Evolved Packet Core
LTE system core voice and data network.
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Product
Air Core Motor Starting Reactors
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Motor starting reactors are used to reduce voltage during starting of large 3 phase motors while limiting inrush currents.
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Product
ARINC 818-3 IP Core
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The ARINC 818-3 IP core offers higher data rates and encoding for high-resolution real-time avionics video. ARINC818-3 standard provides 64B/66B schemes to support high-speed ARINC applications having data rates up to 28Gbps. Display emulation for testing, low latency guidelines, and fixing typographic errors to previous versions was new in this specification.
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Product
Ultra Compact, Uncooled Thermal Imaging Core
Dione S 1280 CAM Series
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The Dione S 1280 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 1280 × 1024 resolution and NETD of less than 40 mK (available upon request) and 50 mK.The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 1280 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 1280 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 1280 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M34/M45 lens (optional).The ultra-compact Dione S 1280 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
40Gbps Ethernet Packet Generators
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Axtrinet (AXTRINET IS A TRADING NAME )
40Gbps QSFP+ & 10Gbps SFP+ ports, Support optical & copper transceivers, Wire-rate performance on all ports, Compact & Portable, Intuitive Graphical Control Interface, Control multiple units from single GUI, Test Automation with TCL interface
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Product
FPGA UDP Packet Interface Connnecting 3-4 Channels of MIL-STD-1553 to Ethernet in Real-Time
ENETX-1553
Ethernet Interface
ENETX-1553™ is an innovative product that provides “remoting” of 1553 operations on 10/100/1000 Ethernet IP/UDP local area networks (LAN). ENETX-1553 is a small, low-power, rugged device that provides real-time Ethernet connectivity to for three or four dual redundant 1553 (A/B) buses (channels). Ideal for remoting 1553 connections for in-field applications or point-point lab usage. AltaAPI provides and highly portable BSD SDK and National Instruments LabVIEW and LabWindows. ENET products are unique in the market as they have a hardware, FPGA real-time UDP engine – no OS or IP stacks – provides maximum throughput and ultimate virus protection.
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Product
12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-279
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12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), Up to 24Core. Support Q670E/H610E chipsetDual channel DDR4 3200MHz, max. 64GB with two SODIMMsSuper Speed I/O: PCIe x16 Gen4 (16GT/s), USB3.2 Gen2 (10Gbps), 2.5GbEQuad independent 4K displays with 2 DP1.4, 1 HDMI, and 1 LVDSRich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 2 SATA12-24V DCin Power InputWindows 10 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOn
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Product
Ultra-compact, Uncooled Thermal Imaging Core
Dione S 640 CAM Series
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The Dione S 640 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution and NETD of less than 40 mK (available upon request) and 50 mK. The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 640 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 640 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional).The ultra-compact Dione S 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
LV Iron Core Smoothing Reactors
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Smoothing Reactors are serially connected reactors inserted in DC systems to reduce harmonic currents and transient over currents and/or current ripples in DC systems. They are necessary in order to smooth the direct current wave shape to reduce losses and improve system performance.
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Product
Ka-Band Silicon SATCOM Tx Quad Core IC
AWMF-0109
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The AWMF-0109 is a highly integrated silicon quad core chip intended for satellite communications transmit applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain per channel with an output power of +12 dBm per element per polarization. Additional features include gain compensation over temperature, temperature reporting, and Tx output power telemetry. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 48 lead 6x6 mm QFN for easy installation in planar phased array antennas.
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Product
Intel® Core™ I3 And Core™ 3 And Atom® X7000E/x7000RE Processor
AIMB-219 B1
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Intel® Core™ i3, Core™ 3 Processor and Atom® x7000E/x7000RE ProcessorUp to 16GB DDR5 4800MT/s with one SO-DIMMTriple independent display with 1 DP, 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMMini-ITX low profile motherboard, fanless designSupports Device-On and Embedded Software APIs
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Product
Processor Intel Core I7, PCI Gen 3, AMC
AMC726
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The AMC726 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the Intel® 4th generation Core i7 Processor (Haswell) with QM87 PCH. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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Product
8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-286EF
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Supports Intel® 8th/9th Gen Core™ i processor (LGA1151) with Intel H310 chipsetOne 260-pin SO-DIMM up to 32GB DDR4 2666 MHz SDRAMSupports PCIe x 16 (Gen 3), 1 M.2 B key, 1 M.2 E key, 2 COM, 4 USB 3.0 and 3 SATA IIISupports dual display of DP/HDMI/LVDS(or eDP)Supports TPM 1.2 / 2.0 (optional)THIN Mini-ITX with 12V DC InputSupport Windows10 LTSC, Ubuntu 20.04 LTS, SUSI API, and WISE-DeviceOn
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Product
Radar Core Chips
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Macom Technology Solutions Holdings Inc.
Multifunction GaAs and Silicon MCM designed for communication radar and weather applications. MACOM Core Chips deliver a complete transmit/receive function with phase and amplitude control.
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Product
Air Core Shunt Reactors
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Shunt Reactors act as absorbers of reactive power to increase energy efficiency of the power system. Shunt Reactors are inductors that are used in order to compensate capacitive reactive power generated by long and lightly loaded transmission lines as well as underground cables, thus allowing the flow of more active power through the system and avoiding over voltages. The shunt reactors provide inductive compensation.
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Product
Transient Suppression for Corelis JTAG Controllers
TAP Protection Adapter
Controller
Transient events such as Electrostatic Discharge (ESD), inductive switching, and lightning can damage electrical equipment, leading to costly repairs and test equipment down-time, reducing production capacity and increasing time-to-market.The Corelis TAP Protection Adapter is designed to enhance protection to any Corelis JTAG controller, shielding against harmful events using a combination of electrical defenses.The compact adapter features series resistors and transient voltage suppressor (TVS) diodes to mitigate damage to the JTAG controller. Protect your investment and enjoy peace-of-mind with the TAP Protection Adapter.
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Product
Clamp-On / Precision / Split Core Current Transformer
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Transformer Ratio (Arms) : 100A / 1AColours : Red, yellow, blueConnection : Safety Sockets for Banana Plugs ф 4mm Jaw Opening : Cable Dia 15mm max.
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Product
PXIe-8830MC, Intel Core i7 Processor PXI MultiComputing Processing Module
783564-33
Processing Module
The PXIe‑8830mc allows two or more intelligent systems to exchange data using PCI Express technology. Featuring an Intel quad-core processor, the NI PXIe‑8830mc can be installed in any PXI Express peripheral slot. It runs on the LabVIEW Real‑Time OS and can act as a coprocessor to offload the processing from the main embedded controller in the system.
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Product
Dual Quad Core Multiprocessor
DSP282A
Multiprocessor
Designed for size, weight and power (SWaP) sensitive applications, Abaco's high performance embedded computing (HPEC) platforms deliver expanded mission capabilities across a wide range of manned- and un-manned airborne, ground and naval platforms.
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Product
IP Cores
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logicBRICKS IP Cores by Xylon - for applications including compact multilayer video controller, versatile video input, multiview 3D transformation engine, image signal processing (isp) ulstraHD pipeline, high dynamic range pipeline, scalable 3d graphics accelerator, DDR3 SDRAM Memory Controller, slave hssl controller, HDR image signal processing framework, video design framework for multi-camera vision applications, and more
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Product
Ultra-compact thermal imaging core
Dione 1024 CAM Series
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The Dione 1024 CAM series is based upon the Dione 1024 OEM thermal imaging core with 1024×768 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 80 Hz.Dione 1024 CAM is a LWIR uncooled thermal imaging SWaP module with housing supporting M34/M45 lens (optional).Dione 1024 CAM series benefit from Xenics image enhancement for advanced image processing while keeping power consumption low. Moreover, GenICam compliance and the availability of multiple lenses (optional) provides a high level of tunability for optimal integration into many systems.The compact Dione 1024 CAM series find applications in safety and security, transportation and industrial process monitoring.
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Product
802.1 Core Test Software
IOL vIOLett®
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The same tool used for testing everyday in the UNH-IOL Ethernet Switching Protocols (ESP) Testing Services is now available to use in your own labs. See the below list of available testing packages. Each test package contains a complete set of tests for use with IOL vIOLett® Software, which is included with any test package license.
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Product
3U i7 Quad Core, 2.4 GHz Processor cPCI Express Controller
GX7945
Controller
The GX7945 is a single-slot embedded cPCI Express 3U controller for use with Marvin Test Solutions' PXI Express chassis. When combined with the embedded storage peripherals which are integrated into PXIe chassis, the controller / chassis offers a compact, high performance, and integrated test platfrom solution.
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Product
Intel® 8th. Gen. Core I7/i5 Processor Fanless Embedded System
EPC-C301
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Intel 8th. Gen. Core Processor with Quad/Dual Cores (i7/i5), TDP 15W.Semi-Industry Fanless slim systen, Din Rail or Wall mount design.HDMI + DP* (Support vai MIO) dual display.4 GbE, 4 USB3.1, 4 USB 2.0, CAN Bus, M.2 M-Key 2280 supports NVMe, M.2 E-key 2230, M.2 B-key, 1 full size of mini PCIe, DC-in 12V.-20 ~ 60 degree extend temperature operating.Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite.No RED certification.
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Product
Ultra Compact, Uncooled Thermal Imaging Core
Dione 640 OEM Series
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The Dione 640 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution. The NETD is less than 40 mK (available upon request) or 50 mK. The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low. All Dione 640 versions have the same SAMTEC ST5 connector and are GenICam compliant.The ultra-compact Dione 640 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
STP Engine (IP Core)
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The Stream Transpose® (STP) engine is a reconfigurable processor (DRP: Dynamically Reconfigurable Processor) core that combines the flexibility of software and the speed of hardware. The firmware defining processing can be reconfigured in an instant, allowing an almost infinite variety of functions to be integrated into a system. A 40nm process is currently available for ASIC.
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Product
Compact Uncooled LWIR Cores
MicroCalibir
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The latest advances in the integration of our in-house 12 μm microbolometer pixel technology with a deep-ADC ROIC circuit have resulted in the development of the small and lightweight MicroCalibir™. This compact, low-power uncooled thermal camera platform features the smallest VGA IR core module on the market making it ideal for OEM drones, handhelds, helmet-mounted and vehicular integration products.
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Product
3U I7 Core 2.1 GHz CPCI Controller
GX7936
Controller
The GX7936 is a single-slot embedded cPCI 3U controller for use with Marvin Test’s GX7300 PXI chassis. The GX7936 features a 2.1 GHz i7 Quad Core processor. When combined with the embedded storage peripherals of the GX7300 Series chassis, it is the ideal solution for an integrated, high performance PXI chassis / controller configuration.
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Product
8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-276
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Supports 8th/9th Generation Intel® Core™ i processor (LGA1151) with Intel Q370 chipsetTwo 260-pin SO-DIMM up to 64GB DDR4 2666 MHz SDRAMSupports triple display of Dual DP++/HDMI 2.0a/LVDS( or eDP)Supports PCIe x16 (Gen 3), 1 x M.2 B key + 1 x M.2 E key, 6 USB 3.1 & 4 USB 3.0, and 3 SATA IIISupports wide range 12V~24V DC InputSupports Intel vPro, AMT 12.0, Software RAID 0,1,5,10, TPM 1.2 / 2.0 (optional)Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
Compact, Industrial Thermal Imaging Core
Dione 320 OEM Series
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The Dione 320 OEM is based on a state-of-the-art detector with a 320×240 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 320 versions have the same SAMTEC ST5 connector and are GenICam compliant.The compact Dione 320 OEM series find application in industrial machine vision, medical, scientific and advanced research, safety and security systems.
