Wafer Level Reliability
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Product
Probe Card
T90™ Series
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The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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Product
MPI Automated Probe Systems
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MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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Product
Semi-Automated Probe Stations
SPS 2600, SPS 2800, and SPS 12000 Series
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The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
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Product
Multisite Probe Card
T300 ButtonTile™
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The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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Product
Probe Card
VC20E Series
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The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
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Product
Probe Card
VC43™/VC43EAF™
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VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
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Product
Wafer Level Test Handler
Kronos
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Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Product
System to Handle Wafer Levels
AMI AW Series
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Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
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Product
Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Product
Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
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The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Product
Wafer Level Multi-Die Test System
ITC55WLMD
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The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Product
Level Measurement & Level Sensors
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With so many technologies, products and parameters to consider, selecting the best technology for level measurement can be challenging. Choose from the comprehensive Rosemount portfolio of level devices for the best solution for your level application.
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Product
Level Sensors
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Intelligent solutions for level and point level measurementWhether for continuous level measurement, point level measurement or both – SICK offers a wide range of solutions for process engineering, storage, and protection. Based on the installation situation, medium properties, and environmental conditions, SICK provides sensors that ensure efficient processes. As the provider of one of the broadest technology portfolios, SICK brings its knowledge to the forefront.
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Product
WDXRF Wafer Analyzer
2830 ZT
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The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Product
Wafer Demounting And Cleaning Machines
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Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Product
Wafer Level Test
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Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Product
LED Tester For Chip And Wafer
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Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
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Product
Reliability & Enviromental Testing
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NCEE Labs has been providing industry-standard reliability and environmental testing for 20 years. Our experienced testing staff can assist you in determining the type or level of reliability/environmental testing you require for your products!
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Product
Level Measurement
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Displacer level gauge for liquids from KOBOLD Instruments operates on the Archimedes principle. The level gauge's displacer tube rests inside the tank and is connected to the measuring unit via a spring. As liquid level increases, the buoyant forces of the liquid act on the displacer tube to reduce spring tension, allowing the spring to expand. The spring connects to a magnetic actuator, and the motion of the actuator is picked up by a magnetically linked indicator to yield the tank level measurement. The displacer level gauge is calibrated at the factory for the user's specified liquid density. Special designs with higher pressure or temperature ratings, as well as those made of exotic materials, are always available on request.
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Product
MBP Reliability Module MOSRA - TMI
W8614EP
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The W8614EP Model Builder Program (MBP)Reliability Module MOSRA - TMI includes the extraction package for MOS Reliability Analysis (MOSRA) and the TSMC Model Interface (TMI) aging model.
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Product
Ultrasonic Level Measurement
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Ultrasonic technology is a perfect choice for level applications that require low cost, non-contact measurement of liquids and slurries for level, distance, volume and open channel flow. These products have excellent accuracy and will handle measurements up to 30’.
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Product
Manual Contactless Wafer Detector
HS-NCS-300
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Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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Product
Sound Level Meters
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Digital Sound Level Meter is a multi-function instrument. It measures both the A and C weightings. It is excellent for checking noise levels to remain in standards of compliance and has many other applications.
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Product
Sound Level Meter
831-LOWN
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Easily make low noise measurements to 6.5 dB A-weighted using the Model 831-LOWN sound level meter paired with the 378A04 low noise microphone and preamplifier. Due to the innovative design of the 378A04 which uses a prepolarized microphone and ICP (constant current) interface, the combination produces a highly portable system that is battery powered and intuitive to use for measuring low noise levels.
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Product
Wafer Probe Test System
STI3000
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The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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Product
Signal Level Meters
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The SignalScout (SS40) provides fast and accurate measurement of signal strength when tuning an antenna for a local TV channel.
