Semiconductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
See Also: iJTAG
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FT-IR and FT-NIR Analyzers
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ABB capabilities encompass one of the largest portfolios in the world for laboratory, at-line and process FT-IR/FT-NIR analyzers. Founded in 1973, ABB Analytical Measurements (formerly Bomem Inc) designs, manufactures and markets high-performance, affordable FT-IR / FT-NIR spectrometers as well as turnkey analytical solutions for Petroleum, Chemical, Life Sciences, Semiconductor, Academic, Metallurgy, OEM industries and spectroradiometers for Remote Sensing/Aerospace market.
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(AOI) Automated Optical Inspection Systems
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For automated defect detection and high-accuracy measurements. VisionGauge Online High-Speed AOI systems are perfect solutions for demanding high-throughput, high-resolution applications. These systems are perfect for a wide range of applications including MicroElectroMechanical systems (for MEMS inspection or MEMS measurement), semiconductor & discrete device inspection and measurement.
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THz Pulsed Imaging and Spectroscopy
TeraPulse 4000
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TeraView’s proprietary semiconductor technology gives the TeraPulse 4000 a market leading signal-to-noise specification with over 90 dB at peak. As standard, the TeraPulse offers a bandwidth of 60 GHz up to typically 4.5 THz; with an option to extend this beyond 6 THz.
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Device Parameter Analysis
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bsw TestSystems & Consulting AG
The complexity of DC Parametric Characterisations has significantly increased with the level of miniaturisation in the semiconductor industry. The demand is not only on the precision of the measurements. New measurement methods have emerged to gain insight into phenomena previously unknown or only of marginal relevance. One example is "Pulsed IV" which is now widely in use. The modular concept of the Keysight B1500A allows users to tailor their instrument exactly to their needs. Flexible upgrades ensure the investment for many years. Together with bsw AG you will get an optimum solution for your application. Our experts provide not only support for the instrument itself but have also working knowledge of all the solutions surrounding it. This includes Cabeling and Adapters, Fixturing for packaged Parts and of course Wafer Probing. We help customers from replacements of broken or worn-out parts to planning and deployment of turn-key-systems.
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Automated Discrete Semiconductor Tester (ATE)
5000E
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Same Proven Technology as all 5000 Series Testers. High Speed Single Test Measure. Capable of Testing Multiple and Mixed Devices. 1KV Standard, 2KV Optional. 1NA to 50A Standard, 100A Optional. 0.1NA Resolution. Complete Self Test. Auto-Calibration. RDSON to 0.1MOHM Resolution. Windows Application Software. Optional Scanner. Optional Wafer Mapping. Optional Curve Trace. MOSFET, IGBT, J-FETTriac, SCR, Sidac, Diac, Quadrac, STS, SBS Transistor, Diode, Opto, Zener Regulator, MOV, Relay. UNDER $23,000.00
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Component Test Systems
Test System
These products include test peripherals used with test systems, such as interfaces that connect semiconductor devices with test systems, and handlers that transport semiconductors to the test system. System-level test equipment and software are also included in this category.
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Product
Laser Head
5517FL
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The Keysight 5517FL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Metrology
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Optical critical dimension (OCD) metrology and film metrology require accuracy and repeatability. Onto Innovation's techniques are well-established and trusted by semiconductor manufacturers around the globe.
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Test Data Investment Services
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PDF Solutions Professional Services offerings cover every major project phase. Available for a specific phase of your project needing a custom solution, or an end-to-end implementation, PDF Solutions Professional Services produces results fast.Realize quicker ROI from your semiconductor test data investmentOffering a broad range of planning, education, design engineering, implementation and support, our team of highly trained semiconductor data integration engineers and analytics consultants can help you build your solution with confidence. These experts can assist your team with:Business Practices AssessmentsBest Practices ImplementationYield AnalysisProduct Characterization SetupSystem DeploymentSite PlanningFlow AnalysisCustom Parser Development
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Systems Integration
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Libra delivers customized manufacturing solutions for high complexity system integration requirements. No matter the industry, we most likely have experience in it across our 85 years of delivering solutions. We have expertise in large complex electro mechanical assemblies, both at the final product level as well as subassembly levels. From advanced robotics to intricate semiconductor capital equipment requirements, we combine system level capabilities with vertical capabilities and know how, that allows us to understand the technical underpinnings of your product. Our well equipped clean room facility allows us to deliver to the cleanliness standards that your product requires.
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Low Noise Amplifiers
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RPG Low Noise Amplifiers are developed and manufactured using the most modern discrete components and thin film technologies, in order to cover the frequency range 50 to 350 GHz. With improved DC-supply and modern semiconductors these amplifiers not only deliver low noise performance but also broad operating bandwidth and gain flatness. These low-noise amplifiers are available as a standard product and on request as customized manufactured product.
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BSDL File Validation
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Corelis offers services to validate the accuracy of Boundary-Scan Description Language (BSDL) files that characterize the boundary-scan functionality of semiconductor devices. These services include validation of a device's BSDL file while the chip is still in development and BSDL file accuracy verification against actual silicon.
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Software Development Projects
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Precision Development Consulting Inc
Automation of new process tool prototype in startup environment, Complex R&D Gasbox Automation, Semiconductor System Control Software, Wafer Transfer Control Software, 300mm Factory Automation, Complete port of Spectrometer software to windows, HSMS Protocol
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LXI High Voltage Matrix 2-pole 300x2
60-310-302
Matrix Switch Module
The 60-310 is a 2-pole Matrix Module available in 300x2, 200x2 and 100x2 formats. It is capable of cold switching 1000VDC and has a maximum carry current of 1A. It is designed for high voltage applications including circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing.
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Test Management Software
ActivATE™
test
Easily create and run robust test programs in semiconductor automated test systems with ActivATE™ test management software. Designed by test engineers for test engineers, ActivATE™ tames automated test complexities with elegant simplicity.
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ESD Device Testing
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Barth Electronics, Inc. offers complete ESD Testing to the semiconductor industry. Nothing is outsourced – all testing is performed at our factory in Boulder City, Nevada.
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Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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Product
4K Multi-Camera System (TRICAM)
E-CAM130_TRICUTX2
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e-CAM130_TRICUTX2 (TRICamera) is a multiple camera solution for NVIDIA® Jetson TX2 developer kit that consists of three 13 MP 4-Lane MIPI CSI-2 camera board and an base board to interface with the J22 connector on the Jetson TX2. Each camera is based on the camera module e-CAM137_CUMI1335_MOD, 1/3.2" AR1335 color CMOS image sensor from ON Semiconductor® and integrated high performance Image Signal Processor (ISP).
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Optical Metrology
YieldStar
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Our YieldStar optical metrology solutions for the semiconductor industry can quickly and accurately measure the quality of patterns on a wafer.
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Wafer Defect observing instrument
HS-WDI
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Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
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Online DGA
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HAOMAI Electric Test Equipment Co., Ltd.
Innovatively combined semiconductor laser technology and photo-acoustic spectroscopy for Online DGA.
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0 Hz/DC to 14 GHz, Single-Pole, Four-Throw MEMS Switch With Integrated Driver
ADGM1304
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The ADGM1304 is a wideband, single-pole, four-throw (SP4T) switch, fabricated using Analog Devices, Inc., microelectro-mechanical system (MEMS) switch technology. This technology enables a small, wide bandwidth, highly linear, low insertion loss switch that is operational down to 0 Hz/dc, making it an ideal switching solution for a wide range of RF applications. An integrated control chip generates the high voltage necessary to electrostatically actuate the switch via a complementary metal-oxide semiconductor (CMOS)-/low voltage transistor-transistor logic (LVTTL)-compatible parallel interface. All four switches are independently controllable. The ADGM1304 is packaged in a 24-lead, 5 mm × 4 mm × 0.95 mm lead frame chip-scale package (LFCSP).
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Metrology Systems
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VIEW offers a full line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.
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IQ Mixers
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The new MMIC IQ mixers from Fairview (also known as IQ modulators) utilize a highly reliable GaAs MESFET semiconductor process which integrates a pair of matched double balanced mixer cells, a 90-degree hybrid and a 0-degree splitter/combiner that produces exceptional amplitude and phase balance performance. This level of integration offers size and performance advantages in comparison to discrete module assemblies. With the addition of an external 90-degree IF hybrid module, these IQ mixers can be used as either a Single Sideband Up-converter Mixer or an Image Reject Down-converter Mixer. The benefit of image rejection and sideband suppression can reduce overall system cost and complexity by removing the need for pre-selection filtering. Typical applications include point-to-point and point-to-multipoint radio, VSAT, military radar, electronic warfare, satellite communications, test equipment, and sensors.
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Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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13MP Jetson TX2/TX1 Camera Board
E-CAM130_CUTX1
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e-CAM130_CUTX1 - 13MP Jetson TX2/TX1 camera board is a 4-lane MIPI CSI-2 camera solution for NVIDIA® Jetson TX2/TX1 developer kit. The e-CAM130_CUTX1 Board uses 13MP custom Lens camera module based on AR1820 CMOS Image sensor from ON Semiconductor. This camera daughter board can be directly interfaced to the NVIDIA® Jetson TX2/TX1 developer kit. The e-CAM130_CUTX1 is a 13MP color camera with the S-mount (also known as M12 board lens) lens holder.
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3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
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e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
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High Precision TMAH Concentration Monitor
HE-960H-TM-S
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Accurately measures the concentration of TMAH (Tetra Methyl Ammonium Hydroxide), which is the main component of the photoresist developer solutions in semiconductor manufacturing. Repeatability: within +/- 0.003%. Measurement range : 0 - 3 %. Have the chemical resistant carbon sensor.
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Digital Instruments
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Digital Instruments generate and acquire high-speed digital waveforms for transmitting data, communicating with devices under test, or testing digital interfaces. These instruments are ideal for semiconductor characterization and production, interfacing to LVDS and TTL digital electronics, and testing the functionality of high-speed serial links.
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Product
Laser Head
5517EL
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The Keysight 5517EL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
