Image Processors
algorithmically enhances image characterization.
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Product
Intelligent Thermal Imaging Camera
ThermiBot2
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ThermiBot2 AID cameras combine best-in-class thermal imaging technology with advanced video analytics to provide a complete solution for automatic incident detection and data collection. Traffic video analytics from FLIR have proven their effectiveness worldwide along highways and in tunnels, and with the addition of thermal, allow traffic operators to see clearly in total darkness, bad weather, and over a long range.
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Product
NXP I.MX8M Plus Quad Core Processor Based IIoT Gateway Platform
MXA-200
IoT Gateway Platform
MXA-200 is an i.MX8M Plus based high-performance IoT gateway, which has an open platform design with Quad Core processor, two RS-232/422/485 isolated serial ports, two 10/100/1000 Ethernet ports, two USB 3.0 port and operating temperature range of -20~70°C. It offers two M.2 slots for integrating Wi-Fi/4G/5G modules. MXA-200 enables system integrators to develop applications precisely for renewable energy, EV charger, smart city and factories which require massive data collection, cloud based application and video related monitoring solutions.
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Product
Xeon E3 Processor, 10GbE, MTCA.4, Double Module, AMC
AMC725
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The AMC725 is a Processor AMC (PrAMC) in a MTCA.4 double-module, mid-size AMC form factor. It features an Intel® Xeon E3 Processor with Cave Creek PCH, and on-board dual RAID options. The module provides PCIe Gen3 x4 or single x8 on ports 4-11 per AMC.1, dual GbE on ports 0 and 1 per AMC.2, and SATA on ports 2 and 3 per AMC.3. Dual 10 GbE ports are included on the front panel.
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Product
1U Rackmount Network Appliance Platform With LGA1150 Socket Intel® Xeon® E3/Core™ Family Processor, Intel® C226 And Up To 24 LANs
NA570
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NA570 1U rackmount Network Security Platform, supports the 4th generation Intel® Xeon® E3 / Core™ processor family, formerly codenamed "Haswell". NA570 offers greatly improved performance and reduced power consumption base on the new Intel architecture marked improvements in power efficiency and performance. The system supports up to 32GB DDR3 1600 non-ECC / ECC (only NA570) memory. NA570 support 4 pairs of LAN Bypass function. Bypass ports allow users to experience uninterrupted network traffic even if a single in-line appliance hangs or sudden shutdown. Expandable LAN Modules via the PCIe 3.0, support up to 24 GbE ports, or up to 4 ports at 10GbE, and a future upgrade to 40GbE, port density and optional networking ports to suit your demands.
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Product
TR D2x/msd-RCx, 3U OpenVPX Intel® Atom™ Processor Board
TR D2x/msd-RCx
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TR D2x/msd-RCx is a rugged conduction-cooled 3U VPX board based on the Intel® Atom™ processor E3800 product family. TR D2x/msd-RCx is offered with two processor options: single-core for lowest power consumption and quad-core for enhanced performance.
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Product
Mini-ITX 12th/13th/14th Gen Processor LGA1700
AIMB-289 A1
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Intel® Core™ Desktop Processors 12/13/14th GenDual channel DDR5 5600MHz, max. 96GB with two SODIMMsRich expansion: M.2 B key for SSD Storage, M.2 E key for wireless, 2 SATA12-24V DCin Power Input via DC Jack or ATX 4pin+5VSB pin headerWindows 10/11 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOnTriple independent 4K displays with 1 DP1.4, 1 HDMI, and 1 LVDS
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Product
EMCCD Image Sensors for Space and Ground-based Astronomy
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EM (Electron Multiplication) is a technology that uses on-chip gain in the charge domain to effectively eliminate read noise from an image sensor. This enables advanced ultra-low light applications that require extreme sensitivity at fast frame rates such as adaptive optics and lucky imaging™.The combination of Teledyne e2v’s back-thinning technology and anti-reflection coatings enables industry leading quantum efficiency that can be optimised for applications in the visible, UV or NIR wavelength ranges.
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Product
Detailed Stereo Image Analysis with 3D Visualization
StereoScope Pro
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StereoScope Pro is a real time stereo field analyzer with multiple views and MIDI/automation output capabilities. It is a powerful help to analyze how the audio signal is spread in the stereo field, and you can easily detect potential phase and mono compatibilities issues.
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Product
Industrial Mini-ITX Motherboard With Intel® N97 Processor
AmITX-ALN
Motherboard
- Intel Alder Lake N SoC processors, N97- Single channel DDR4 3200 MHz memory up to 32 GB- Triple independent display: HDMI 2.0b, DP 1.4a (from Type C), VGA, LVDS or eDP- Dual GbE ports: 2x 2.5GbE- Expansion slots: 1x PCIe Gen3 x1, 1x USB 3.2 Gen2 Type C, 4x USB 3.2 Gen1, 6x USB 2.0, 1x M.2 B-key, 1x M.2 E-key, 1x M.2 M-key- 12 to 28V DC-in
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Product
Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor, LVDS And LAN
PICO511
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The PICO511 is an extremely compact Pico-ITX motherboard featuring the latest 7th generation Intel® Core™ processor or Celeron® processor 3965U (codename: Kaby Lake). The feature-rich 2.5-inch embedded board is building flexible I/O interfaces through board to board connectors, wide temperature range in a small-form factor motherboard to fit different needs of many demanding applications in various industries. The PICO511 is perfect for system integrators who require an extremely compact embedded motherboard with great processing power and expansion capabilities. Its compact size form factor has ensured that it can fit into a variety of space constricting environments. In addition, the Intel® Kaby Lake-based motherboard was designed to withstand extreme temperatures, ranging from -20°C to +70°C (0°F to +158°F).
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Product
Quad-Core Intel® Atom™ Processor 3U CompactPCI® Card
MIC-3329
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The Advantech MIC-3329 is based on Intel® Atom™ technology, previously codenamed Baytrail and is designed to provide balanced performance and power efficiency. The MIC-3329 is a 3U CompactPCI® processor blade designed for dual-core Intel® Atom E3826/E3827 and quad-core Intel® Atom E3845 processors, and up to 4GB soldered DDR3L-1066/1333 ECC memory. It is available in single and dual slot form factor, offering a range of I/O functionality by XTM (8HP) & Rear I/O extensions. Front panel I/O on the single slot (4HP) provides 2 x RJ45 GbE ports (Switchable with RIO 4HP),1 x VGA port (Switchable with RIO 4HP), 1 x USB2.0 port and 1 x USB3.0 port. Front panel I/O on the second layer (XTM) provides 2 x COM ports (RS232/422/485), 1 x PS/2 KB/MS and 1 x Audio ports or 2 x M12 GbE ports, 1 x COM ports (RS232/422/485). The MIC-3329 provides an ideal solution for transportation, railway and factory automation applications. Its robust design from a layout and thermals perspective allows it to meet or exceed EN50155 and EN50121-4 using a very low TDP selection of 7W/8W/10W processors. Its low power consumption and industrial SoC features make the MIC-3329 a perfect fit for all fanless system applications.
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Product
Intel Atom® X6000E Series, Pentium®, Celeron® N And J Series Processor
AIMB-218
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Supports Intel Pentium/Celeron processor (Elkhart Lake), N6210/N6211/J6412/J6413/J6426/x6413ETwo 260-pin SO-DIMM up to 32 GB DDR4 3200 MT/s SO-DIMMSupports, DP++ , HDMI, eDP(or LVDS)Supports 1x M.2 (B-Key) and 1x M.2 E-Key (or 1x PCIe x1 Gen3 ), 6 COM, 3 USB 3.2 Gen2x1 & 5 USB 2.0, dual LANLower total cost of ownership with DC12V support and onboard TPM2.0 (option) & Amplifier (option)Support SUSI, Ubuntu20.4, WISE-DeviceOn and Edge AI Suite
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Product
Near-Field Detection Module for Imaging
Reflection
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Reflective AFM-tip illuminationDetection optimized for high-performance near-field imagingEnables optical amplitude and phase resolved near field measurementsNear-field spectroscopy possible via sequential imaging (Requires tunable illumination unit)Patented background-free detection technologySuited for visible & infrared wavelength range (0.5 20 m)Version for infrared & THz wavelength range (5 300 m) availableSupported AFM scan-speed: up to 20 m/s @ highest spatial resolution
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Product
COM Express Type 6 Basic Module With Intel® Xeon® & 8th Gen Intel® Core™ Processors And Intel® CM246/QM370/HM370
CEM520
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The CEM520 is a high-performance COM Express Type 6 basic module featuring triple independent displays, industrial operating temperatures and rich expansions. The CEM520 is based on the Intel® Xeon® E-2176M and 8th generation Intel® Core™ i7/i5/i3 processors (codename: Coffee Lake) with the Intel® CM246/QM370/HM370 chipset. The system-on-module is equipped with dual DDR4-2666 SO-DIMM slots for up to 32GB of system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of harsh operating conditions. Integrated with Intel® Gen 9 graphics, and with the support of DX11/12, OCL 2.0 and OGL 4.3/4.4, the Intel® Xeon® and Core™-based computer-on-module presents excellent graphics performance with a resolution up to 4K. Three independent displays are supported through one LVDS, one VGA and two DDI ports for HDMI, DisplayPort. The CEM520 comes with multiple I/O connectors including four SATA-600 interfaces with RAID 0/1/5/10, one Gigabit LAN port with Intel® i219-LM controller, four USB 3.0 ports, eight USB 2.0 ports, and 4-In/Out DIO port. Also, the system-on-module is expandable with one PCIe x16 slot and eight PCIe x1 slots, as well as LPC and SMB expansion buses. Trusted Platform Module 2.0 (TPM 2.0) is supported to provide efficient hardware-based data protection. This new powerful COM Express Type 6 module is compatible with Windows® 10 and Linux operating systems. It also supports AMS.AXView – Axiomtek’s exclusive software for smart device monitoring and remote management applications.
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Product
2U Rackmount Network Appliance With Intel® Xeon® Processor Scalable Family, Up To 8 NMC Slots. Ideal For Data Center Deployments.
FWA-6170
Network Appliance
Dual 1st/2nd Gen Intel® Xeon® Scalable Processors, up to 28 Cores24 x DDR4 ECC RDIMM slots2x 2.5" disk bays, and system fan, redundant PSU, 2 x low profile Gen3 PCIe x8 slotIntel® QAT with up to 40G Crypto supportIPMI v2.0 compliant, with web interface8 x Advantech network module expansions w/ PCIe Gen3 bandwidth
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Product
SMARC Short Size Module, Intel® Atom® X7000 Series (Amston Lake) Processors
LEC-ASL
Computer on Module
The ADLINK LEC-ASL is a SMARC module that supports 2/4/8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) Processors (formerly Amston Lake) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that run 24/7.
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Product
12.1" XGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-312
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Industrial-grade 12.1 XGA TFT LCD with 50K lifetime and LED backlight.8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMM.Dual channel memory slots support up to 64G in total.Compact, fanless embedded system with aluminum alloy front bezel and chassis grounding protection.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Support expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G).Diverse system I/O and isolated digital I/O via iDoor technology.Support fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technology.Support TPM2.0 hardware security.
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Product
Flight Processor Emulator
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Flight Processor Emulators are an essential part of satellite simulators – both for testing of flight software and at the heart of operational simulators. The Terma Emulator is a suite of instruction-level emulators, based in the ESOC Emulator Suite, supporting several processors used in the Space industry: MIL-STD-1750 in both A and B variants. ERC32 in both 3-chips configuration (691-E) and single chip configuration (695-F). LEON 2 (AT-697)...
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Product
GPGPU Processor Card
VPX3-4935
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Curtiss-Wright Defense Solutions
The VPX3-4935 delivers incredible processing power from its NVIDIA Quadro Turing TU104 GPU, providing an impressive 3072 CUDA cores for parallel processing and a 50% improvement in performance per CUDA core compared to the previous Pascal generation.
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Product
15" Fanless Panel PC With Intel® 11th Gen Core™ I7/i5/i3 Processor
PPC-415 TGL
Panel PC
15" XGA TFT LCD flat panel with projected capacitive (default) or resistive (by reuqest) touchscreenIntel® Core™ i7-1185G7E/i5-1145G7E/i3-1115G4E processor with fanless system designDual channel memory slots, max 64GSupports either 1 x PCIe x4 or 1 x PCI1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID1 x isolated RS-422/485 with auto flowWide power input range (9 ~ 32 VDC)Dual 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technology3 x Independent displays
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Product
COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
Computer on Module
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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Product
23.8" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-324W TGL
Panel PC
Industrial-grade 23.8" LCD panel with 30k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive controlHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 11 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technology
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Product
Acoustic Imaging Cameras
Si1 and Si2 Camera series
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Helps you significantly lower costs associated with mechanical bearing issues and partial discharge on electrical equipment. It also enables you to drastically reduce leaks in your facilities, cutting down expenses related to compressed air and gas leaks.
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Product
Terahertz imaging cameras
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Operates at frequencies (0.05 - 0.7 THz), where most common materials are transparent. Different models are available: 256 pixels; 1024 pixels; 4096 pixels - to accomodate any budget. USB feeding and programming.
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Product
Digital Signage Player With 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, 3 HDMI 2.0, 4 USB And GbE LAN
DSP500-523
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*8th gen Intel® Core™ i7/i5/i3 & Pentium® processor (Coffee Lake)*2 DDR4-2400 SO-DIMM for up to 32GB of memory*3 HDMI 2.0*4 USB 3.1 and 1 GbE LAN*1 M.2 Key E 2230 for Wi-Fi/BT*1 M.2 Key B 3042 for 4G LTE*1 M.2 Key M 2280 for storage
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Product
Thermal Imager
testo 865
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The testo 865 thermal imager combines all the important properties required for high-quality thermographic measurement it is accurate, robust, fast and reliable. The testo 865 provides high-quality thermography at an affordable price and keeps going even in tough working conditions. The case supplied with the thermal imager means it can be conveniently transported, so it is always there for you when needed.
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Product
Robust DIN-rail Fanless Embedded System With Intel® Atom™ Processor E3815 As An Intel® IoT Gateway Solution
ICO300-MI
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The ICO300-MI based on Intel® Gateway Technology has been upgraded with Wind River Intelligent Device Platform XT v3.1. The reliable din-rail embedded IoT gateway platform utilizes the low power Intel® Atom™ processor E3815 and supports DDR3L system memory maximum up to 4GB, delivering high performance and low power consumption. It provides enterprise-grade security and intelligent manageability, yet simplifies the development process and gateway deployment for IoT applications. The intelligent ICO300-MI is a perfect solution for industrial IoT applications such as smart energy, smart factory automation, facility monitoring systems and more.
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Product
Extreme Rugged Cold Plate Mount System with Intel® Xeon® Processor and MIL-DTL-38999 Connectors
HPERC-KBL-MC
Processing Module
Inside the tiny footprint of ADLINK’s HPERC lives the power of Intel® Xeon® processor and optional GPGPU parallel processing engine based on a NVIDIA Quadro MXM module. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments.
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Product
High Speed Imaging
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The High-speed Intensified Camera Attachment (HiCATT) is designed for use with a high-speed camera. The HiCATT increases the sensitivity of a high-speed camera and allows low-light-level imaging applications at frame rates up to 300 000 fps.
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Product
Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H310 And TPM 2.0
OPS500-520-H
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The OPS500-520-H is powered by the newest 8th generation Intel® Core™ i7/i5/i3 and Celeron® processors (code name: Coffee Lake S) with the Intel® H310 chipset. The smart cableless digital signage module has two DDR4-2400 SO-DIMMs for up to 32GB of system memory. Axiomtek's OPS500-520-H supports the LGA1151 socket-type processors offering greater flexibility for CPU selections, which is easily configured to meet various performance requirements. The OPS signage module is connected to OPS-compliant display via a standardized JAE TX-25A plug connector interface which supports DisplayPort, HDMI 2.0, USB 2.0, USB 3.1, audio and UART signals. It also has one M.2 Key E for Wi-Fi modules and one M.2 Key M supporting PCIe, SATA and SSD interfaces for storage. We believe that this new smart cableless open pluggable signage module with simplified installation, maintenance and upgrade can help you develop creative display solutions that increase your sales and improve your customers' experiences. With the enhanced multimedia performance, the Intel® Coffee Lake S-based OPS500-520-H is well suited for a wide range of digital signage applications in retail, transport, entertainment, education, and more.
