Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Probe Series
AVIOR Series
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The MPI AVIOR series offers a broad lineup of high performance prober systems targeting the Optical Communications market. Our prober systems are available in Top emitting (TP), Flip chip (FP) emitting and Die/Package (DP) configurations to meet your specific test requirements. Whether it be R&D or mass production, MPI has a solution that will meet your needs for accurate and reliable measurements in conjunction with a reduced cost-of-test.
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Product
Photonic Device Testing
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ficonTEC’s series of photonic device testing machines is focused on automated electrical, optical or mixed-signal electro-optical characterization (test-&-qualify) of chips and dies, opto-electronic assembles and integrated devices. Capability includes PIC design validation and device verification.
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Product
Dry Systems
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Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
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Product
Module Spectrum
nRF51822 Series
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Raytac nRF51822 module provides 16K & 32K RAM option with Chip Antenna & PCB Antenna for selection.
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Product
Generates Test Cases on ICE
TrekSoC-Si
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TrekSoC-Si automatically generates self-verifying C test cases to run on the embedded processors in SoCs in in-circuit emulation (ICE), FPGA prototyping, and production silicon. This verifies your chips more quickly and more thoroughly than hand-written diagnostics or running only production code on the processors. TrekSoC-Si's generated test cases target all aspects of full-SoC verification and work in a variety of different environments. TrekSoC-Si is a companion to TrekSoC, which generates test cases for simulation and acceleration. TrekSoC-Si extends the benefits of TrekSoC into hardware platforms.
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Product
Thermal Test Chip
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Thermal Engineering Associates, Inc.
Thermal Test Chips (TTC) are used in many different Applications: Package Thermal Characterization, Heat Source Simulator, Temperature Reference Platform, Transient Analysis, System Thermal Management Design, Thermal Interface Material (TIM) Measurement & Characterization, Heat Sink Measurement & Characterization.
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Product
COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
Computer on Module
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Product
SparkFun LTE GNSS Breakout
SARA-R5
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The SparkFun SARA-R5 LTE GNSS Breakout is a robust development tool for u-blox's impressive SARA-R510M8S module. The SARA-R510M8S combines u-blox's UBX-R5 cellular chipset with their M8 GNSS receiver chipset to provide a 5G-Ready wireless IoT device complete with positioning data all on a single chip. As an asset tracker, the LTE GNSS Breakout offers Secure Cloud LTE-M communication for multi-regional use and has an integrated u-blox M8 GNSS receiver for accurate positioning information.
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Product
Dicing Machines
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Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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Product
Multi Socket Programmers
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Gang programmers are based around the universal programmers but offer multiple sockets allowing 4 or more devices to be programmed at the same time giving a greater throughput where a large number of devices require programming. Mass production environments churning out tens of thousands of chips a week are where these programmers are typically found.
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Product
Smart Lighting
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The AS721x/AS722x are complete System-on-Chip (SoC) sensor-integrated IoT smart lighting managers for color-tunable white lighting applications. They also support daylight harvesting and color/lumen maintenance lighting applications. 0-10V control and network-enabled high-level command inputs are combined with industry-standard PWM and 0-10V outputs for direct control of LED power systems.
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Product
PXIe I/Q Arbitrary Waveform Generator, 16 bit, 540 MHz, 3 Scalar Channels
M9336A
Waveform Generator
The M9336A AWG delivers exceptional performance for creation of complex wideband waveforms. Multiple, 540 MHz bandwidth channels with 16-bit resolution and up to a 1.28 GSa/s sampling rate are provided in a single-slot PXIe instrument. This enables the AWG to generate wide bandwidth signals with low Error Vector Magnitude (EVM), making it ideal for creating baseband waveforms for wireless communications, radar, and satellite. The M9336A can also be combined with a wideband I/Q upconverter, resulting in modulation bandwidths of 1 GHz at RF frequencies for signal simulations employed in functional testing of chip sets designed for modern digital communications radios.
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Product
Molded Interconnect Subtrate
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A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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Product
2MP Wide Temperature Range Industrial Grade HDR Camera
e-CAM20_CU0230_MOD
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e-CAM20_CU0230_MOD is a 2MP high performance, HDR Camera Module with excellent low light performance. It is based on AR0230AT CMOS Image sensor from ON Semiconductor®. It has an ability to stream seamlessly at wide temperature range (-40 to 105°C) which is suitable for Automotive application. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. e-CAM20_CU0230_MOD has a dedicated, high-performance Image Signal Processor chip (ISP) that performs the entire Auto functions (Auto White Balance, Auto Exposure control).
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Product
cRIO Modules
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The cRIO technology (RIO = reconfigurable I / O) from National Instruments enables the creation of customized measurement and control hardware circuits based on FPGA chips using the NI LabVIEW graphic development tool. The cRIO core comprises an FPGA chip and surrounding circuits that allow LabVIEW to perform a hardware synthesis.
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Product
Radar Core Chips
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Macom Technology Solutions Holdings Inc.
Multifunction GaAs and Silicon MCM designed for communication radar and weather applications. MACOM Core Chips deliver a complete transmit/receive function with phase and amplitude control.
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Product
Circuit Card Assembly
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Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
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Product
Big Easy Driver
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The Big Easy Driver, designed by Brian Schmalz, is a stepper motor driver board for bi-polar stepper motors up to a max 2A/phase. It is based on the Allegro A4988 stepper driver chip. It's the next version of the popular Easy Driver board.
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Product
RFSoC Board
VP431
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VP431, the next generation of our highly successful VP430, is a 3U VPX commercial off-the-shelf direct RF processing system that features the 3rd-generation Xilinx Radio Frequency System-On-Chip (RFSoC). The VP431 maximizes I/O channel density, reduces the radio frequency signal chain complexity, and allows for heterogeneous processing capability.
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Product
Thermal Test Vehicles
TTV
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Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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Product
24-Channel Digital I/O With Digital Integration Features On M.2
M.2-DIO-24A
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The M.2-DIO-24A is an M.2 card, and optional cable assembly (D-Sub 37-pin Male connector) designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program. This also allows for simple and trouble-free migration from other ACCES PCI and PCI Express digital I/O cards, but also provides for advanced features enabled by the onboard FPGA logic.
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Product
Phototransistors
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Phototransistors are photodiode-amplifier combinations integrated within a single silicon chip. The phototransistor can be viewed as a photodiode whose output current is fed into the base of a conventional transistor. These photodiode-amplifier combinations are put together to overcome the major limitation of photodiodes: unity gain. The typical gain of a phototransistor can range from 100 to over 1500.
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Product
PCI Express Digital I/O Cards With Counters And COS Detection
PCIe-DIO-24DCS, PCIe-DIO-24DC, PCIe-DIO-24DS, and PCIe-DIO-24D,
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This product is a x1 lane PCIe DIO board available in four models ranging from basic DIO to advanced COS detection and Counter/Timer capabilities. The card emulates an 8255 compatible chip, providing 24 DIO lines. The DIO lines are grouped into three 8-bit ports: A, B, and C. Each 8-bit port is configured via software to function as either inputs or outputs. Port C can be further broken into two 4-bit nybbles via software and configured as either inputs or outputs.
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Product
SMD/Chip Resistors
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Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide range of SMD/Chip Resistors including conventional Thick Film and Precision Thick Chip Resistors as well as specialized Resistors such as Thin Film, Metal Film Chip, Current Sense and more.
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Product
CMOS Cameras
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A digital still or video camera that uses a CMOS-based image sensor chip rather than a CCD to record the picture.
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Product
Laser Diode
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Is a Polarization Maintaining CWDM Coaxial DFB-LD for CWDM analog communication, CATV return-path, laboratory instrument, and R&D applications. This cost-effective, high reliability DFB laser chip has a selectable wavelength with range between 1270 nm to 1610 nm. The versatile DFB-CWDM also features a built-in InGaAsP monitor photodiode, built-in optical isolator and 4-pin coaxial- pigtailed package, single mode coupling, and an FC/APC connector. Contact Optilab for more information.
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Product
Reliability Testing
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ELES Semiconductor Equipment SpA
ELES designs and manufacturers reliability test solutions to verify the performance of integrated circuits from concept validation to high volume production during all the test phases. No other company can provide universal equipment for all the reliability tests, or can guarantee a seamless data flow between phases or can apply on chip embedded reliability engineering for data tracking and failure investigation. Clients use our functional test data to proactively analyse variations between lots, between temperature extremes and during lifetime (often these defects escape ATE). The improvements to products and processes needed to arrive at zero defects cannot be driven by the quantity of Big Data alone, the quality of reliability data is a strategic advantage that only ELES can provide.
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Product
COM Express Type 6 Basic Module With 5th Gen Intel® Core™ I7 & 4th Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® QM87
CEM880
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The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.
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Product
KV CAPS
500 V
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Macom Technology Solutions Holdings Inc.
The MACOM KV CAPSTM Si high voltage capacitors feature very high working voltage ratings, very low loss and excellent stability by virtue of their novel internal construction and very high-quality dielectric layers. These capacitors are available as unpackaged chips. The chips have gold bonding surfaces on both terminals to enable excellent bonding and minimum contact resistance.
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Product
Radio Module (2x2)
SX-PCEAC2
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The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the QCA6174-5, which features 2x2 wave 2 MU-MIMO technology. It is a dual-band 802.11 a/b/g/n/ac module with Bluetooth support which is designed for devices that require wireless connectivity in a small form factor combined with high performance with throughputs reaching up to 867Mbps.
