SPI devices that may be 'hard coded' to specific digital pins on the Arduino, or simply stacking one of each type together to get a total of eight thermocouple channels on one Arduino. The MAX31855J supports a measured temperature range of -210C-1200C with known thermal characteristics and output resolution of 0.25C. Included thermocouple connectors are type-specific to provide proper material continuity as close to the IC as possible. The SEN-30004 is interfaced via 3 or 4-wire SPI and a high-speed level shifter is included to allow the board to plug directly into an Arduino Uno or Mega
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Product
DUAL-IN-LINE (DIL/DIP) SERIES 97 - 98
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Pickering’s dual-in-line (DIP/DIL) reed relays are through-hole electronic components that enclose two parallel rows of connection pins on the standard DIL spacing with switching capability up to 2 Amps, 50 Watts. The reed relays come with 5, 12 or 24 V coils with or without internal diode. Many standard build options are available on request, or we can fully customise the parts to suit your exact specifications.It is often possible to replace TTL ICs with their equivalent CMOS ones and replace standard DIL relays with Pickering Series 98, to obtain the benefits of CMOS without any circuit or PCB redesign.
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Low Power RF Transceivers
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Analog Devices provides a wide range of low power RF transceivers covering sub-GHz and 2.4 GHz frequency bands. Drawing on over 40 years of experience designing high performance RF ICs, the ADF7xxx family of transceivers delivers industry-leading RF performance combined with ultralow power consumption. Our latest transceivers incorporate configurable packet handling capability for proprietary and industry standard protocols to address emerging Internet of Things requirements. As faster time to market grows in importance, evaluation platforms such as the latest ADF7xxxMB4Z will be critical to kickstarting software development.
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ICs For Factory Automation (R-IN)
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The advancement of Industry 4.0 and the Industrial Internet of Things (IIoT) brings with it a growing need to boost factory productivity. The use of Ethernet-based networks in factories is becoming more widespread, as deterministic, safe communications across all levels of the factory are more critical than ever. Renesas has a comprehensive portfolio of products to support Industrial Ethernet solutions leading to increased factory productivity and reduced production cost.
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Product
Molded Interconnect Subtrate
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A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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LOAD BOARD
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The semiconductor manufacturing process is divided into a front process (WAFER) and a post process (PACKAGE). The LOAD BOARD is an INTERFACE device for inspecting the function and performance of a package state IC, which is a post process, It is an INTERFACE key device for inspection. In particular, LOAD BOARD is widely used in non-memory semiconductor inspection equipment.
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10M/100M/1G Ethernet Network Emulator
VirtualNetTM GE
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VirtualNet-1G is a high-performance Network Emulator that replicates real world Ethernet network effects such as latency and errors on user traffic in a controlled environment. The VirtualNet-1G emulator uses customized ICs to support full line rate performance at all frame sizes and impairment settings. The emulator can be transparently installed in-line as shown in the diagram below. VirtualNet-1G emulator has an intuitive and easy to use GUI interface and a very powerful TCL based CLI to aid in configuration and testing.
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Product
OBD Development Kit
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The OBD Development Kit is a modular development system designed to speed up the development of devices that interface with the OBD bus. It consists of the Interconnect Board, three removable modules (Power, OBD Drivers, and STN OBD IC), and an OBD cable.
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Product
Test System
LPDDR4 and LPDDR3
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Testing LPDDR4, LPDDR3 devices is made fast and simple with the "Lower Power" LPDDR4/3 TCE-3200LP IC test system. It can be configured up to 32 sites in parallel and integrated with the customer's selected handler.The TCIII-3200LP system can be used as a production tool as well as an engineering tool. To assist manufacturers and integrators, TurboCATS has developed a heat chamber that can be integrated with the TCE-3200LP, LPDDR4 and LPDDR3 test system. This allows the devices to be tested while being exposed to heat conditions.
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Environmental Testing
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D.L.S. Electronic Systems, Inc
D.L.S. Conformity Assessment provides testing services for environmental tests under its accredited ANAB/ACLASS ISO 17025 program. This globally accepted accreditation covers environmental and mechanical testing that include vibration and shock, temperature extremes , sand and dust, fluid and chemical resistance, altitude, humidity, salt spray, ingress protection, icing, flammability and other related testing services.
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Humidity And Temperature PROfilers
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RPG's profiling radiometers are mainly used to derive vertical profiles of atmospheric temperature and humidity (RPG-HATPRO). The infrared radiometer extension allows to cloud base height and ice cloud detection.The radiometer series covers high-resolution temperature profiling of the boundary layer and low-humidity applications. All models of the series provide accurate total amounts of atmospheric water vapor and cloud liquid cloud. RPG radiometers are stand-alone systems for automated weather-station use under nearly all environmental conditions. A variety of retrieval algorithms (custom designed and global standard algorithms) can be selected.
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Automotive Products
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Renesas has invested in key technologies to address the current mega trends within the automotive market such as environment, safety, information, and affordability. This effort has resulted in leadership positions in high-performance power conversions, state-of-the-art precision analog, cell balancing and battery charging ICs, power-efficient Class D audio amplifiers, and highly flexible TFT display controllers.
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OBD Chips
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STNxxxx OBD-II to UART Interpreter ICs are developed by our in-house engineering team at OBD Solutions. STNxxxx chips combine ELM327 compatibility with advanced hardware at an unbeatable price. We utilize STN11xx technology in all of our OBDLink scan tools.
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Passive Probe, 10:1, 1.5 GHz, 1.3 M
N2874A
Oscilloscope Probe
A compact 2.5-mm probe head diameter, low input capacitance, and fine-pitch probe tip accessories make the N2870A Series ideal for probing densely populated IC components or surface-mount devices used in today’s high-speed digital applications.
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Resets And Voltage Detectors
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ST’s reset and voltage detector ICs provide basic voltage monitoring (low-voltage detect POR-LVD function) and reset timing for power-on resets. These devices offer:
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End-of-Line IC & MEMS Tester
igentic® 841t
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Integrated circuit (IC) and micro electro-mechanical system (MEMS) device manufacturers need to address the challenges of today's global market including increased functionality, speed and complexity while delivering components at reduced costs. Sterner Automation's igentic® 841t automated test systems meet these demanding requirements by providing a flexible platform for comprehensive end-of-line IC and MEMS device handling, testing, grading and packaging. The resulting improvements in quality assurance and process efficiency will maximize customer satisfaction and profitability.
