Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
Industrial Flash & Memory Solutions DDR3 Memory
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SQRAM offers DDR3 memory modules with Samsung or Hynix chips and DDR3L of low voltage 1.35v backward to 1.5V compatible with Intel and AMD platforms.
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Product
Module Spectrum
nRF52810 Series
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Nordic nRF52810 solutioin features an Arm Cortex-M4 processor with 192 KB Flash and 24 KB RAM with 32 GPIO available. Supports SPI, UART, I2C, PWM interfaces with both Chip Antenna and PCB Antenna option for selection.
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Product
Fixed Clamp-on Flowmeter
D116
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Gentos Measurement & Control Co.
D116 Series Ultrasonic Flowmeter is a state-of-the-art universal transit-time flowmeter designed using FPGA chip and low-voltage broadband pulse transmission.
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Product
Module Spectrum
nRF52811 Series
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Raytac nRF52811 module employed MDBT42Q series design is a hardware pin to pin compatible to nRF52832 & nRF52810 solution with both Chip Antenna and PCB Antenna option for selection.
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Product
Caibration Equipment For Lab Use
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In the field of high-power semiconductor testing, PONOVO has launched a smart test platform with high-speed high-frequency, high-voltage, high-current power sources, combined with high-speed, high-precision high-voltage, high-current analog acquisition technology and high-speed digital processing control system. The platform can complete the testing of dynamic parameter parameters, static parameters, thermal parameters and mechanical parameters, and power life parameter of various types of high-power semiconductor devices, modules, and chips, which could meet different testing requirements. It is the universal testing platform for automated testing for different application purpose, such as the research and development testing, engineering acceptance test, factory acceptance test, etc.
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Product
Source Signature Recorder
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*GPS accuracy for time break collection and source equipment locations.*32-bit, high speed, ADC chip for lower noise and increased accuracy for signatures.*Operates independently of crew, including observer and shooter or operators.*Can be used with any Vibrator Control System.*Great for monitoring rental equipment and operators.*Provides accurate start times that can be used with any nodal recording system.
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Product
4K UHD Fanless Edge Computer
UBX-110K
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The UBX-110K is a 4K UHD fanless edge computer powered by an Intel® N97 or Core™ i3-N305 processor. Built-in an Intel® N97 or Core™ i3-N305 processor, Built-in a TPM 2.0 chip for data encryption enhancement. Supports triple displays to expand the visible range and provide detailed video content. Supports two M.2 2280 SATA SSD expansions.
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Product
Specific Gravity Tester
LD-LSGT-A10
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Specific Gravity Tester LD-LSGT-A10 determines the theoretical maximum specific gravity of bituminous mixtures in accordance to ASTM D2041 Standard Test Method for Theoretical Maximum Specific Gravity of Bituminous Mixtures (Vacuum process). Adopted with single chip machine technology to shake a loose asphalt mixture sample submerged in water. Vacuum is applied into the sample, to extract out the air bubble.
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Product
Socket with Collet Contacts
Correct-A-Chip
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Correct-A-Chip with Collet Contacts. Correct-A-Chip technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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Product
Digital I/O Cards
104-DIO-48E
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The circuits use an 82C55A PPI with mode 0 supported. Ports A, B and C are buffered with 74ABT245 transceivers and pulled up to 5V. The optional 82C54 has three-sixteen bit down-counters within one chip. These counters are useful for making frequency outputs, measuring frequency of square waves, pulse width outputs, pulse width measurements etc. Software drivers are provided on CD.
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Product
Precision Shunt Chip Resistors
SMV
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*5W permanent power at 65C*High pulse power rating*Mounting: Reflow and wave-soldering
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Product
Software
DPM-3
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Was developed to read and edit Plug and Play Smart Sensors that are compliant to the IEEE 1451.4 Standard. TEDS, or transducer Electronic Data Sheet, is a set of electronic data in a standardized format defined within the IEEE 1451.4 standard. This data specifies what type of sensor is present, describes its interface, and gives technical information such as sensitivity, bridge type , excitation, etc. This information is stored in an EEPROM chip attached to the sensor. By having this chip, the sensor can identify and describe itself to the network and or Smart Load Cell Meter (DPM-3), thereby easing automatic system configuration.
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Product
Mems-Based Probe Cards
MEMSFlex
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Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Product
Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, Built-in Layer 2 Managed PoE Switch For Railway PC
tBOX400-510-FL
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The tBOX400-510-FL is a two-in-one transportation-certified box PC with built-in layer 2 managed PoE switch for IP surveillance applications. The tBOX400-510-FL is certified with CE (Class A) and FCC and is in compliance with EN 50155 and EN 45545-2. This high-performance transportation box PC is powered by the 7th generation Intel® Core™ (Kaby Lake) or Intel® Celeron® 3965U processors, along with dual DDR4 SO-DIMM slots for up to 32GB of memory. The built-in 10-port managed switch is powered by Qualcomm's chip. The tBOX400-510-FL has a built-in 10-port managed switch with 8-port 10/100 Mbps PoE and 2-port Gigabit LANs, featuring VLAN, QoS and PoE scheduling for the more secure and smooth network. For reliable operation in severe environments, the rugged fanless transportation box computer is designed to withstand a wide temperature range from -40°C to +60°C and vibration of up to 3 Grms. It also supports a wide voltage input range: 9V to 36V DC for vehicle applications, 14V to 32V DC for marine applications, and 24V to 110V DC for railway applications. With its high performance, industrial-grade design and full-strict certifications, the tBOX400-510-FL is suited for transportation-related applications such as onboard video surveillance and video management.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
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The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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Product
Rugged SODIMM DDR4 2666/3200
SQR-YD4N
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Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
Spectrometer - OSA
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HighFinesse optical spectrometers LSA and HDSA are designed to analyse the multi-line or broadband spectrum of (un-)known light sources like cw and pulsed lasers, gas discharge lamps, super luminescence diodes, semiconductor laser diodes and LEDs. They are suitable to analyze the spectrum of telecom signals, resolve Fabry-Perot modes of a gain chip, and produce a spectral measurement of gas absorption.
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Product
Ultrasound Pulser ICs And HV Multiplexers
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ST's Ultrasound Imaging IC Solutions offer a complete range of integrated high-voltage transmitters from quad and octal, to the latest device, the state-of-the art STHV1600 ultrasound pulser IC, to high-voltage multiplexer IC, the STHV64SW, a 64-channel, high voltage analog independent switches. ST’s proprietary BCD6s-SOI and BCD8sSOI process technologies enable the combination of low-voltage CMOS logic, precise analog circuitry, and robust power stages on the same chip, offering unprecedented level of integration.
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ALD Applications
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Atomic Layer Deposition (ALD) has the potential to optimize product design across a wide array of applications from making silicon chips run faster, to increasing the efficiency of solar panels, to improving the safety of medical implants.
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Product
Battery Management Chip Module
Sentinel
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The first single system on chip module. Measures cell voltage, cell internal temperature and cell impedance.
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Product
SMT Rework Station
RW1210
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Safely and precisely rework SMD, BGA, or LED chips. This all-in-one solution covers rework needs for even the most complex, densely populated PCBAs. Yet it is easy to use, enabling technicians to quickly master delicate alignment, placement, and heating controls.
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Product
Solid State Power Amplifiers
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Skylink SSPAs incorporate state-of-art DPD and well-done Heat Dissipation technologies with available LDMOS, GaN & GaAs Chips. Solutions of SSPA frequency range from 9kHz to 50GHz and output power up to kilowatts and includes basic PA modules to integrated chassis with embedded software for local and remote control and monitoring.
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Product
8G DDR5-5600 1GX16 1.1V SAM -20~85℃
AQD-D5V8GN56-SCH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
Chip-Type Attenuators
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Panasonic Industrial Devices Sales Company of America
Chip-Type Attenuators for high-frequency signal attenuation, level adjustment or matching improvement.
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Product
Chips and Diodes
NC100/200/300/400 Series
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Noisecom's noise diodes are the fundamental building blocks for analog noise systems. They are sorted for performance characteristics that enhance their broadband noise output and flat spectral response. All Noisecom noise diodes can deliver symmetrical white Gaussian noise and flat output power versus frequency
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Product
Intelligent Stirrer
Model 901
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Intelligent chip design. Ability to set and store the stirring rate. Ability to switch between two kinds of stirring speed after pressing “PRM” button.Options of AC and DC. Applied in the field or in the incubator. MoreIntelligent chip design. Ability to set and store the stirring rate. Ability to switch between two kinds of stirring speed after pressing “PRM” button.Range: 0 to 2300 R/M (no load)Nice appearance, transparent coping designused with AC or DC, and a battery low voltage alarmused in lab, in incubator and brought outdoorsEquipped with strut and electrode holder, it can be used as agitating arc-spark standIP54 dustproof and splash proof.
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Product
Dicing Machines
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Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
