Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Step & Repeat Non-Contact Inspection System for FPC and PCB
OHT-Ⅴ
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*Space-saving design and highly efficient and high-speed inspection, with top and bottom slider structure*Roller head enables to handle the reverse imposition.*Easy operation by new alignment mechanism*The machine handlingPCB is called "WSR"
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Product
Full Wafer Contact Test System
Fox 1
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Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
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Product
Ceramics and Glass Inspection Systems
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Due to their special material properties, ceramic and glass components are the basis of many high-tech products. The same properties make the production complex and costly. Substrate defects that lead to failure of finished components should be avoided at all costs. For this reason, early automated optical inspection is essential.For the inspection of sapphire and quartz glass Intego has developed systems to detect both external and internal defects and can also provide cutting suggestions. Using index matching it is possible to test rough or uneven glass profiles.For the inspection of ceramic components Intego offers solutions specifically tailored to the respective testing task. Our modular design uses standard components that have already been developed and tested and in most cases only requires minimal adaptation.
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Product
Complete GPR System for Road Inspection
RoadScan
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Geophysical Survey Systems, Inc.
The RoadScan™ 30 system provides users with an effective tool for quickly determining pavement layers at high speeds. RoadScan is able to collect data densities not obtainable using other labor-intensive methods commonly used for pavement testing.
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Product
Dual Projection 3D In-Line Solder Inspection System
KY8030-2
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The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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Product
DC Safety Inspection Device For Solar Panels
“DC Fault Tester”
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Identifies defect position instantly- contributes to saving inspection time
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Field Evaluation And Special Inspections
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Nemko offers Field Evaluation and Special Inspection Services in the US and Canada as a fast and economical alternative to traditional product safety certification.
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Building Inspection System with Moisture Hygrometer & MSX® IR Camera
FLIR MR277
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The MR277 is the first FLIR building inspection system to combine the advantages of Infrared Guided Measurement (IGM) and our patented Multi-Spectral Dynamic Imaging (MSX) with advanced environmental sensors to help you quickly locate, clearly identify, and easily document problems. IGM technology and a laser pointer isolate the area where you can use the integrated pinless moisture sensor for non-invasive readings or external pin probe for invasive measurements. With automatically calculated environmental readings and a field-replaceable humidity/temperature sensor, the MR277 lets you finish the job and minimize downtime. Connect to external devices with METERLiNK® and use FLIR Tools® to enhance troubleshooting and reports.
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E-beam Metrology And Inspection
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Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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Electrical Inspection Adapters & Accessories
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Electrical Inspection Adapters & Accessories by electro-PJP
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Product
Pinhole Detection Inspection Kit
Elcometer 270
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The Elcometer 270 Pinhole Detectors Inspection Kit utilises the wet sponge technique and has been designed to set a new standard for wet sponge detectors - a high quality, low voltage detector with similar accessories to a high voltage spark tester.
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Product
Optical Inspection System
OIS Products
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A manual optical inspection system that is able to inspect the wire-bonded leadframe or substrate.
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Product
X-Ray Inspection System
MXI Quadra 5
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Quadra™ 5 is the X-ray inspection system of choice for sub micron applications such as PCB and semiconductor package inspection, counterfeit component screening and finished goods quality control.
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Product
X-ray Inspection System
X-eye SF160 Series
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High-performance Micro-focus Open Tube with 160kV is installed and fine defects of 1㎛ are detectable. High-resolution X-ray image can be gained with world best magnification by installing high-price Open Tube as standard.Dual CT function can be purchased adtionally, and exact location & size of defects can be detected and analyzed with this function.
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Product
Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
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Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Product
Automated Optical Inspection (AOI)
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Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
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Automated Surface Inspection for Glossy Components
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Flawlessly glossy surfaces are among the most important quality features of many premium products. The smallest surface defects immediately have a degrading effect on the product. The result: disappointed end customers or buyers. At the same time, reflective surfaces are often very sensitive and a challenge for optical metrology. A manual inspection is tedious, expensive, and ultimately always governed by subjective decision criteria. During production, faulty painting or coating processes can cause high scrap rates. Defects that are not detected even during the final inspection can lead to expensive complaints and, in the worst case, to the loss of the customer. Only an efficient, automated surface inspection achieves the highest quality at acceptable costs.
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Product
IoT Data Inspection App
Data Explorer
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he Application Data Explorer allows you to easily explore, aggregate, and analyze historical data across all of the devices in an application. The data explorer can be accessed through the "Data Explorer" link in the Application navigation bar: control the time range, resolution, and aggregation of the data. determine what devices and attributes we are gathering data from. displays the data in various ways (in graph form, in table form, or in aggregation form)
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Product
Inspection & Metrology Platform
Neon
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Neon is Cohu’s next generation inspection platform optimized for small, fragile semiconductors used in automotive, consumer, industrial and medical, and mobility applications.
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Product
Wafer Thickness, TTV, Bow and Warpage
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ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
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Industrial CT X-Ray Inspection System
X5000
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The X5000 is the most versatile system offered by North Star Imaging. The system boasts a large scanning envelope and excellent ergonomics for loading sizable objects while still maintaining the sensitivity to inspect even the smallest of items.
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Automated Optical Inspection (AOI)
TR7700 SIII
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TR7700 SIII is the newest generation of TRI's AOI solutions, delivering precise multi-phase inspection at full speed. By combining an ultra-fast camera, intelligent auto conveyor, and new GUI, the TR7700 SIII offers a powerful and easy to use AOI solution with fast programming, optimized board loading, production line integration and support for offline programming. TRI's new color algorithm combined with multiple lighting phases increase defect coverage and help deliver highly accurate inspection results with a minimum of false calls.
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Leadframe Inspection Machine
IV-L200
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The IV-L200 is a leadframe inspection machine ideal for measuring leadframe dimension and pitch. Aside from identifying leadframe warpage, it is also used to detect bent or skewed leads as well as surface defects such as scratch, ink, and contamination, among others.
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Verification And Print Quality Inspection Solutions
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Integrate quality barcode verifiers within your production line using our robust barcode verification technology.
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Thickness and Flaw Inspection
NORTEC 600
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Olympus converges its latest advancements in high-performance digital circuitry and eddy current flaw detection into one compact and durable portable unit—the new NORTEC® 600. With its crisp and vivid 5.7 inch VGA display and true full-screen mode, the NORTEC 600 is capable of producing highly visible and contrasting eddy current signals in any lighting condition.
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Product
Mobile ASA-Livestream Data Node for Main Inspection
CONNECT CUBE V3 | VP 185076
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Maschinenbau Haldenwang GmbH & Co. KG.
The mobile data node is the right tool for quick and digital diagnosis of the brake system as well as for routine testing and calibration of all ASA livestream-capable brake testers. The plug & play solution can also be used for modern routine testing and calibration of brake test stands.
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Property Inspection Solution
DJI / IMGING
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Advanced DJI drone solutions for the P&C Insurance industry. IMGING™ to conduct full roof and property inspections with incredible detail in as little as ten minutes from start to finish, and they’re getting high-resolution, actionable data they can use to make informed decisions. By combining Insurance-focused workflows and patents-pending autonomous flight control technology, IMGING is making roof inspections safer, quicker, and more consistent. It’s deceptively simple, amazingly powerful, and built specifically for Insurance.
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Installation of Visual Inspection of the Inner Surface of Hollow Cylindrical Parts
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Create an installation that allows visual inspection of the inner surface of hollow cylindrical parts with the ability to display the resulting image on a personal computer monitor with its subsequent saving in the JPEG format.
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2D/3D Wafer Metrology System
7980
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Chroma 7980 provides accurate and reliable profile information. 7980 adopts new BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement.
