Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip
LEC-BTS
Computer on Module
- Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip- Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)- HDMI and LVDS- GbE, camera interface- 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO- Extreme Rugged™ operating temperature: -40°C to +85°C
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Product
500-1000W AC Power Source
CX-P150
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Shenzhen Chuangxin Instruments Co., Ltd.
The AC power source is made by adopting microcomputer processing chip and high power device. It provides a stable pure sine wave and has voltage,
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Product
Alchitry Au+ FPGA Development Board (Xilinx Artix 7)
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The Alchitry Au+ is the "gold" standard for FPGA development boards and it's possibly one of the strongest boards of its type on the market. The Au+ substitutes a more robust & scalable FPGA chip (Xilinx XC7A100T) that allows for more complex application circuits. The number of Configurable logic blocks (LABs/CLBs), Logic Elements, and total RAM bits are all nearly 3x that of the standard Au; see "Features" for more details.
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DIP Test Clips
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Low-profile fine-pitch chips, desnely populated boards, or vertical boards, Pomona test clips connect you with confidence.
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32+2 Channel 12bit 5 GS/s Switched Capacitor Digitizer
V1742
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12 bit @ 5 GS/s, 1-unit wide 6U VME64 module, Switched Capacitor technology based on the DRS4 chip (designed at Paul Scherrer Institute) 1024 capacitor cells per channel (acquisition window of ~ 200 ns @ 5 GS/s)
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PIN Diodes
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The SemiGen SGP7000 series of PIN Diodes are processed with a high-resistivity epi that have intrinsic layers that range in thickness from 4 micron to 200 micron depending on performance specifications. These devices are typically manufactured with either a robust thermal-oxide passivation or ceramic glass for durable high-power applications. These diodes are made with a grown junction P++ layer that yields abrupt junction structures that provide low punch through voltages and minimize autodoping. They are available as chips or in your choice of packages.
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Embedded Boards
UltraZed Family
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Embedded boards are boards with processors, multiple integrated circuits, interfaces and other essential components assembled on it to serve a dedicated function. Embedded boards comprise multiple technologies, including processors, core logic, networking, connectivity, and multimedia components to provide functionality and performance for embedded system design applications. Embedded boards and solutions are normally employed to ensure a faster time to market for the developer. Applications of embedded systems vary from tiny portable devices, to large commercial and industrial installations, and even largely complex systems like medical or military or aviation purposes. Embedded boards can have single MCU chip or multiple MCUs depending on the complexity of application.
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Encoders
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DekTec encoder cards use hardware compression chips to achieve very low CPU overhead. Ideal for converting the output of your video-generating application to H.264 in real-time, without consuming precious CPU cycles.
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Chip Test Adapter
SOJ EDO/FPM
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Our new addition to the RAMCHECK line provides support for common 20 to 42-pin EDO/FPM DRAM SOJ chips of sizes 256Kx16/18, 1Mx16/18, 8Mx8, 16Mx4, 2Mx8, 4Mx4, 16Mx1, 1Mx4, and 4Mx1.
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Product
Video Signal Generator
MSPG-6100L
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MSPG-6100L is basically supporting the Teletext and Closed Caption as multi broadcast for the D-TV9NTSC, PAL), as well as V-Chip (Violence Chip) function to block the violence and sex, etc. bad program to protect a person under age through the regulation grade.
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Up Converters
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Macom Technology Solutions Holdings Inc.
MACOM's upconverters are widely used in point-to-point radio, broadband communications, and RADAR applications. Operating up to a frequency of 86 GHz, our upconverters feature an integrated image reject (balanced) mixer, LO buffer, and RF buffer. Some products also include LO multiplication and variable gain, all within a single chip. Available in die, or SMT lead-free QFN and LGA packages, our upconverters boast excellent performance with adjustable bias, high linearity and image rejection with low LO leakage
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Product
Solar power Controller
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The controller computer chip on the battery voltage, solar battery voltage, discharge current, ambient temperature and other parameters of sampling, through a dedicated control chip basis, the realization of the battery discharge rate and temperature compensation for high accuracy control of the amendment, and intelligent and efficient use of pulse-width modulation (PWM) charging vague way to recharge batteries to ensure the batteries work in the best condition, significantly extended battery life.
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WLCSP Probe Heads
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Smiths Interconnect offers Wafer Level Chip Scale Package (WLCSP) Probe Heads utilizing spring probe technology which provide high parallelism in test, superior signal integrity and high speed / RF testing capability.
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Storage Technologies
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We engage with companies across the storage landscape, from flash memory chips used in mobile devices to massive cloud data centers. And here is how!
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IF/RF Receivers
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IF and RF Receivers are designed for communications infrastructure applications. Wide input bandwidth and high sample rates allow digitizing close to the antenna. Various receiver architectures, such as zero-IF, IF sampling to direct RF receivers, are supported and available on chip post digital signal processing can be used to offset demands in the FPGA or digital ASIC and ease analog filtering.
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Semiconductors
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Multiphysics Analysis Solutions for Chips and 3D IC Systems. Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification.
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Metrology
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KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.
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RF/Microwave Assembly Capability
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Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Wafer Level Test
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Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
Optical Voltage Probe
400-02
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Srico’s optical voltage probe uses advanced, proprietary optical chip technology to achieve precise, interference-free measurement. Our sensor and optical fibers are made of dielectric materials. This facilitates a high degree of isolation between the voltage test point and the instrumentation system ⎯ at a safe distance of 100 meters and more. This system senses, measures, and transmits electrical data very accurately.
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Extreme Rugged PC/104-Plus, PCI-104 Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM3-BT4
Single Board Computer
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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Solid State Power Amplifiers
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Skylink SSPAs incorporate state-of-art DPD and well-done Heat Dissipation technologies with available LDMOS, GaN & GaAs Chips. Solutions of SSPA frequency range from 9kHz to 50GHz and output power up to kilowatts and includes basic PA modules to integrated chassis with embedded software for local and remote control and monitoring.
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Diode Arrays
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a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100 % Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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UV Sensors
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With analog (4-20mA, 0-5V, 0-10V) or digital (USB, Modbus) output, also available with Android device (incl. app). SiC photodiode chip based Broadband UV sensitivity or filtered for UVA, UVB, UVC or UV-Index spectral sensitivity. Our sensors are also available with logarithmic signal transduction, linearity from 0 … 1500 mV. Calibration services available at our Berlin facility prior to delivery and after use
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MIPI Video Devices
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The abundance of the MIPI® interface in mobile applications has driven its proliferation into other application areas such as the automotive and broader consumer environments. Analog Devices, an established provider of video products, offers a range of MIPI video devices that provide interfaces to the latest generations of system on chip (SoC) processors. Typical applications for MIPI video devices include the rear-view camera function in the automotive environment and HDMI® output from portable devices featuring a MIPI-capable SoC. The MIPI video device portfolio offers a variety of solutions.
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Product
Arduino CAN Shield
IFB-10003-IWP
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CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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Product
Tantalum-Polymer
POSCAP™
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Panasonic Industrial Devices Sales Company of America
Panasonic POSCAP™ Solid Electrolyte Chip Capacitors offer stable capacitance at high frequency and temperature, with low-ESR/ESL. These Capacitors utilize a sintered tantalum anode with a proprietary high-conductivity polymer cathode. Panasonic's innovative construction and processing yields one of the lowest ESR levels in Tantalum-Polymer Capacitor technology, while exhibiting excellent performance in high frequency applications. POSCAP Capacitors are available in various, compact package sizes for a small PCB footprint while offering high volumetric efficiency for capacitance. In addition, Panasonic’s POSCAP parts demonstrate high reliability and high heat resistance, making them the ideal Chip Capacitor for digital, high-frequency devices and more.
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IPhone Data Recovery Tool
iPhone Jig (several chips)
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iPhone and iPad is special with its system.encrypted with several chips;once they get damaged(can't boot or start),it is hardly to get data back.
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JTAG (and IJTAG) Environment Tool Suite
SAJE
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SAJE is the SiliconAid Suite of JTAG related standards focused tools for chip development, verification, validation and patterns generation of ATE, Board, and System Test. Each tool can be used as a point tool by itself to compliment other tools in your flow. However, the SAJE Tool Suite used together in a flow can provide a total solution that also leveraging previous steps for debug and analysis.
