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Product
DDR4 MSO Probes
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The DDR4 DIIM and SO-DIMM Mixed Signal Interposers connect Address, Command and Control signals of a DDR4 bus to the Keysight V-Series Oscilloscopes with the MSO option. These interposers also provide accessibility to DDR4 signals for convenient analog probing. The user can then easily observe both the digital and analog representation of the DDR4 Address, Command and Control bus. Solder down N5541A analog probes purchased separately from Keysight Technologies.
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Product
Ultra Grade SODIMM DDR4 2666/3200
SQR-SD4E
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Ultra Wide temperature natively support -40~125C, Micron original Ultra High grade IC adopted. An underfill technique to stronger PCB and IC structural, 30u" Golden finger & Locked BOM components list. Exclusive SQ Manager software to monitor and deliver real time information.
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Product
DDR4 Parametric Test Reference Solution
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Keysight's DDR4 parametric test reference solution helps verify the signal integrity of DDR4 memory designs according to JEDEC specifications.
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Product
Memory Tester for DDR4 DIMMS
RAMCHECK LX
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USBWith the RAMCHECK LX DDR4 memory tester package (part number INN-8686-DDR4) you can quickly test and identify DDR4 DIMMs that comply with JEDEC standards. Tests are fast, reliable and easy to do. The RAMCHECK LX DDR4 package includes the RAMCHECK LX base tester and 288-pin DDR4 DIMM adapter. (This package is also available with the DDR4 DIMM Pro adapter, featuring a very rugged test socket).
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Product
DDR4 RUGGED DIMM
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A Rugged DIMM (Dual In-line Memory Module) is a specialized type of computer memory module designed to operate reliably in harsh, demanding environments that would cause standard commercial RAM to fail.
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Product
Registered DIMM DDR4 3200/2933/2666
SQR-RD4N
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100% Screening Test, Compatible with server platform, Original IC chip adopted, 30u” golden finger.
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Product
RAMCHECK LX DDR4 Memory Tester
INN-8686-DDR4
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The RAMCHECK LX DDR4 quickly and accurately tests and identifies DDR4 DIMMs for servers and desktops, as well as laptop SODIMMs.
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Product
8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
12.1" XGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-312
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Industrial-grade 12.1 XGA TFT LCD with 50K lifetime and LED backlight8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMMDual channel memory slots support up to 64G in totalCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionTrue-flat touchscreen with 5-wire resistive touch control and IP66-rated front panelSupport expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G)Diverse system I/O and isolated digital I/O via iDoor technologySupport fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologySupport TPM2.0 hardware security
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Product
DDR4 X16 2-wing BGA Interposer For Logic Analyzers, Connects To 61-pin ZIF
W4641A
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The W4641A DDR4 2-wing BGA interposer for DDR4 x16 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A the W4641A is the smallest BGA interposers for DDR4 x16 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
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Product
Micron 8G DDR4 3200 288PIN 1GbX8 REG 1.2V
96D4-8G3200ER-MI
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DDR4-3200 Registered ECC DIMM, 1.2V power consumption, Supports ECC error detection and correction. Data bus inversion (DBI) for data bus, Low-power auto self refresh (LPASR).
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Product
DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
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The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Product
LGA 1200 Intel® Xeon® W & 10th Gen. Core™ MicroATX Server Board with 4 x DDR4, 3 x PCIe, 6 x USB 3.2, 5 x SATA3, Quad/Dual LANs, and IPMI
ASMB-587
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- LGA 1200 Intel® Xeon® W and 10th Gen. Core™ i9/i7/i5/i3 processor with W480E chipset- DDR4 ECC/Non-ECC 2933/2666/2400 MHz UDIMM up to 128 GB- One PCIe x16 and 2 x PCIe x4 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 22110/2280 (SATA / PCIe compatible)- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
DDR4 SODIMM
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Small Outline Dual In-line Memory Module) is a compact type of RAM designed for devices with limited space, specifically laptops, mini-PCs, and embedded systems.
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Product
Functional/Protocol Debug and Analysis Reference Solution
DDR4
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Highest confidence in measurement accuracy! Industry’s fastest triggering and data capture for DDR4 analysis, test, and debug.
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Product
SODIMM DDR4
SQR-SD4N
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Original IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
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Product
15" XGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-315
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Industrial-grade 15" XGA TFT LCD with 70K lifetime and LED backlight.8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMM.Compact, fanless embedded system with aluminum alloy front bezel and chassis grounding protection.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Supports expansion via Full-size Mini PCIe and NVMe.Diverse system I/O and isolated digital I/O via iDoor technology.Supports fieldbus protocols via iDoor technology.
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Product
LGA 1200 Intel® Xeon® W & 10th Gen. Core™ ATX Server Board with 4 x DDR4, 5 x PCIe, 2 x PCI, 6 x USB 3.2, 5 x SATA 3, Quad/Dual LANs, and IPMI
ASMB-787
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- LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
LGA1700 12th/13th/14th Generation Intel® Core™ I9/i7/i5/i3 ATX Motherboard With DP/HDMI/VGA, DDR4, USB 3.2, M.2
AIMB-788
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Intel® 12th/13th/14th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q670E chipsetFour DIMM sockets up to 128 GB DDR4 3200Triple display DP/HDMI/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2 Gen 2Advantech iBMC remote out-of-band power management solution on DeviceOnAWS (Amazon Web Service) IoT Greengrass qualifiedNote 1: Legacy platform is not supportedNote 2: dTPM 2.0 module is required to enable Intel vPro and TPM technologiesNote 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11
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Product
Virtex UltraScale+ HBM FPGA Processor - SOSA Aligned 3U VPX
Model 5586
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- Jade 5585 and 5586 FAQ- Co-processor for distributed FPGA processing tasks- High-Bandwidth Memory (HBM) delivers 20x more memory bandwidth than traditional DDR4 solutions- Board interfaces: 1 GigE, 10 GigE, 40 GigE, dual 100 GigE and PCIe- High-bandwidth memory, FPGA logic and DSP density make this board a single-slot 3U VPX proessing powerhouse- Features Xilinx Virtex UltraScale+ HBM FPGAs- 10 GigE Interface and 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 46, VITA 48.11, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled- Navigation Design Suite for software and custom IP development
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Product
Micro-ATX Motherboard 10th Gen Intel® Xeon® Processor LGA1200
AIMB-587
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Supports Intel® 10th Gen Xeon/Core™ (Comet Lake-S) i9/i7/i5/i3 processor with Q470E/ W480E/ H420E chipsetFour U-DIMM sockets support up to 128GB DDR4 2666/2933 MHz SDRAMSupports 2 DP++, VGA(option), eDP display with Triple Display supportSupports Intel AMT 12.0 and Intel vPro competentSupports PCIE Gen3, Dual 10 GbE LAN, Dual GbE LAN, M.2(M-key) and up to 8 x SATAIIISupports 4 USB3.2 Gen2, 6 USB3.1 Gen1 and 6 USB2.0Supports SUSI,Ubuntu 20.04 LTS, WISE-DeviceOn and Edge AI Suite
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Product
1-Ch 3.6 GHz or 2-Ch 1.8 GHz 12-bit A/D with DDC, Kintex UltraScale - 6U VPX
Model 57841
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- One-channel mode with one 3.6 GHz, 12-bit A/D- Two-channel mode with two 1.8 GHz, 12-bit A/D- Programmable DDCs (Digital Downconverter)- 5 GB of DDR4 SDRAM- µSync clock/sync for multiboard synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Product
Multi-site Module Testing System
TCIII-3200ST
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TurboCATS introduces a new line of redesigned TCIII-3200ST DDR4 and DDR3 multi-site module testing system - compact, high-performance, and equiped with enhanced productivity features. The TurboCATS TCIII-3200ST module test system features an optional 8, 16 or 64 module testing, in parallel, for high throughput on your production floor.
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Product
Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, Built-in Layer 2 Managed PoE Switch For Railway PC
tBOX400-510-FL
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The tBOX400-510-FL is a two-in-one transportation-certified box PC with built-in layer 2 managed PoE switch for IP surveillance applications. The tBOX400-510-FL is certified with CE (Class A) and FCC and is in compliance with EN 50155 and EN 45545-2. This high-performance transportation box PC is powered by the 7th generation Intel® Core™ (Kaby Lake) or Intel® Celeron® 3965U processors, along with dual DDR4 SO-DIMM slots for up to 32GB of memory. The built-in 10-port managed switch is powered by Qualcomm's chip. The tBOX400-510-FL has a built-in 10-port managed switch with 8-port 10/100 Mbps PoE and 2-port Gigabit LANs, featuring VLAN, QoS and PoE scheduling for the more secure and smooth network. For reliable operation in severe environments, the rugged fanless transportation box computer is designed to withstand a wide temperature range from -40°C to +60°C and vibration of up to 3 Grms. It also supports a wide voltage input range: 9V to 36V DC for vehicle applications, 14V to 32V DC for marine applications, and 24V to 110V DC for railway applications. With its high performance, industrial-grade design and full-strict certifications, the tBOX400-510-FL is suited for transportation-related applications such as onboard video surveillance and video management.
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Product
DDR4 Pro 288-Pin DIMM Adapter
INN-8686-18-PRO
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Your best option if you need to test a large volume of memory! The RAMCHECK LX DDR4 Pro 288-pin DIMM Adapter (p/n INN-8686-18-PRO) gives RAMCHECK LX users the power to test 288-pin DDR4 modules, including unbuffered (UDIMM), load-reduced (LR-DIMM) and registered modules (RDIMM), both ECC and non-ECC, that comply with JEDEC standards. It includes the DDR4 Series adapter and DDR4 Pro DIMM test head.
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Product
2U Rackmount Network Appliance Platform Based On Intel® Xeon® E3 Series And 6th/7th Generation Intel® Core™i7/i5/i3 Processors
FWA-4130
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Intel® Xeon® E3 Series and 6th/ 7th Generation, Intel® Core™i7/ i5/ i3 Processors4 x DDR4 2133/ 2400MHz ECC UDIMMs, up to 64GB4 x Advantech network module expansions1 x PCIe x8 slot on rear, supports FH/HL add-on cards1 x mSATA slot, 2 x 3.5" HDD bay, CF slot (optional)IPMI2.0 compliant remote management (optional)
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Product
8-Channel 200 MHz A/D with DDC, Kintex UltraScale FPGA - 6U VPX
Model 58861
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Eight 200 MHz 16-bit A/Ds- Eight multiband DDCs (digital downconverters)- 10 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
Expandable Embedded Box IPC With 10th Gen Intel® CPU
UNO-348
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Intel® 10th Gen socket type processor with DDR4 memoryScalable CPU, RAM selectionCompact, rugged and fanless design for harsh embedded environmentFlexible expansion with up to 3 x PCIe/PCI slots, 1 x M.2 (B-key), 1 x mPCIe & 2 x 2.5" SSDOptional iDoor expansionRemote out-of-band (OOB) power management with Advantech’s iBMC technologyBuilt-in TPM2.0 for hardware-based security
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Product
Micro-ATX Motherboard 8th/9th Gen Intel® Xeon® E3 Processor LGA1151
AIMB-586
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Supports Intel® 8th/ 9th Gen Xeon/ Core™ i7/i5/i3 processor with Q370/C246/H310 chipsetFour U-DIMM sockets support up to 128GB DDR4 2400/2666 MHz SDRAMSupports HDMI2.0a(option),2 DP++,eDP/LVDS(option) displaySupports Intel AMT 12.0 and Intel vPro competentSupports PCIE Gen3, 4 USB3.1, 10 x USB2.0/USB 3.0, upto 4 x SATAIII and quad GbE LAN, M.2(M-key),M.2(E-key)Supports Software RAID 0, 1, 5, 10, TPM 1.2/2.0 (optional)Supports SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
Universal Network Appliance With Intel® Atom™ Processor C3000 For VE-CPE And SD-WAN. Ideal For SD-WAN Deployments.
FWA-1012VC
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Intel® Atom® C3000, up to 8 Cores, with Intel® QuickAssist Technology2 x DDR4 DIMM slots, up to 64GB2 x 1GbE SFP + 6 x RJ-45 slots4G LTE and Wi-Fi supported (optional)Reserve 1 x SATA3.0 SSD/ M.2 3042 LTE module and 1x Mini-PCIe for Wi-Fi module (optional)2 x PoE supported (optional)
