Evolved Packet Core
LTE system core voice and data network.
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Product
Intel® Core™ Ultra 3 Series Processor
AIMB-234
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Intel® Core™ Ultra ProcessorsSupports Intel® ARC™ GPU with up to 12Xe, enabling four independent 4K displaysSupports up to 128GB dual-channel DDR5-7200MT/s using CSODIMM modulesBuilt-in NPU5 delivering 50 TOPS for dedicated AI accelerationOffers full support for embedded software APIs and Advantech’s WISE-PaaS/DeviceOn platformProvides extensive I/O expandability—2.5GbE, high-speed PCIe x8 Gen5, USB4 and USB3.2 Gen2 ports, plus SATA 3.0
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Product
Multifunctional Digital Design Core
PA72DIOS6016
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The PA72DIOS6016 is a multifunctional digital design core. The FPGA allows for implementing many different custom applications. The connector has 64 Input/Output pins which can be assigned as TTL I/O or as differential inputs. 128 MByte of DDR2 memory is available to the FPGA, and an onboard EEPROM allows for storing values in non-volatile memory. The I/O bank voltage can be FPGA-selected between 2.5 and 3.3 Volt.
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Product
Gigabit Ethernet Tester Module for 1G and 10G Packet
GAO-ENET-103
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GAOTek Gigabit Ethernet Tester Module for 1G and 10G Packet is designed for installation and maintenance of Metro/Carrier Ethernet and IP services. It supplies a compact test solution for 1G and 10G packet Ethernet, including ITU-T Y.1564 standard for SLA and OAM test features.
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Product
802.1 Core Test Software
IOL vIOLett®
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The same tool used for testing everyday in the UNH-IOL Ethernet Switching Protocols (ESP) Testing Services is now available to use in your own labs. See the below list of available testing packages. Each test package contains a complete set of tests for use with IOL vIOLett® Software, which is included with any test package license.
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Product
LAN Packet Tester
LE-590TX
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The LE-590TX is a LAN analyzer that connects to a PC's USB2.0 port. In TAP mode, you can capture full duplex data on 10/ 100Base-TX and transmit to the PC at 480Mbps via the USB2.0 interface. In PG mode, you can generate test packets at up to 100Mbps line rate.
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Product
Air Core Inductors
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Osborne designs our Air Core Inductors to realize their advantage of high linearity. We also work with our clients to identify and mitigate any potential disturbances that could result from electromagnetic fields created. The air core design approach is known to create strong electromagneticfields. Osborne develops electromagnetic circuit models, if necessary, to ensure that our clients build effective and reliable circuits.
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
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- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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Product
12.1" Fanless Panel PC With Intel® Core™ I5-7300U Processor
PPC-412
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12.1" XGA TFT LCD with resistive touchscreenIntel® Core™ i5-7300U(default); i7-7600U/i3-7100U(optional) processor with fanless system design1 x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual Gigabit Ethernet with IEEE1588 support3 x Independent displays1 x M.2 bay (2242) for storage only and support SATA RAID 0/1No RED CertificationSupports VESA 75 mounting interface
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Product
Ultra-compact, uncooled thermal imaging core
Dione 640 CAM Series
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The Dione 640 CAM series is based on the Dione 640 OEM thermal imaging core with 640 x 480 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 60 Hz.The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione 640 CAM is both lightweight and small. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 640 CAM versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional). The ultra-compact Dione 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
Iron Core Earth Tester
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Weshine Electric Manufacturing Co., Ltd
Transformer iron core grounding current tester is a high-precision clamp meter specially designed for measuring AC leakage current, current and voltage. Large diameter (80×80mm) can clamp φ80mm cable, or 96mm×4mm flat steel ground wire, suitable for cables Leakage detection and transformer grounding flat steel leakage measurement.
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Product
Intel® 6th/7th Generation Core I Desktop Compact Fanless System
MIC-7700
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Intel® 6th/7th Generation Core i Desktop CPU (LGA1151) with Q170/H110 chipset2 x RS-232/422/485 and 4 x RS232 serial ports (with expansion cable)1 x 2.5" HDD, 1 x CFast, 1x mSATA and 1 mini-PCIe with SIMSupports 2 LAN, Isolation COM, 32-bit GPIO modules2 x GigaLAN and 8 x USB 3.0VGA and DVI outputSupports Advantech’s i-module, SUSIAccess, and embedded software APIs9 ~ 36 V DC input power rangeWide operating temperature
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Product
3.5 Inch SBC with 7th Gen Core i7 CPU and PCIe/104
VENUS
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Based on the “Kaby Lake” 7th generation Core i7 processor, Venus offers high CPU performance in a small form factor rugged SBC with modest power consumption. It incorporates a full suite of rugged features such as soldered memory, latching connectors, a thicker PCB, and true -40/+85ºC operating temperature, making it suitable for the most demanding vehicle applications. High I/O density, multiple expansion sockets, rugged design, modest power consumption of 14W, and wide temperature operation combine to make Venus an extremely attractive option for applications requiring high CPU performance or ruggedness.
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Product
Performance Core i7 Mission Computing Platform
ComSys-5362
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The ComSys-5362 is a rugged COTS based mission computer. A powerful yet power stingy 15W Intel Core™ i7 CPU supports signal processing for critical applications. Highly configurable, application-specific I/O. Removable drive bay for two 2.5“ SSDs.
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Product
PXIe-8821, 2.6 GHz Dual Core Processor PXI Controller
785158-33
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PXIe, 2.6 GHz Dual Core Processor PXI Controller—The PXIe‑8821 is an Intel Core i3‑based embedded controller for PXI systems. You use it to create a compact and/or portable PC-based platform for industrial control, data acquisition, and test and measurement applications. The PXIe‑8821 includes a 10/100/1000 BASE‑TX (Gigabit) Ethernet port, two Hi‑Speed USB ports, two USB 3.0 ports, as well as an integrated hard drive, serial port, and other peripheral I/O.
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Product
Processor Intel Core I7, PCI Gen 3, AMC
AMC726
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The AMC726 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the Intel® 4th generation Core i7 Processor (Haswell) with QM87 PCH. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Product
Double DDS Core
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AllWin Instrument Science and Technology Co., Ltd.
1. Double DDS core,high accuracy and high stability2. Store more than 20 kinds of waveforms3. Frequency range: 1 Hz~120 MHz
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Product
BACnet Packet Capture And Protocol Analyzer For MS/TP
BACTrace
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The multi-pane user interface shows captured packets in several different kinds of detail. The upper pane displays a quick summary of received packets, each of which is identified by number. The MS/TP frame type, destination and source MAC addresses are shown, as well as a timestamp in milliseconds. For APDUs, the BACnet service is also shown.
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Product
12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-279 A1
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12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), Up to 24Core. Support Q670E/H610E chipsetDual channel DDR4 3200MHz, max. 64GB with two SODIMMsSuper Speed I/O: PCIe x16 Gen4 (16GT/s), USB3.2 Gen2 (10Gbps), 2.5GbEQuad independent 4K displays with 2 DP1.4, 1 HDMI, and 1 LVDSRich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 2 SATA12-24V DCin Power InputWindows 10 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOn
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Product
Core I7 Processor AMC, 10/40GbE
AMC727
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The AMC727 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the Intel® next generation CoreTM i7 Processor (Haswell) with QM87PCH.
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Product
LV Iron Core Motor Starting Reactors
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Motor starting reactors are used to reduce voltage during starting of large 3 phase motors while limiting inrush currents.
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Product
12th Gen. Intel® Core I7/ I5/ I3 P-Series 3.5" SBC
MIO-5377
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12th Gen. Intel® Core™ Processor up to 12 Cores, TDP 28/15WDual Channel DDR5-4800 up to 64GB4 simultaneous displays: LVDS/HDMI/DP/USB-C Alt. DP2 GbE, 6 USB, USB4/TBT4, 4 UART, 2 CANBus, 3 I2C3 Expansions: M.2 E-Key, B-Key, M-Key (support NVMe)Supports iManager & Software APIs, WISE-DeviceOn
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Product
Complete TAP Signal Isolation for Corelis Boundary-Scan Controllers
ScanTAP IsoPod
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The Corelis ScanTAP IsoPod™ is an add-on accessory that provides a galvanic isolation barrier between the target system and the boundary-scan (JTAG) controller hardware. While the Corelis boundary-scan controllers are highly robust and reliable, the complete electrical isolation helps prevent damage to the controller from harsh electrical environments where over-voltage and over-current can damage components.This Corelis ScanTAP IsoPod was designed to add an additional layer of protection with minimal cost and effort. Open the box and plug it in; everything just works.
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Product
Intel® 8th & 9th Gen. Core™ I Mini-ITX Motherboard
PPC-MB-610
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Supports Intel® 8th & 9th Gen Core™ i processor (LGA1151) with Intel Q370 chipsetTwo 260-pin SO-DIMM up to 32GB DDR4 2666 MHz SDRAMSupports triple display of DP/VGA/LVDSSupports PCIe x16 (Gen 3), 1 M.2 M key & 1 M.2 E key, 6 x USB 3.1Supports 2 x SATA 3.0 (Raid 0, 1)Supports TPM 2.0 (optional)Supports 4 RS-232,1 RS-232/422/485Supports 1 GPIO(8 channels)
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Product
15.6" Fanless Widescreen Panel PC With Intel® Core™ I5-7300U Processor
PPC-3151W
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15.6" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i5-7300U(default); i7-7600U/i3-7100U(optional) processor with fanless system designSupports PCIe x4 or PCI expansion1 x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual Gigabit Ethernet with IEEE1588 support3 x Independent displays1 x M.2 bay (2242) for storage only & 1 x TPM2.0 internal support (optional)No RED Certification
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Product
Compact, Industrial Thermal Imaging Core
Dione 320 OEM Series
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The Dione 320 OEM is based on a state-of-the-art detector with a 320×240 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 320 versions have the same SAMTEC ST5 connector and are GenICam compliant.The compact Dione 320 OEM series find application in industrial machine vision, medical, scientific and advanced research, safety and security systems.
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Product
Sandwich Core Shear and Rigid Cellular Plastic Shear Testing
Model 3421
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Jinan Testing Equipment IE Corporation
For measuring shear properties of sandwich cores to ASTM C273. Simple clip-on design attaches in seconds and provides repeatable test results.
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Product
11th Gen. Intel® Core U-Series I7/i5/i3/Celeron Pico-ITX SBC
MIO-2375
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Intel® Tiger Lake-UP3 (10nm++) Series, On-board LPDDR4x-4266 up to 32G with IBECCDual independent display: eDP/MIPI-DSI, DP up to 8KRich I/O interface with GbE x 2, USB 3.2, COM Port, DIO SMBus, TPM2.0Flexible expansion to IoT connectivity: M.2 E-Key, M.2 B-Key/M-Key NVMe x2Supports Advantech iManager3.0, Embedded Software APIs, WISE-DeviceOn, and Edge AI Suite
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Product
6U VME 3rd Gen Intel Core 17 Computer
VM6052
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The VM6052 6U VME 2eSST Single Board Computer is built around Intel®’s state-of-the-art 3rd Generation Core™ i7 dual-core processor.
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Product
1394 and AS5643 IP Core Solutions
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Synthesizable 1394 and AS5643 IP Core solutions PHY, LLLC, PHY & LLC for multiple FPGA families.
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Product
Ka-Band Silicon 5G Quad Core IC
AWMF-0108
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The AWMF-0108 is a highly integrated silicon quad core IC intended for 5G phased array applications. The device supports four Tx/Rx radiating elements, includes 5 bit phase and 5 bit gain control for analog RF beam steering, and operates in half duplex fashion to enable a single antenna to support both Tx and Rx operation. The device provides 26 dB gain and +9 dBm output power during transmit mode and 28 dB coherent gain, 5.0 dB NF, and -28 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, Tx power telemetry, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 48 lead 6x6 mm QFN for easy installation in planar phased array antennas.
