Image Processors
algorithmically enhances image characterization.
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Product
ToF Image Sensors
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The ability to measure objects at a distance to determine how far away they are and/or their overall dimensions is becoming more popular in Imaging. With this, there are several different techniques and technologies, each with their own advantages and disadvantages. Picking the right one can be daunting without someone in your corner to help decipher your needs and direct you to the best product to meet them.
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Product
Universal Network Appliance With Intel® Atom™ Processor C3000 For VE-CPE And SD-WAN. Ideal For SD-WAN Deployments.
FWA-1012VC
Network Appliance
Intel® Atom® C3000, up to 8 Cores, with Intel® QuickAssist Technology2 x DDR4 DIMM slots, up to 64GB2 x 1GbE SFP + 6 x RJ-45 slots4G LTE and Wi-Fi supported (optional)Reserve 1 x SATA3.0 SSD/ M.2 3042 LTE module and 1x Mini-PCIe for Wi-Fi module (optional)2 x PoE supported (optional)
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Product
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
Computer on Module
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Product
SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
Computer on Module
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Product
Intel® Smart Display Module Large (Intel® SDM-L) With 8th Gen Intel® Core™ I7/i5/i3 Processor, HDMI And LAN
SDM500L
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The SDM500L is powered by the onboard 8th generation Intel® Core™ i7/i5/i3 processor with the Intel® Generation 9 HD Graphics chipset. The Intel® Smart Display Module-Large (Intel® SDM-L) measures just 175 x 100 mm and a maximum z-height of 1.6 mm, which is well-suited for ultra-slim displays. It can be easily connected to an SDM-compliant display via a high-speed PCIe x8 edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 2.0, DisplayPort 1.2, Serial TX/RX and I2C signals. With its excellent graphics performance and installation flexibility, the incredible signage module can satisfy diverse industry requirements and support a wide range of digital signage applications such as bedside terminals for hospital patients or factory automation solutions.
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Product
Intel® Smart Display Module Small (Intel® SDM-S) With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
SDM300S
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The SDM300S is a signage computer module following the newest Intel® Smart Display Module Small (Intel® SDM-S) architecture. The SDM300S is powered by the onboard Intel® Pentium® processor N4200 and Celeron® processor N3350 (code name: Apollo Lake) with the Intel® HD Graphics 505 or 500 chipset. The sleekest all-in-one display module measures only 100 x 60mm (roughly the size of a credit card), which makes for a thinner display. The SDM300S can be easily connected to an SDM-compliant display via a high-speed PCIe edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 1.4, DisplayPort 1.2, Serial TX/RX and I2C signals. Nearly a third the size of Open Pluggable Specification (OPS), the design of the SDM300S omits housing so it is well suited for space-constricting applications.
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Product
3D Imaging Sensor
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The GS 3D sensors, can be used in applications such as bin picking, robotic manipulation, sorting products, mold clearance checking, and space monitoring and object recognition. In addition, the 3D technology will aid in determining spatial positions and measurements.The GS 3D images larger objects at longer distances and does so in milliseconds without the cycle time and motion required by scanning-based methods.
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Product
Real-time Chemical Imaging System
AZtecLive & Ultim Max
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AZtecLive is a revolutionary new approach to EDS analysis that enables a radical change in the way users perform sample investigation in the SEM. It combines a live electron image with live X-ray chemical imaging to give an intuitive new way of interacting with your samples. 100 mm2 and 170 mm2 sensor areas. Quantitative analysis at 400,000 cps. EDS mapping at >1,000,000 cps.
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Product
Multispectra, Multifiber, Multichannel Imaging spectrometer with 8-16-32 Simultaneous UV-NIR Spectra
PoliSpectra® M116 MultiTrack Spectrometer
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HORIBA designs and manufactures a large range of custom OEM fiber-coupled, multi-spectra spectrometers capable of simultaneous measurement of up to 32 fiber channels and sequential measurement up to 96. Utilizing a concentric imaging spectrometer with a broadband spectral range and a customized fiber bundle, the HORIBA OEM multifiber spectrometers provide excellent imaging quality with minimum crosstalk.
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Product
Cavium CN66xx Packet Processor AMC
AMC732
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The AMC732 is a 10-Gigabit Ethernet (10GbE) AdvancedMC™ (AMC) module which includes an on-board multi-core packet processor based on Cavium CN66XX CPU. VadaTech offers this product in a mid size (full size optional) form factor with the AMC.1, AMC.2 and AMC.4 specification. The AMC732 is based around the Cavium OCTEON CN66xx processor which has been specifically designed to intelligently process Ethernet packets at line rate. The processor can be loaded via the PCIe/SRIO interface or via an optional flash memory. The number of processor cores, speed grade, and amount of DDR3 memory is customizable based on customer needs.The module has an RTC on board and 2GB of HFA for pattern matching for deep packet inspection, etc. The SDK for the processor as well as additional software stacks are available from Cavium or third party. The AMC732 has Serial Over LAN (SOL) with a true hardware Random Number Generator.
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Product
Micro-ATX Motherboard 8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-506
Motherboard
Supports Intel® 8th/9th Gen Core i7/i5/i3 processor with H310 chipsetSupports up to 14 COM, 8 USB 3.0, 12 USB 2.0, TPM 1.2/2.0 (optional)Supports Dual display of VGA, DP, DVI, eDP, LVDS (optional) and two GbE LANTwo DIMM sockets support up to 64 GB DDR4 2666 MHz SDRAMSupports WISE PaaS/Device-On, McAfee, Acronis, Edge AI Suite and Embedded Software APIs
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Product
Extreme Rugged PC/104-Plus, PCI-104 Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM3-BT4
Single Board Computer
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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Product
2-slot Fanless Industrial System With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, Front-access I/O, PCIe And PCI Slots
IPC932-230-FL
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The IPC932-230-FL is an expandable fanless barebone system with various front-facing I/O connectors. The powerful embedded system IPC932-230-FL supports LGA1150 socket for the 4th generation Intel® Core™ processors coupled with the Intel® Q87 Express chipset. Two 204-pin SO-DIMM sockets support up to 16 GB DDR3-1333/1600 system memory in maximum. To fulfill different application needs, the compact industrial PC provides two flexible PCI/PCIe expansion slots with two different combinations: one PCIe x1 and one PCIe x4 or one PCIe x4 and one PCI. Its DVI-I output on the front panel allows user to directly connect to a LCD panel and four COM ports and a DIO are provided for general industrial control. This all-in-one barebone system also has two easy-to-install 2.5 SATA HDD drive bays with RAID 0/1, and supports Intel® Active Management Technology 9.0 (AMT 9.0) to enhance overall device manageability.
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Product
Digital Image Correlation (DIC) Measurement System
EduDIC
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EduDIC is a complete Digital Image Correlation (DIC) measurement system, designed as a simple and convenient educational training tool for academic courses in experimental solid mechanics. This easy-to-use system allows academic instructors to effectively present the optical measurement technique of DIC for materials testing to the engineers and scientists of tomorrow.
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Product
Compact 3U CPCI Processor Board
CP32110
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LinkedHope Intelligent Technologies Co.,Ltd.
Based on Intel® Atom™ x5/x7 E3900 series (Apollo Lake-I), Pentium® N4200 and Celeron® N3350 CPU, CP32110 is a compact 3U CPCI single board computer compliant with CompactPCI® specification.On CP32110, there is a Mini SATA interface for system software installation, and several peripheral interfaces include SATAII, USB2.0 and Giga bit Ethernet.
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Product
High Speed PCI Data Acquisition Processors
DAP 5400a
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The DAP 5400a model, a board optimized for simultaneous sampling at extreme speeds, has eight A/D converters that sample simultaneously with 14-bit resolution at 1.25M samples per second each, for a total throughput of 10M samples per second. Or for higher speeds per channel, each board can sample each of 4 channels at 2M samples per second.
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Product
Remote Manageable 1U Network Appliance For UCPE/SD-WAN And NGFW Base On Intel® Xeon D-2100 Series Processor. Ideal For SD-WAN Deployments.
FWA-3050
Network Appliance
Intel® Xeon D-2100 Series Processors, up to 16 Cores with Optional 100G QAT4 x DDR4 ECC RDIMM slots8 x 1GbE RJ-45, 4 x 10GbE SFP+ slots with 2 pairs of LAN bypassIntel® QAT with up to 100G crypto supportIPMI v2.0 compliant BMC1 x Advantech network module expansions2 x internal 2.5" SATA HDDs/SSDs
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Product
3.5" Embedded SBC With LGA1151 Socket For 7th/6th Gen Intel® Core™ I7/i5/i3 Processor, LVDS, VGA, HDMI, 2 GbE LANs And Audio
CAPA500
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The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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Product
RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, LAN, DIO (2-in/2-out), 4 AI Channels (16-bit, 250 KS/s) And 2 PCIe Mini Card Slots
IRU152
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The IRU152 is powered by the low-power NXP i.MX 6 UltraLite processer. It can withstand an extended operating temperature range of -40°C to +70°C and up to 2G of vibration for operating in harsh environments. Furthermore, it supports NI LabVIEW to allow users to design graphical user interfaces for their measurement applications quickly and efficiently. In order to provide data collection and device control, the IRU152 comes with various I/O connectors, including four analog input (AI) channels, one isolated RS-232/422/485 port, one isolated LAN and one isolated DIO (2-in/2-out). The four analog input channels have differential input configuration and overvoltage protection of 55V DC. The maximum sampling rate of IRU152 is up to 250 kS/s with a 16-bit resolution for low-speed high-resolution sensor monitoring and signal measurements. Apart from the abovementioned features, the IRU152 comes in two PCI Express Mini Card slots and one SIM card slot for Wi-Fi, 3G/4G and LoRa connections. The DIN-rail embedded system is equipped with onboard 512MB DDR3 SDRAM; besides, they have an 8GB eMMC flash memory. The extremely low power industrial IoT gateway has passed the Heavy Industrial certification and FCC part 15 to ensure the excellent quality and highly reliable performance.
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Product
COM Express Type 6 Basic Module With Intel® Xeon® And 6th Gen Intel® Core™ I7/i5/i3 Processor, Intel® CM236/QM170/HM170
CEM500
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The CEM500, a COM Express Type 6 basic module, is based on the 14 nm Intel® Xeon® processor E3-1505M v5 and 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-H) with Intel® CM236/QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications.
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Product
Intel 186 EB & EC Processor Boards
MS 1503
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- ATE- Data Acquisition System- Process Control- Industrial Automation
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Product
Fanless Embedded System With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, 4-CH PoE And MXM 3.1 Type A
eBOX671-521-FL
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The eBOX671-521-FL is a GPU computing embedded system that comes with 4-CH PoE and MXM 3.1 Type A slot for applications in machine vision, edge computing, traffic vision, deep learning, and artificial intelligence of things. The outstanding eBOX671-521-FL with enhanced GPU computing performance is powered by the 9th/8th gen Intel® Core™ i7/i5/i3 processor with up to six-core, Intel® Pentium® processor, or Intel® Celeron® processor and comes with Intel® Q370 or optional Intel® C246 chipset. The fanless embedded GPU-based system is equipped with dual DDR4 ECC/non-ECC SO-DIMM slots for up to 64GB of system memory. The embedded vision system has an optional MXM type A slot for NVIDIA GTX1030 and GTX1050 graphics modules to enhance the performance of the visual display. Furthermore, this Intel® Coffee Lake-based embedded box PC is specially designed with four Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports with a total power budget of 60W, six USB 3.1 ports and two Gigabit LANs to connect different devices or sensors. It comes in great expansion possibilities, including one internal MXM 3.1 type A connector, two full-size PCI Express Mini Card slots and two SIM slots. For storage, it has two swappable SATA HDD drive bays with a height of up to 9.5 mm and one mSATA for RAID 0 and 1 feature. Besides, we have designed a flexible I/O window slot for incorporating application-oriented I/O functions to meet the requirements of various cases. This embedded vision computer can be mounted using wall or DIN-rail mounting for versatile use in various environments.
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
Mini-ITX With Intel® Celeron® Processor J1900 (up To 2.42 GHz), VGA/HDMI/LVDS, USB 3.0, Mini PCIe Card And HD Audio
MANO842
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The MANO842 Mini-ITX motherboard features quad-core SoC, fanless design, advanced graphics performance, and 12VDC/STD ATX power input. The powerful MANO842 is equipped with a quad-core Intel® Celeron® J1900 processor with Intel® HD Graphics engine, delivering outstanding computing, graphics and media performance at a competitive price. The cost-effective industrial-grade motherboard utilizes high bandwidth DDR3L-1333 SO-DIMM with system memory up to 8 GB and a rich set of I/O features. With 12V single voltage DC power or STD ATX jack, the ultra-compact Mini-ITX mainboard can be widely applied to automation and embedded industries, including medical healthcare, in-vehicle infotainment, kiosk, digital entertainment, digital signage, POS and much more.
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Product
Single Processor VPX Payload Blade
VP62106
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LinkedHope Intelligent Technologies Co.,Ltd.
VP62106 is a single processor VPX payload blade based on the Intel® 3rd generation CoreTM i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two PCI Express 3.0 x8 lanes in the VPX Data plane for workstation and compute intense applications.Two x8 PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and I/O boards.With a SO-DIMM socket dual channel DDR3 design running up to 1600MT/s, the VP62106 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO-DIMM technology. Moreover, the 3rd generation CoreTM processors offer increased cache size and efficiency as well as instruction set improvements which make the VP62106 a high performance compute engine with outstanding floating point and vector processing performance.
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Product
Image Sensor Test System
IP750
Test System
Teradyne's IP750 series dominates the image sensor tester market with its superior performance and low cost of test. The IP750 delivers high throughput and high parallel test efficiency, broad device test coverage from CCD and CIS, analog and digital capture, and concurrent image sensor and logic testing. In addition, Teradyne's IG-XL software environment provides easy, shorter test program development and easy maintenance.
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Product
Ultimate Performance Gaming Platform Based on 7th Generation Intel® Core™ Processors Supports up to 11x Independent Displays Including 4K UHD
ADi-SA1X-KB
Gaming Platform
- Ultimate " all-in-one" gaming platform- The best-in-class graphics capabilities in games with high levels of detail- Up to 11x independent HD monitors supporting 4K UHD- Advanced security feature set and software solutions- Intelligent middleware shortens development time- Various power supply options- Low-power consumption
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Product
Xeon E3-1125 Processor AMC, XAUI
AMC721
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The AMC721 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMCTM (AMC) form factor based on the Intel® Xeon™ Processor with an 8900 Series PCH.
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Product
Near IR Image Plates
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The IR Display Plate is a versatile instrument that presents clear, high contrast images of all near IR laser beams. These displays are made on infrared sensitive phosphors which offer a variety of unique features, variable image retention times for pulsed lasers, high resolution for CW YAG, and a good response to gallium arsenide light-emitting diodes. All near IR lasers are capable of being displayed over a wide sensitivity range.
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Product
SF6 Optical Gas Imaging Camera
FLIR GF306
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The FLIR GF306 optical gas imaging camera visualizes sulfur hexafluoride (SF6) and other gas emissions without the need to shut down operations. SF6 is used in the electric power industry as an insulator and quenching medium for gas-insulated substations and circuit breakers. The portable, non-contact GF306 allows you to quickly scan substations for leaks while maintaining a safe distance from high-voltage equipment. By catching leaks early, the GF306 reduces lost revenue to breakdowns and repairs.
