Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Product
Linux-based Development Platform For The GridARM™ ΜController
PEAK gridARM Evaluation Board
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The ARM7 microcontroller gridARM™ was developed by Grid Connect® as a system on a chip solution (SoC) for the implementation of embedded applications with a focus on industrial communication. The Evaluation Board PEAK-gridARM is a Linux-based development platform for the gridARM™ microcontroller. It has connections for Gigabit Ethernet, high-speed CAN, USB 2.0, RS-232, SPI and I²C. The digital and analog inputs of the evaluation board can be manipulated with buttons and potentiometers. The states of the microcontroller, the supply and the message traffic are displayed via LEDs. A board support package for Linux enables access to the hardware resources of the PEAK-gridARM evaluation board.
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Product
High Speed Spectroscopy Camera
SynapsePlus CCD
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Superfast electronics (up to thousands of spectra per second). Very low read noise. Best linearity in its class. Different chip types to suit every spectroscopy need. Open Electrode (OE) 1024 x 256 pixels, Front-illuminated UV enhanced (FIUV) - 2048 x 512 pixels, Front-illuminated visible (FIVS) - 2048 x 512 pixels, Back-illuminated UV enhanced (BIUV) - 1024 x 256 and 2048 x 512 pixels, Back-illuminated visible (BIVS) - 1024 x 256 and 2048 x 512 pixels, Back-illuminated deep depletion (BIDD) – 1024 x 256 pixels.
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Product
Thermal Conductivity Gas Analyzer
CI2000-RQD
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Shanghai ChangAi Electronic Science & Technology Co.,Ltd
Determining gas concentrations by measuring the thermal conductivity of the gas, CI2000-RQD analyzer uses advanced thermal conductivity sensor with single chip technology. It adopts platinum thread as sense organ to make up Imbalance Bridge, which output signal has a relationship with tested gas volume. And the single chip will magnify, sieve wavelength, modify linearly and criteria the signal by electric procedure.
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Product
Video Signal Generator
MSPG-3233RT
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MSPG-3233RT is basically supporting the Teletext and Closed Caption as multi broadcast for the D-TV(NTSC, PAL), as well as V-Chip(Violence Chip) function to block the violence and sex etc. bad program to protect a person under age through the regulation grade.
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Product
PCIe Gen 4.0 RAID Adapter
MegaRAID 9560-8i
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The MegaRAID 9500 series is the industry’s first PCIe Gen 4.0 RAID adapter family, offering PCIe Gen 4.0 host and storage interfaces. The MegaRAID 9560-8i adapter, based on the SAS3908 high-port count PCIe 4.0 x8 RAID-on-Chip (RoC), delivers twice the performance of previous generations.
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Product
High Precision Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
EUV Lithography
NXE systems
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NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.
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Product
32GB R-DDR5 5600 R-Dimm 2GX8 1.1V SAM
AQD-D5V32GR56-SB
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SAM Original Chip, Industrial Design for Improved Reliability, Compatible with server platform, 30u” golden finger, Operating Temperature: 0°C ~ 85°C.
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Product
Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
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The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
SoC Verification
TrekSoC
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TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
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Product
Storage Technologies
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We engage with companies across the storage landscape, from flash memory chips used in mobile devices to massive cloud data centers. And here is how!
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16GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-D5V16GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Single Channel Detectors
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Infrared detectors for gas analysis, flame detection and radiometry in TO18 or TO39 packages.Housing types TO18 and TO39Voltage or current modeSignal processing with JFET or operational amplifierThermally compensated (optional)With special chip holder for reducing the microphonic sensitivity (optional)
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Product
Cryogenic Temperature Sensors
Cernox®
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Cernox® thin film resistance cryogenic temperature sensors offer significant advantages over comparable bulk or thick film resistance sensors. The smaller package size of these thin film sensors makes them useful in a broader range of experimental mounting schemes, and they are also available in chip form. They are easily mounted in packages designed for excellent heat transfer, yielding a characteristic thermal response time much faster than possible, with bulk devices requiring strain-free mounting. Additionally, Cernox sensors have been proven very stable over repeated thermal cycling and under extended exposure to ionizing radiation.
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Product
8G DDR5-4800 288Pin 1GX16 1.1V Unbuffered Samsung Chip
AQD-D5V8GN48-SC
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Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
(IoT) Wireless Module
SX-59HLS
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The SX-59HLS is an ultra-low power Hosted Dual Band 1x1 802.11a/b/g/n Internet-of-Things (IoT) wireless module based on the Qualcomm QCA4012-2 System-on-Chip (SoC). The SX-59HLS is a first in its class to provide enterprise security for today’s high performing networks.
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Product
.13u ESD diode
Impulse TSMC
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The Impulse TSMC .13u ESD diode was made to provide ESD discharge paths when integrating third party IP in an integrated circuit design for total ESD protection. The Impulse ESD diode has been successfully used with Dolphin Technologies, Artisan/ARM, TriCN/Synopsis I/O libraries, as well as popular IP blocks from RAMBUS, Chip Idea and other quality IP vendors. A 5.5 volt reverse bias anode to cathode operational specification enables the Impulse TSMC .13u ESD diode to be the device of choice for 5 volt tolerant designs.
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Product
Intelligent Power Switches
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ST offers a series of intelligent power switches (IPS) for high-side and low-side configurations. These devices integrate the control section (logic interface, drivers, diagnostic and protection features) and the power stage on the same chip, with benefits in terms of compactness, increased system reliability and cost effectiveness.
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Product
Inductor Test & Packaging Machine
1870D
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The Chroma 1870D Series (1870D/1870D-12) are specifically Designed automated test equipment for chip inductors. It comprises Various test functions that are required for verifying chip inductors. In addition, an automated tape packaging machine at the end of production line is equipped to fulfill demand for automated manufacturing.
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Product
RF/Microwave Assembly Capability
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Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Product
288-Pin Dual In-Line Memory Module
SQR-UD4(ECC)
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SQRAM is Industrial Grade DRAM memory. all of SQRAM are designed with original IC chip and adopt a rigorous test program.
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Product
Microelectro Mechanical Systems And MEMS Sensors
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NevadaNano has spent a decade integrating multiple, complementary chemical sensors on a single silicon chip. We call it the Molecular Property Spectrometer™ (MPS™). The MPS Gas Sensor works together to measure a variety of thermodynamic and electrostatic molecular properties of sampled vapors, liquids, and particles. In less than a second, the chip creates a large, rich dataset of chemical information. Then, Custom MPS software identifies the types of molecules present in an unknown sample.
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Product
Digital Step Attenuators
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Analog Devices provides a range of broadband IC digital attenuators that come in low cost, leadless surface mount packages. Our digital attenuator family offers excellent attenuation and includes off chip ac ground capacitors for near dc operation, making it ideal for an extensive number of RF and IF applications.
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Image Sensor/Fingerprint-on-Display Testing
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Enli Tech provides the most advanced optical and non-destructive inspection technology, which can de-convolute the digital images back to the analog properties, such as quantum efficiency, spectral response, system gain K, Dynamic Range (DR), PRNU, DRNU, Linearity Error LE, and Chief-Ray-Angle (CRA). The testing solution can be applied to CCD and CMOS image sensors in aerospace, defense, and scientific camera field. Image sensor packages that can be tested by Enli Tech’s systems include bare wafers, dies, chips, or camera modules. Our image sensor testers can help users reduce the sensor-modules or camera-modules development time and RD budget.
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Product
Digital Color Camera for Microscopy
LC30
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The LC30 is a 3.1 megapixel digital color camera for microscopy that combines versatility with performance. The LC30 is the ideal entry-level microscope camera for quality bright-field imaging － suitable for material science applications. The Olympus LC30 color camera for microscopy combines versatility with performance. With up to 37 frames per second (fps), faithful color reproduction, full integration into Olympus imaging platforms, and an excellent cost-performance ratio, the LC30 is the ideal entry-level microscope camera for quality bright-field imaging － suitable for material science applications.. The sensitivity and frame rate of the 3.1-megapixel CMOS chip can be increased using various binning modes, resulting in easy observation and focusing. The LC30 camera can be quickly and easily mounted on all microscopes equipped with a standard C-mount adaptor, and requires only a single USB 2.0 cable for high-speed data transfer and power supply. Its complete integration into the OLYMPUS Stream imaging platforms helps ensure the seamless interaction of microscope, camera, and additional devices, delivering intuitive and efficient operation.
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Product
Thermal Cycling Test Equipment
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Wewon Environmental Chambers Co, Ltd.
IC welding to PCB, IC is integrated in the chip general purpose circuit, it is a whole. Once the inside is damaged, the chip will be damaged. The goal of printed circuit boards (pcbs) is to connect IC and discrete components to form a larger working circuit. Thermal cycling equipment can detect the defects and hidden dangers of welding components in the production process, decreasing failure rate. When it fails, components can be replaced in timehttps://www.wewontech.com/thermal-cycling-test-equipment/
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Product
K-Band Silicon SATCOM Rx Quad Core IC
AWS-0102
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The AWS-0102 is a highly integrated silicon quad core IC intended for satellite communications applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain with a noise figure of 3.4 dB. Additional features include gain compensation over temperature and temperature reporting. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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Product
4G SO-DDR3-1600 512X8 1.35V SAM -20~85℃
AQD-SD3L4GN16-SGH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
Humidity Sensors
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digital humidity sensor with integrated temperature sensor that provides excellent measurement accuracy at very low power. The device measures humidity based on a novel capacitive sensor. The humidity and temperature sensors are factory calibrated. The innovative WLCSP (Wafer Level Chip Scale Package) simplifies board design with the use of an ultra-compact package. The sensing element of the HDC1008 is placed on the bottom part of the device, which makes the HDC1008 more robust against dirt, dust, and other environmental contaminants. The HDC1008 is functional within the full 40C to +125C temperature range.
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Product
Electrical Receiver Conformance Test Application for IEEE 802.3bs/ cd
M8091BSCA
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IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
