Evolved Packet Core
LTE system core voice and data network.
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Product
IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784965-01
Controller
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Product
21.5" Fanless Widescreen Panel PC With Intel® Core™ I5-7300U Processor
PPC-3211W
Panel PC
21.5" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i5-7300U(default); i7-7600U/i3-7100U(optional) processor with fanless system designSupports PCIe x4 or PCI expansion1x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual Gigabit Ethernet with IEEE1588 support3x Independent displays1x M.2 bay (2242) for storage only & 1x TPM 2.0 internal support (optional)No RED Certification
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Product
Split Core Hall Effect DC Current Sensor
CYHCT-C2TC
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ChenYang Technologies GmbH & Co. KG
This Hall Effect current sensor is based on open loop principle and designed with a split core and a high galvanic isolation between primary conductor and secondary circuit. It can be used formeasurement of DC current etc. The output of the transducer reflects the real wave of the current carrying conductor.
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Product
IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784227-01
Controller
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Product
Compact Fanless System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-770 V3
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Intel® 12th/13th/14th Gen Core™ i CPU socket-type (LGA1700) with Intel® R680E/ H610E chipsetWide operating temperature (-20 ~ 60 °C)2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1); 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2; 9 ~ 36 VDC input power rangeIP40 dust proof for deployment in harsh environmentSupports FlexIO and iDoor technology, flexible configure additional DP, DVI, COM port, DIO, Remote switch IOSupports Advantech i-Modules; Supports Advantech SUSIAPI and embedded software APIsSupports Intel® vPro™/AMT and TPM technologies; Supports Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOnSupport Windows 11 IoT Enterprise LTSC
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Product
Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Product
Value Series Industrial ATX Motherboard For 10/11th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-C46
Motherboard
ADLINK IMB-C46 ATX Motherboard: Robust Performance for Industrial Applications The ADLINK IMB-C46 ATX motherboard offers a powerful platform for diverse industrial applications, powered by Intel's reliable 10/11th Gen Core processors. Engineered with the versatile Q470 chipset, the IMB-C46 excels in delivering enhanced performance and scalability. This motherboard supports up to 128GB of DDR4 memory, providing a balance of speed and efficiency critical for process-intensive tasks in environments like smart manufacturing and industrial automation.
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Product
Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor For Railway, Vehicle And Marine PC
tBOX500-510-FL
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The tBOX500-510-FL comes with the onboard 7th generation Intel® Core™ or Intel® Celeron® processor 3965U along with onboard two DDR4-2133 SO-DIMM slots supporting up to 32GB system memory. It offers two I/O module slots and a wide selection of value-added modules (VAM) to meet different user requirements and customizations. The rugged tBOX500-510-FL is certified with E-Mark, ISO 7637-2, EN 50155, EN 50121, DNV 2.4, EN 45545-2 and IEC 60945.It supports a wide temperature range from -40°C to +70°C and anti-vibration of up to 5 Grms. The fanless embedded box PC equipped with intelligent power management offers ACC on/off delay, shutdown delay and over/under voltage protection. It supports a wide voltage input range: 9V to 36V DC for vehicle applications, 14V to 32V DC for railway & marine applications, and 16.8V to 137.5V DC for railway applications. For system integrators with extensive storage needs, the box computer offers two 2.5” SATA HDDs and one mSATA. The new transportation embedded system is well suited for transportation-related applications such as security surveillance, onboard devices controller, truck fleet management, data transfer, and onboard passenger infotainment system.
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Product
Complete TAP Signal Isolation for Corelis Boundary-Scan Controllers
ScanTAP IsoPod
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The Corelis ScanTAP IsoPod™ is an add-on accessory that provides a galvanic isolation barrier between the target system and the boundary-scan (JTAG) controller hardware. While the Corelis boundary-scan controllers are highly robust and reliable, the complete electrical isolation helps prevent damage to the controller from harsh electrical environments where over-voltage and over-current can damage components.This Corelis ScanTAP IsoPod was designed to add an additional layer of protection with minimal cost and effort. Open the box and plug it in; everything just works.
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Product
10.4" Fanless Panel PC With Intel® 13th Gen Core™ Processors (I7/i5/i3 )
PPC-310S RPL
Panel PC
True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th Gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP)1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 75Support TPM2.0 hardware security
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Product
Packet Sniffer
EtherDetect
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EtherDetect Packet Sniffer is an easy for use and award-winning packet sniffer and network protocol analyzer, which provides a connection-oriented view for analyzing packets more effectively. With the handy tool, all you need to do is to set up the filter, start capturing, and view connections, packets as well as data on the fly.
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Product
3U CompactPCI Serial Processor Blade with 6 COres/12 Thread Core i7 and Xeon Processor
MIC-330 Series
Processor Blade
MIC-330 is a 3U CompactPCI® serial processor blade with 6 cores/12 thread Core™ i7 and Xeon® processor and configured with Intel® CM246 PCH to support dual-channel 32GB DDR4-2666, up to 16GB on board memory for rugged applications, and another 16GB are available via the SO-DIMM socket for expansion.
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Product
Sandwich Core Shear and Rigid Cellular Plastic Shear Testing
Model 3421
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Jinan Testing Equipment IE Corporation
For measuring shear properties of sandwich cores to ASTM C273. Simple clip-on design attaches in seconds and provides repeatable test results.
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Product
12.1" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-312S(W) RPL
Panel PC
True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
Intel® Core™ I3, N Series And Atom® X7000E/x7000RE Series Processor
AIMB-219
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Intel® Core™ i3, N series and Atom® x7000E/x7000RE SeriesUp to 32GB DDR4 3200MT/s SODIMMTriple independent display with 1 DP(over USB-C), 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMTHIN Mini-ITX low profile I/O stack design, fanless thermal solutionExtend operating temperature: -20C~70°C (-4 ~ 158 °F)
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Product
Air Core Neutral Grounding Reactors
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Neutral Earthing (Grounding) Reactors, which resist current flow through inductive elements, are single phase reactors generally connected between ground and neutral of transformers or generators in order to control single line-to-ground faults at a desired level.
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Product
MORA Ready Development Platform: CompacFrame Integrated With SOSA Aligned PICs And Sciens Innovations Helux Core RF Tools
SE9M3PS9YIBXNLY
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The MORA-Ready Development Platform (MRDP) simplifies the process of creating RF signal processing capabilities and accelerates integration of existing applications. Featuring Sciens Innovations helux™ Core powerful software tools to accelerate RF signal generation and system development.
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Product
Industrial ATX Motherboard With 10th Generation Intel® Core™ I9/ I7/ I5 /i3 Processor
IMB-M46
Motherboard
The ADLINK IMB-M46 Industrial ATX Motherboard supports lines of the 10th Generation Intel® Core™ i desktop processors, an Intel® Q470E Chipset, and 5 PCIe expansion slots to provide a cost-competitive embedded computing solution.
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Product
15.6" Fanless Widescreen Panel PC With Intel® 13th Gen Core™ I7/i5/i3 Processor
PPC-415W
Panel PC
15.6" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i7-1365URE/i5-1345URE/i3-1315URE processor with fanless system designSupports PCIe x4 or PCI expansion1 x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technology3 x Independent displays1 x M.2 bay (2242/2280) for storage onlySupport TPM2.0 hardware security
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Product
Cavium CN63xx Packet Processor AMC
AMC730
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The AMC730 is a a 10-Gigabit Ethernet (10GbE) AdvancedMCTM(AMC) module which includes an on-board line rate multi-core packet processor based on Cavium CN63XX CPU. VadaTech offers this product in a mid size (full size optional) form factor with the AMC.1, AMC.2 and AMC.4 specifications. The AMC730 is based around the Cavium OCTEON CN63xx processor which has been specifically designed to intelligently process Ethernet packets at line rate.The processor can be loaded via the PCIe/SRIO interface or via an optional flash memory. The number of processor cores, speed grade, and amount of DDR3 memory is customizable based on customer needs. The module has 2GB of HFA for pattern matching for deep packet inspection, etc. The SDK for the processor as well as additional software stacks are available from Cavium or third party.
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Product
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
Computer on Module
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Product
Intel® Smart Display Module Large (Intel® SDM-L) With 8th Gen Intel® Core™ I7/i5/i3 Processor, HDMI And LAN
SDM500L
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The SDM500L is powered by the onboard 8th generation Intel® Core™ i7/i5/i3 processor with the Intel® Generation 9 HD Graphics chipset. The Intel® Smart Display Module-Large (Intel® SDM-L) measures just 175 x 100 mm and a maximum z-height of 1.6 mm, which is well-suited for ultra-slim displays. It can be easily connected to an SDM-compliant display via a high-speed PCIe x8 edge connector - which supports 4K resolution displays and video capture and has built-in USB 3.0, HDMI 2.0, DisplayPort 1.2, Serial TX/RX and I2C signals. With its excellent graphics performance and installation flexibility, the incredible signage module can satisfy diverse industry requirements and support a wide range of digital signage applications such as bedside terminals for hospital patients or factory automation solutions.
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Product
Intel® Core™ Ultra Series 2 Processors (LGA1851), Up To 24 Core. Support Q870/H810 PCH
AIMB-2710
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Intel® Core™ Ultra Series 2 Processors, Up to 24 Core. Support Q870/H810 PCHDual channel DDR5 6400MT/s, max. 96GB with two CSODIMMSuper Speed I/O: PCIe x16 Gen5 (32GT/s), USB 3.2 Gen2x1 (10Gbps), 2.5 GbERich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 2 SATA and 1 USB4 Type-C12-24V DCinWindows 11 LTSC & Ubuntu 24.04 LTS; SUSI API and WISE-DeviceOn
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Product
Thermal Imaging Core
JOHO336CM_A00
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Wuhan JOHO Technology Co., Ltd
JOHO336CM_A00 is a high sensitivity, high reliability uncooled thermal imaging core . With advanced image processing technology, it offers excellent image quality by 320x240 resolution,17m pitch sensor. Featuring of compact design and ultra low power.
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Product
Medium Voltage Iron Core Oil-Immersed Shunt Reactor
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Iron core Oil-immersed Shunt Reactors act as an absorber of reactive power to increase energy efficiency of the power system.
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Product
Micro-ATX Motherboard 8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-506
Motherboard
Supports Intel® 8th/9th Gen Core i7/i5/i3 processor with H310 chipsetSupports up to 14 COM, 8 USB 3.0, 12 USB 2.0, TPM 1.2/2.0 (optional)Supports Dual display of VGA, DP, DVI, eDP, LVDS (optional) and two GbE LANTwo DIMM sockets support up to 64 GB DDR4 2666 MHz SDRAMSupports WISE PaaS/Device-On, McAfee, Acronis, Edge AI Suite and Embedded Software APIs
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Product
Intelligent Pluggable System Specification (IPSS) Digital Signage Player With 4th Gen Intel® Core™ I5, Intel® QM87, AMT 9.0 And TPM 1.2
OPS885
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The OPS885 is world first Intelligent Pluggable Systems Specification (IPSS) compliant digital signage player. The OPS885 adopts the 4th Generation Intel® Core™ i5 processor with the Mobile Intel® QM87 Express chipset and provides superb graphics performance with 4K resolution. It comes with Intel® Active Management Technology 9.0 (AMT 9.0) that offers convenient remote diagnosis and cost-effective maintenance. The advanced signage player also features Intel® Retail Client Manager (Intel® RCM) that integrates an easy-to-use digital signage content CMS with analytics and security features. The IPSS compliant OPS885 provides digital signage vendors a comprehensive solution, and reduces their development effort and time to market. It is excellent for various display applications in shopping mall, corporate, education, bank, transportation, retail store, restaurant, performing art center.
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Product
2-slot Fanless Industrial System With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, Front-access I/O, PCIe And PCI Slots
IPC932-230-FL
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The IPC932-230-FL is an expandable fanless barebone system with various front-facing I/O connectors. The powerful embedded system IPC932-230-FL supports LGA1150 socket for the 4th generation Intel® Core™ processors coupled with the Intel® Q87 Express chipset. Two 204-pin SO-DIMM sockets support up to 16 GB DDR3-1333/1600 system memory in maximum. To fulfill different application needs, the compact industrial PC provides two flexible PCI/PCIe expansion slots with two different combinations: one PCIe x1 and one PCIe x4 or one PCIe x4 and one PCI. Its DVI-I output on the front panel allows user to directly connect to a LCD panel and four COM ports and a DIO are provided for general industrial control. This all-in-one barebone system also has two easy-to-install 2.5 SATA HDD drive bays with RAID 0/1, and supports Intel® Active Management Technology 9.0 (AMT 9.0) to enhance overall device manageability.
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Product
X-Band Silicon Radar Quad Core IC
AWS-0105
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The AWS-0105 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and single beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain and +15 dBm output power during transmit mode and 7 dB gain and +7 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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Product
3.5" Embedded SBC With LGA1151 Socket For 7th/6th Gen Intel® Core™ I7/i5/i3 Processor, LVDS, VGA, HDMI, 2 GbE LANs And Audio
CAPA500
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The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
